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[@semivision_tw](/creator/twitter/semivision_tw)
"🟥SemiVision : As #AI and electrification accelerate demand for higher power efficiency and reliability continues to soar. Today (2025/7/18) #Microchip Technology Inc. announced a strategic partnership with #Delta Electronics to integrate Microchips mSiC products and technologies into Deltas designs. Both companies aim to leverage this collaboration to accelerate the development of innovative #SiC solutions and energy-saving products and systems driving progress toward a more sustainable future"  
![@semivision_tw Avatar](https://lunarcrush.com/gi/w:16/cr:twitter::1881240196756504576.png) [@semivision_tw](/creator/x/semivision_tw) on [X](/post/tweet/1946381993178271766) 2025-07-19 01:30:03 UTC 1022 followers, XXX engagements


"The Current #HBM Landscape SK Hynix currently dominates the high-end HBM market supplying leading players with state-of-the-art memory solutions. However with demand surging other companies aiming to enter the HBM market are developing proprietary technologies to create HBM-like products"  
![@semivision_tw Avatar](https://lunarcrush.com/gi/w:16/cr:twitter::1881240196756504576.png) [@semivision_tw](/creator/x/semivision_tw) on [X](/post/tweet/1947139538024849424) 2025-07-21 03:40:16 UTC 1025 followers, XXX engagements


"MR-MUF & Its New Materials: The Missing Pieces to the Heat Control Puzzle As SK hynix was developing HBM2E the third generation of HBM controlling heat became a major focal point for improvement. Even when TC-NCF was being recognized as a packaging solution suitable for densely stacked products SK hynix challenged the status quo and strove to develop a new packaging technology offering improved heat dissipation. After countless tests and trials the company unveiled its new packaging technology MR-MUF in 2019 which would change the future of the #HBM market"  
![@semivision_tw Avatar](https://lunarcrush.com/gi/w:16/cr:twitter::1881240196756504576.png) [@semivision_tw](/creator/x/semivision_tw) on [X](/post/tweet/1947152179162165449) 2025-07-21 04:30:30 UTC 1026 followers, XXX engagements


"In the long run once applications mature TSMC Samsung and Intel will rely on EUV to fend off competitors. But for the entry and mid-tier nodes high-end DUVi remains key. China will keep buying DUV while local equipment makers gradually catch up assuming EUV sanctions stay"  
![@semivision_tw Avatar](https://lunarcrush.com/gi/w:16/cr:twitter::1881240196756504576.png) [@semivision_tw](/creator/x/semivision_tw) on [X](/post/tweet/1946742713254367513) 2025-07-20 01:23:26 UTC 1013 followers, XX engagements


"Industry Collaboration and Market Penetration In 2024 #Besi received orders for hybrid bonding systems with XXX nm alignment capabilities indicating readiness for next-generation nodes. Strategic partnership with Applied Materials (#AMAT) since 2020 deepening in 2025 as AMAT became Besis largest shareholder (9%) enabling tight integration from deposition to final assembly"  
![@semivision_tw Avatar](https://lunarcrush.com/gi/w:16/cr:twitter::1881240196756504576.png) [@semivision_tw](/creator/x/semivision_tw) on [X](/post/tweet/1944227867031658511) 2025-07-13 02:50:20 UTC 1026 followers, XXX engagements


"Demand for edge #AI chips is gaining momentum. All three major smartphone SoC vendorsApple #Qualcomm and #MediaTekhave adopted #TSMCs N3P process this year. PC chips are also expected to migrate toward 3nm to meet the rising computational demands of AI workloads. As a result TSMCs advanced process capacity is expected to remain tight throughout the year"  
![@semivision_tw Avatar](https://lunarcrush.com/gi/w:16/cr:twitter::1881240196756504576.png) [@semivision_tw](/creator/x/semivision_tw) on [X](/post/tweet/1947828252091064643) 2025-07-23 01:16:58 UTC 1026 followers, XXX engagements


"#Marvell highlights that with its proprietary D2D (die-to-die) I/O it can accommodate XX% more logic chips in custom XPU designs and install XX% more CHBM memory packages alongside the compute chips increasing the available DRAM capacity for processors. The company anticipates a XX% reduction in memory interface power consumption"  
![@semivision_tw Avatar](https://lunarcrush.com/gi/w:16/cr:twitter::1881240196756504576.png) [@semivision_tw](/creator/x/semivision_tw) on [X](/post/tweet/1947028329439113414) 2025-07-20 20:18:22 UTC 1026 followers, 1362 engagements


"🌈CPO (Co-Packaged Optics) is Poised to Power Large-Scale AI Supercomputing As AI workloads push the limits of bandwidth and latency embedded optical I/O technologies including OBO NPO and CPO are rapidly replacing traditional copper interconnects revolutionizing chip-to-chip data transmission. CPO a leading form of embedded optical interconnect integrates optical and electronic components within the same package representing an advanced step toward fully optical data pathways in compute architectures. The optical future of #AI infrastructure is coming faster cooler and more scalable than"  
![@semivision_tw Avatar](https://lunarcrush.com/gi/w:16/cr:twitter::1881240196756504576.png) [@semivision_tw](/creator/x/semivision_tw) on [X](/post/tweet/1945339192323809473) 2025-07-16 04:26:20 UTC 1026 followers, 15.6K engagements


"🌈#SemiVision : Global Silicon Photonics Supply Chain Overview"  
![@semivision_tw Avatar](https://lunarcrush.com/gi/w:16/cr:twitter::1881240196756504576.png) [@semivision_tw](/creator/x/semivision_tw) on [X](/post/tweet/1927588864845091067) 2025-05-28 04:52:52 UTC 1026 followers, 38.7K engagements


"#TSMCs SoW Renaissance: Defending the AI Frontier Where NVIDIA Sells Ecosystem Not Chips"  
![@semivision_tw Avatar](https://lunarcrush.com/gi/w:16/cr:twitter::1881240196756504576.png) [@semivision_tw](/creator/x/semivision_tw) on [X](/post/tweet/1947114575457034715) 2025-07-21 02:01:05 UTC 1024 followers, XXX engagements


"Test Equipment Vendors and Market Opportunities #TEL #ficonTEC #MPI #advantest #formfactor"  
![@semivision_tw Avatar](https://lunarcrush.com/gi/w:16/cr:twitter::1881240196756504576.png) [@semivision_tw](/creator/x/semivision_tw) on [X](/post/tweet/1945806533184590174) 2025-07-17 11:23:23 UTC 1026 followers, XXX engagements


"Eventually once TSMC Samsung and Intel fully ramp 2nm companies like Hua Hong CXMT and SMIC might have opportunities in sub-10nm but for now only the big three are making serious moves"  
![@semivision_tw Avatar](https://lunarcrush.com/gi/w:16/cr:twitter::1881240196756504576.png) [@semivision_tw](/creator/x/semivision_tw) on [X](/post/tweet/1946742771081175233) 2025-07-20 01:23:40 UTC 1026 followers, XX engagements


"Chinese media: Jensen Huang has arrived in Beijing and met with Lei Jun for a photo together. A media press conference is being held in Beijing. (Photo: Tencent Technology) #NVIDIA #MI"  
![@semivision_tw Avatar](https://lunarcrush.com/gi/w:16/cr:twitter::1881240196756504576.png) [@semivision_tw](/creator/x/semivision_tw) on [X](/post/tweet/1944687167630147737) 2025-07-14 09:15:25 UTC 1013 followers, XXX engagements


"#TSMC continues to dominate the leading-edge process segment. From cloud to edge AI workloads the vast majority of chips are produced by TSMC. This includes AI chips and ASICs from NVIDIA AMD and all four major cloud service providers (CSPs)"  
![@semivision_tw Avatar](https://lunarcrush.com/gi/w:16/cr:twitter::1881240196756504576.png) [@semivision_tw](/creator/x/semivision_tw) on [X](/post/tweet/1947827639353544963) 2025-07-23 01:14:32 UTC 1026 followers, XXX engagements


"#Rapidus: The Locomotive of Japans Semiconductor Industry"  
![@semivision_tw Avatar](https://lunarcrush.com/gi/w:16/cr:twitter::1881240196756504576.png) [@semivision_tw](/creator/x/semivision_tw) on [X](/post/tweet/1946574361080803542) 2025-07-19 14:14:27 UTC 1020 followers, XXX engagements


"Currently #ASMLs revenue contribution from #EUV and #DUV isnt that far apart. While EUV systems are primarily ordered by #TSMC #Intel and #Samsung the urgency for High NA EUV isnt quite there yet. Intel and Samsungs 2nm mass production remains delayed and even CC admits theres no immediate need for High NA in the short term. On the other hand DUV demand is booming especially from China. Although the export of 1970i and above systems is restricted with resolution enhancement DUV can still handle 7nm. Chinese fabs are actively deploying 1965i systems and with sufficient overlay accuracy they"  
![@semivision_tw Avatar](https://lunarcrush.com/gi/w:16/cr:twitter::1881240196756504576.png) [@semivision_tw](/creator/x/semivision_tw) on [X](/post/tweet/1946742557742121355) 2025-07-20 01:22:49 UTC 1026 followers, XXX engagements


"To understand #NVIDIAs direction in silicon photonics we must first analyze TSMCs progress in this field. The reason is straightforwardNVIDIA is actively collaborating with TSMC. As a semiconductor giant #TSMCs broad range of process nodes allows it to leverage mature processes for PIC (Photonic Integrated Circuit) manufacturing"  
![@semivision_tw Avatar](https://lunarcrush.com/gi/w:16/cr:twitter::1881240196756504576.png) [@semivision_tw](/creator/x/semivision_tw) on [X](/post/tweet/1947505672272122034) 2025-07-22 03:55:09 UTC 1026 followers, XXX engagements


"With the growing demand for advanced packaging we have seen companies like #Marvell and #Broadcom launching their own advanced packaging platforms. For example:"  
![@semivision_tw Avatar](https://lunarcrush.com/gi/w:16/cr:twitter::1881240196756504576.png) [@semivision_tw](/creator/x/semivision_tw) on [X](/post/tweet/1946749761643577506) 2025-07-20 01:51:26 UTC 1020 followers, XXX engagements


"#Intels Next Frontier: Redefining Chiplet Integration Through Advanced Packaging"  
![@semivision_tw Avatar](https://lunarcrush.com/gi/w:16/cr:twitter::1881240196756504576.png) [@semivision_tw](/creator/x/semivision_tw) on [X](/post/tweet/1946572489934643418) 2025-07-19 14:07:01 UTC 1012 followers, XXX engagements


"Summary: DUV still captures the majority of applications High NA / Hyper NA EUV will take time to ramp ASML still has money visibility in the short term but future surprises await Lets see if ASML can pull off something truly groundbreaking"  
![@semivision_tw Avatar](https://lunarcrush.com/gi/w:16/cr:twitter::1881240196756504576.png) [@semivision_tw](/creator/x/semivision_tw) on [X](/post/tweet/1946742985397583975) 2025-07-20 01:24:31 UTC 1012 followers, XXX engagements


"What distinguishes #VLSI Symposium 2025 is its unique blend of industry-driven content and collaborative learning. With world-class contributions from #IBM #AMD #TSMC SK hynix #NVIDIA #MediaTek #Samsung #Sony Lam Research #KIOXIA and many more the Symposium goes beyond technical exchangeit becomes a living garden of innovation where theory meets application and seeds of research mature into real-world impact"  
![@semivision_tw Avatar](https://lunarcrush.com/gi/w:16/cr:twitter::1881240196756504576.png) [@semivision_tw](/creator/x/semivision_tw) on [X](/post/tweet/1931189156933173331) 2025-06-07 03:19:09 UTC 1026 followers, XXX engagements


"Future Outlook The race to innovate in #HBM and advanced packaging will continue to intensify as #AI and high-performance computing drive demand. Companies entering this space must not only focus on technology development but also ensure a secure and scalable supply chain. In subsequent discussions I can delve deeper into specific technologies market dynamics and the strategies needed to succeed in the rapidly evolving HBM landscape"  
![@semivision_tw Avatar](https://lunarcrush.com/gi/w:16/cr:twitter::1881240196756504576.png) [@semivision_tw](/creator/x/semivision_tw) on [X](/post/tweet/1947490065661276346) 2025-07-22 02:53:08 UTC 1026 followers, XXX engagements


"Broadcoms 3.5DXDSiP utilizes #TSMCs CoWoS-L packaging technology enabling a packaging size approximately XXX times larger than the reticle size with a total area of 4719 mm. It integrates logic ICs up to XX HBM3/HBM4 stacks and additional I/O chips"  
![@semivision_tw Avatar](https://lunarcrush.com/gi/w:16/cr:twitter::1881240196756504576.png) [@semivision_tw](/creator/x/semivision_tw) on [X](/post/tweet/1946764561790427396) 2025-07-20 02:50:15 UTC 1026 followers, XXX engagements


"To maximize performance Broadcom recommends decomposing the compute chip design and employing Hybrid Copper Bonding (HCB) in a face-to-face (F2F) configuration to stack one logic chip on top of another. This approach utilizes bumpless hybrid bonding directly connecting the metal layers of the upper and lower silicon dies. Compared to face-to-back (F2B) configurations that rely on through-silicon vias (TSVs) this method represents a key advantage of Broadcoms 3DXDSiP platform"  
![@semivision_tw Avatar](https://lunarcrush.com/gi/w:16/cr:twitter::1881240196756504576.png) [@semivision_tw](/creator/x/semivision_tw) on [X](/post/tweet/1946780659378270536) 2025-07-20 03:54:13 UTC 1026 followers, 8398 engagements


"🤝 HPE Completes Acquisition of Juniper Networks Hewlett Packard Enterprise has officially acquired Juniper Networks a leading AI-native networking solutions provider. This strategic move positions HPE to capitalize on the fast-growing AI and hybrid cloud markets by delivering a cloud-native AI-driven IT portfolio including a fully modernized networking stack. #HPE #JuniperNetworks #AINetworking #HybridCloud #AI #NetworkSolutions"  
![@semivision_tw Avatar](https://lunarcrush.com/gi/w:16/cr:twitter::1881240196756504576.png) [@semivision_tw](/creator/x/semivision_tw) on [X](/post/tweet/1941007173007691789) 2025-07-04 05:32:26 UTC 1015 followers, XXX engagements


"Financial Outlook and Strategic Significance At its 2025 Investor Day Besi elevated hybrid bonding to a core business pillar raising long-term revenue targets to 1.51.9 billion with 4055% operating margins. Financial Times reported hybrid bonding revenues at 36M in 2023 projected to surge to 476M by 2026 potentially accounting for one-third of Besis total business"  
![@semivision_tw Avatar](https://lunarcrush.com/gi/w:16/cr:twitter::1881240196756504576.png) [@semivision_tw](/creator/x/semivision_tw) on [X](/post/tweet/1944243924404461762) 2025-07-13 03:54:08 UTC 1015 followers, XXX engagements


"As advanced packaging technologies continue to evolve #Fluxless Thermo-Compression Bonding (#TCB) is rapidly emerging as a critical process for supporting AI chips high-bandwidth memory (such as HBM) and silicon photonics modules. Traditional TCB relies on flux and reflow processes to facilitate solder wetting and oxide removal. However in fine-pitch bondingparticularly below 40mthis approach often leads to voids residual contamination and reduced reliability falling short of the precision requirements"  
![@semivision_tw Avatar](https://lunarcrush.com/gi/w:16/cr:twitter::1881240196756504576.png) [@semivision_tw](/creator/x/semivision_tw) on [X](/post/tweet/1945320778792116573) 2025-07-16 03:13:10 UTC 1026 followers, 1292 engagements


"As a global leader in IC design #MediaTek has evolved from its consumer electronics SoC roots to expand into Edge AI #ASICs and automotive markets. In doing so it has increasingly recognized advanced packaging not merely as a manufacturing consideration but as a strategic capability. This evolution touches not only how chips are architected and IPs are integrated but how system-level synergy across performance thermal design and power consumption can be fully optimized"  
![@semivision_tw Avatar](https://lunarcrush.com/gi/w:16/cr:twitter::1881240196756504576.png) [@semivision_tw](/creator/x/semivision_tw) on [X](/post/tweet/1946604517107118179) 2025-07-19 16:14:17 UTC 1026 followers, XXX engagements


"🚀 Big news from the 2025 China RISC-V Summit #NVIDIAs VP of Hardware Engineering Frans Sijstermans just announced that the CUDA software platform will officially support RISC-V processors a major breakthrough for the open-source architectures path into data centers and the AI ecosystem. Historically x86 and Arm have dominated AI and HPC thanks to deep integration with CUDA from Intel and AMD chips powering data centers to NVIDIAs Jetson modules and Grace CPUs tightly coupled with Arm. In contrast RISC-V despite its openness and scalability has struggled to gain traction due to a lack of key"  
![@semivision_tw Avatar](https://lunarcrush.com/gi/w:16/cr:twitter::1881240196756504576.png) [@semivision_tw](/creator/x/semivision_tw) on [X](/post/tweet/1947811281790206333) 2025-07-23 00:09:32 UTC 1026 followers, 1645 engagements


"During #TSMCs recent earnings call a major update was announced especially impactful for Taiwans housing market: TSMC is significantly accelerating its fab construction and production timelines in #Arizona pulling forward by several quarters First fab: 4nm process mass production in 2024. Second fab: 3nm process completion by 2025. Third fab: 2nm process potentially completed by 2027"  
![@semivision_tw Avatar](https://lunarcrush.com/gi/w:16/cr:twitter::1881240196756504576.png) [@semivision_tw](/creator/x/semivision_tw) on [X](/post/tweet/1947127412569075730) 2025-07-21 02:52:05 UTC 1025 followers, XXX engagements


"🟨#Nikon unveils the DSP-100 Lithography System engineered for large square substrates up to XXX x XXX mm. This opens new possibilities for advanced packaging and panel-level integration. More info: #Semiconductor #AdvanedPackaging #FOPLP #CoPoS #Panel"  
![@semivision_tw Avatar](https://lunarcrush.com/gi/w:16/cr:twitter::1881240196756504576.png) [@semivision_tw](/creator/x/semivision_tw) on [X](/post/tweet/1946163887037878593) 2025-07-18 11:03:23 UTC 1012 followers, XXX engagements


"Whats more critical TSMC expects its advanced node revenues to contribute around XX% of total revenue when these fabs ramp up Originally the industry expected this XX% threshold to be reached by 2030. Now this milestone will arrive 2-3 years earlier than projected"  
![@semivision_tw Avatar](https://lunarcrush.com/gi/w:16/cr:twitter::1881240196756504576.png) [@semivision_tw](/creator/x/semivision_tw) on [X](/post/tweet/1947127439873945654) 2025-07-21 02:52:12 UTC 1026 followers, XXX engagements


"Traditional data transmission methods such as copper interconnections are typically high-speed and #optimal for short-distance communication. However as transmission distances increase power consumption significantly rises. This makes copper interconnections primarily suitable for inter-chip on-board and backplane applications"  
![@semivision_tw Avatar](https://lunarcrush.com/gi/w:16/cr:twitter::1881240196756504576.png) [@semivision_tw](/creator/x/semivision_tw) on [X](/post/tweet/1947834803023159586) 2025-07-23 01:43:00 UTC 1026 followers, XXX engagements