[GUEST ACCESS MODE: Data is scrambled or limited to provide examples. Make requests using your API key to unlock full data. Check https://lunarcrush.ai/auth for authentication information.] #  @semivision_tw SemiVision👁️👁️ SemiVision👁️👁️ posts on X about ai, taiwan, china, the first the most. They currently have XXXXX followers and XX posts still getting attention that total XXXXX engagements in the last XX hours. ### Engagements: XXXXX [#](/creator/twitter::1881240196756504576/interactions)  - X Week XXXXXX -XX% - X Month XXXXXXXXX +617% - X Months XXXXXXXXX +1,509% ### Mentions: XX [#](/creator/twitter::1881240196756504576/posts_active)  - X Week XX -X% - X Month XXX -XXXX% - X Months XXX +429% ### Followers: XXXXX [#](/creator/twitter::1881240196756504576/followers)  - X Week XXXXX +4.50% - X Month XXXXX +60% - X Months XXXXX +427% ### CreatorRank: XXXXXXXXX [#](/creator/twitter::1881240196756504576/influencer_rank)  ### Social Influence **Social category influence** [countries](/list/countries) XX% [stocks](/list/stocks) XX% [technology brands](/list/technology-brands) XXXXX% [finance](/list/finance) XXXX% [travel destinations](/list/travel-destinations) XXXX% [currencies](/list/currencies) XXXX% [automotive brands](/list/automotive-brands) XXXX% **Social topic influence** [ai](/topic/ai) 16.25%, [taiwan](/topic/taiwan) #620, [china](/topic/china) 5%, [the first](/topic/the-first) 3.75%, [compact](/topic/compact) 2.5%, [future](/topic/future) 2.5%, [investment](/topic/investment) 2.5%, [acquisition](/topic/acquisition) 2.5%, [strong](/topic/strong) 2.5%, [inference](/topic/inference) XXX% **Top accounts mentioned or mentioned by** [@richieriiicch](/creator/undefined) [@marvelltech](/creator/undefined) [@hihi89710699232](/creator/undefined) [@roy8uk](/creator/undefined) [@danzwku](/creator/undefined) [@djrockysmith](/creator/undefined) **Top assets mentioned** [Taiwan Semiconductor (TSM)](/topic/taiwan-semiconductor) [Applied Materials, Inc. (AMAT)](/topic/$amat) [Oracle Corporation (ORCL)](/topic/$orcl) ### Top Social Posts Top posts by engagements in the last XX hours "In todays focus we turn to Metalens a breakthrough technology that has rapidly drawn intense attention across the semiconductor and photonics sectors. Since TSMC demonstrated the use of Metalens as an optical-coupling element in its COUPE (Compact Universal Photonic Engine) platform many readers have begun asking: What exactly is the role of Metalens How is it fundamentally different from traditional Lens or micro-lens arrays Why is it emerging as a key interface for silicon photonics (SiPh) in chip-to-fiber and chip-to-chip optical links #SemiVision #Semiconductor #SiPh #SiliconPhotonics" [X Link](https://x.com/semivision_tw/status/1996048000095793503) 2025-12-03T02:45Z 3916 followers, XXX engagements "This study presented by the Intel team at ECTC 2025 focuses on a hybrid TIM1 solution based on liquid metal fillers embedded in a silicone matrix. The work specifically addresses the thermal and mechanical challenges associated with large 2.5D fan-out lidded package architectures proposing an optimized material and process design that delivers both high thermal performance and mechanical reliability. Through dual-domain modelingthermal and mechanical simulationthe study identifies Bond Line Thickness (BLT) and coverage as critical design targets. It also validates these insights through" [X Link](https://x.com/semivision_tw/status/1997762545218699758) 2025-12-07T20:18Z 3916 followers, 2172 engagements "Future of AI Accelerators Ayar Labs and Alchip are teaming up to bring optics directly on-package for next-gen XPUs. Key highlights: X full-reticle AI accelerators X HBM stacks X Ayar Labs TeraPHY optical engines Integrated passive devices (IPD) for better signal integrity UCIe protocol converter chiplets for scale-up This collaboration blends high-bandwidth low-latency optical I/O with advanced packaging shaping the future of heterogeneous AI compute. #AI #Semiconductors #Optical #AdvancedPackaging" [X Link](https://x.com/semivision_tw/status/1972887967883800596) 2025-09-30T04:55Z 3916 followers, 8327 engagements "ASE Expands in Taiwan: NT$4.2 Billion Investment to Boost Advanced Packaging Capacity in Zhongli ASE Technology Holding has announced a major expansion in Taiwan exercising its contractual right of first refusal to acquire XXXXX% ownership of a second-phase facility from Hung Ching Development & Construction Co. Ltd. The acquisition covers: 14065 ping of building area ( 46400 m) 2119 ping of land ( 7000 m) This facility will be used to expand advanced packaging and testing capacity at ASEs Zhongli campus supporting the companys growth in high-end OSAT processes as global demand surges for AI" [X Link](https://x.com/semivision_tw/status/1993169630173802989) 2025-11-25T04:07Z 3916 followers, XXX engagements "China is building an aerial front line on the roof of the world. Near Tingriclose to Mount Everest and more than 4300 meters above sea levelconstruction crews are carving runways into terrain defined by perpetual cold and thin air. Officially these new airports are meant to improve transportation links in remote regions. Yet their ultra-long runways reinforced concrete shelters and hardened blast-resistant hangars reveal a parallel purpose: military power projection. Over the past decade China has rapidly expanded aviation infrastructure across the Tibetan Plateau and a Wall Street Journal" [X Link](https://x.com/semivision_tw/status/1997876693852402015) 2025-12-08T03:51Z 3916 followers, XXX engagements "Zhen Ding Tech advancing ABF substrate technology From 2005 to 2026 ABF substrates have undergone dramatic scaling: -Body size expanded from 3131 mm to 120140+ mm (20 growth) -Layer count increased from X to 28+ (4 growth) -Bump count jumped from 1K to over 300K500K (300 growth)" [X Link](https://x.com/semivision_tw/status/1957346141542170970) 2025-08-18T07:37Z 3879 followers, 1044 engagements "AI at scale needs optical I/O. #AyarLabs and Alchip are partnering to bring co-packaged optics into nextgen AI and HPC platforms. By combining #Alchips ASIC and advanced packaging with Ayar Labs CPO solutions were enabling higher bandwidth lower latency and better power efficiency for hyperscalers" [X Link](https://x.com/semivision_tw/status/1964939502616805687) 2025-09-08T06:30Z 3896 followers, 6430 engagements "Semicon Taiwan last day #Lasertec #Heraeus #TDK #Mitsubishi" [X Link](https://x.com/semivision_tw/status/1966378753048850948) 2025-09-12T05:50Z 3895 followers, 1657 engagements "TSMC x Nvidia : Breaking the Thermal Wall: How Advanced Cooling Is Powering the Future of Computing" [X Link](https://x.com/semivision_tw/status/1979063706697748802) 2025-10-17T05:55Z 3878 followers, XXX engagements "Unimicrons Next-Gen High Layer Count PCB Roadmap @ IMPACT 2025 Unimicron showcased its HLC PCB (High Layer Count PCB) roadmap through 2027 pushing multilayer PCB manufacturing into new territory for AI servers HPC and advanced packaging. Presented at: IMPACT 2025 (20th Anniversary) Credit: SemiVision" [X Link](https://x.com/semivision_tw/status/1980450473208680753) 2025-10-21T01:46Z 3902 followers, 1384 engagements "SUMCO noted that while artificial intelligence is driving strong demand for XXX mm (12-inch) advanced-node wafers the global XXX mm market remains sluggish due to the slow recovery of mature-node demand ongoing U.S.China tech decoupling and Chinas increasing self-sufficiency" [X Link](https://x.com/semivision_tw/status/1993461314786893859) 2025-11-25T23:26Z 3902 followers, XXX engagements "Nan Ya Plastics partners with Japans Nittobo to jointly expand specialty glass-fiber production for the fast-growing AI supply chain. As AI demand accelerates the global market for high-performance specialty fiberglass fabrics is tightening. To address this surge Nan Ya Plastics and Nittobo have formed a strategic partnership to co-develop and co-produce advanced specialty glass fabrics enhancing supply resilience and meeting rapid market growth. Nan Ya will leverage its deep experience in electronic materials fiberglass copper foil and resin technologies while Nittobo contributes its" [X Link](https://x.com/semivision_tw/status/1994324347222413381) 2025-11-28T08:35Z 3884 followers, 3071 engagements "Intel to Conduct AI Packaging at Amkors Songdo Plant in Incheon Korea #Intel is advancing its AI semiconductor packaging technologies at Amkor Technologys facility in Songdo Incheon. Until now Intel had always carried out its AI-related packaging processes in its own factoriesmaking this the first time the company has outsourced such work. The decision to place this workflow in Korea is seen as a strategic move to strengthen Intels global semiconductor supply chain. According to industry sources on December X Intel has installed production lines for its advanced packaging technology EMIB at" [X Link](https://x.com/semivision_tw/status/1995480222146421221) 2025-12-01T13:08Z 3901 followers, XXX engagements "The Compact Universal Photonic Engine (COUPE) platform jointly developed by TSMC and NVIDIA is reshaping the landscape of optoelectronic integration. COUPE not only integrates an advanced Co-Packaged Optics (CPO) architecture but also establishes a scalable production-ready photonic integration framework across optical coupling packaging and materials engineering. #SemiVision #Semiconductor #SiPh #SiliconPhotonics #CPO #Photonics #AI #Insight #Technology" [X Link](https://x.com/semivision_tw/status/1996071401753571777) 2025-12-03T04:18Z 3900 followers, 1388 engagements "UMC x Polar Semiconductor: A Strategic Move for U.S. Onshore Chip Production UMC and Polar Semiconductor just announced a new collaboration to explore U.S. onshore manufacturing of power and sensor chipscore components for automotive data centers industrial systems and other mission-critical markets. The partnership combines Polars 8-inch wafer production capacity in Bloomington Minnesota and its strong manufacturing track record with UMCs broad technology portfolio and global customer base. For customers this means stronger multi-sourcing flexibility and a more secure domestic supply of" [X Link](https://x.com/semivision_tw/status/1996741583828611449) 2025-12-05T00:41Z 3901 followers, XXX engagements "Emerging 3D integration technologies such as SoIC Foveros Intel ODI and M3Das plotted in the graphrequire vertical interconnects below XX m pitch. These ultra-fine interfaces drive up the demand for high-performance TIMs capable of maintaining consistent BLT (bond line thickness) and low Rc (contact resistance) even in the face of chip-level warpage and localized thermal hotspots. Looking ahead as packaging evolves toward near-memory computing and logic-to-memory stacks (L1/L2/L3) become thermally co-located the role of TIM1 becomes central to power delivery integrity cooling efficiency and" [X Link](https://x.com/semivision_tw/status/1997520956017828119) 2025-12-07T04:18Z 3881 followers, XXX engagements "Amkor Global Footprint Amkor's New Advanced Packaging Technology" [X Link](https://x.com/semivision_tw/status/1997666342682476898) 2025-12-07T13:55Z 3901 followers, XXX engagements "🔵SemiVision : Physical AI is not just about algorithms humanoid robots require an entire ecosystem of high-performance electromechanical actuators. Walking balancing grasping lifting rotating a joint with human-like precision all of these depend on advanced motors gearboxes and drivers working together. These displays show exactly that: a full-body joint solution for humanoid robotics from neck and shoulder torque motors to elbow knee hip wrist and even finger actuators. Each joint demands different thrust torque rigidity and response speed. In the era of Physical AI motors are the new" [X Link](https://x.com/semivision_tw/status/1998213768963403849) 2025-12-09T02:11Z 3879 followers, XXX engagements "In addition the Taiwan delegation included representatives from the Hon Hai Research Institute where Dr. Hao-Chung Kuo delivered a panel talk sharing insights on Taiwans latest progress in semiconductorphotonics integration and advanced packaging innovations highlighting how Taiwans ecosystem can collaborate with European partners to accelerate technology commercialization and mass production in the photonics domain. Dr. Hao-Chung Kuo outlined Foxconns 3+3 Strategyleveraging resources mastering advanced technologies and strengthening integrationas the engine behind its growth in EVs digital" [X Link](https://x.com/semivision_tw/status/1990644392042852520) 2025-11-18T04:53Z 3913 followers, XXX engagements "The semiconductor ecosystem is increasingly showing a dual-axis pattern: Technological concentration geographically dispersed capacity and services. 🔷 Front-End (WFE): Dominated by a handful of playersASML Applied Materials (AMAT) Lam Research Tokyo Electron (TEL) and KLA. 🔷Back-End (Advanced Packaging): Led by OSAT majors ASE Amkor JCET along with key equipment vendors such as Disco Besi ASMPT K&S and Semes. #SemiVision #Semiconducctor #AI #Insight #Market #SupplyChain" [X Link](https://x.com/semivision_tw/status/1996433788826456115) 2025-12-04T04:18Z 3912 followers, 1112 engagements "⚛French quantum computing chip company #Quobly announced a major milestone in the industrialization of quantum semiconductor technology. The first batch of customized 28Si FD-SOI substrates manufactured on #Soitecs industrial production line has officially entered #STMicroelectronics 300mm fab in Crolles France for process development and technology validation. This achievement marks a significant step forward in the strategic collaboration among the three companies and represents the worlds first integration of a high-purity 28Si silicon channel into FD-SOI technology. It highlights the" [X Link](https://x.com/semivision_tw/status/1999333515025089014) 2025-12-12T04:20Z 3916 followers, XXX engagements "Reports from #Taiwans Mirror Media highlight a new layer of U.S.Taiwan semiconductor tension: President Trump is pressuring TSMC to share profits from its U.S. fabs. The concept echoes #NVIDIAs experience in China where sales of downgraded H20 GPUs became a way to navigate export restrictions while still capturing revenue. For TSMC the stakes are much higher. Profit-sharing demands challenge the foundrys long-standing neutral business model. U.S. fab costs are already multiples higher than Taiwan. Geopolitical bargaining risks turning advanced manufacturing into a policy-driven concession. If" [X Link](https://x.com/semivision_tw/status/1963032243192102986) 2025-09-03T00:12Z 3911 followers, XXX engagements "#Nvidia is investing USD X billion to acquire #Synopsys shares at USD XXXXXX each integrating GPU + CUDA directly into EDA toolscovering everything from chips and automobiles to aerospace and industrial applications. This is more than an investment. It marks a full migration of engineering simulation into a new era powered by AI + GPU acceleration. Design cycles that once took weeks will be compressed into hours fundamentally transforming how engineers work" [X Link](https://x.com/semivision_tw/status/1995653235412271442) 2025-12-02T00:36Z 3905 followers, XXX engagements "To support such massive compute power #NVIDIA is upgrading its interconnect technologies: the next-generation NVLink X point-to-point interface provides up to XXX Tbps total bandwidth per node. At the same time NVIDIA is rolling out photonics-based datacenter switches (e.g. Spectrum-X Quantum-X) offering port speeds up to XXX Gbps capable of linking millions of GPUs. #SemiVision #Semiconductor #SiPh #SiliconPhotonics #CPO #Photonics #AI #Insight #Technology" [X Link](https://x.com/semivision_tw/status/1995662974124437759) 2025-12-02T01:15Z 3908 followers, XXX engagements "Hot topic how do you think #Academiaisjustajob" [X Link](https://x.com/semivision_tw/status/1998551958563799319) 2025-12-10T00:34Z 3910 followers, XXX engagements "The Foxconn Research Institute serves as the core innovation engine driving the Foxconn Technology Groups transformation and upgrade. It focuses on disruptive technologies expected to shape the next X to X years including semiconductor processes AI computing robotics systems and electric vehicle platforms. In the semiconductor domain the institute adopts an application-driven approachworking backward from system-level needs to materials and processes. It emphasizes innovation across advanced packaging thermal management optoelectronic integration and AI chip platforms thereby strengthening" [X Link](https://x.com/semivision_tw/status/1998591752840548481) 2025-12-10T03:13Z 3910 followers, XXX engagements "Driven by the demands of AI and high-performance computing (HPC) data center interconnects are reaching the limits of bandwidth power efficiency and latency. Silicon photonics has emerged as a key solution for next-generation optical interconnects offering high speed low power consumption and seamless integration with advanced packaging. As a global leader in semiconductor manufacturing TSMC is actively developing heterogeneous photonic-electronic integration architectures with a particular focus on enhancing coupler design and process controlcritical enablers for stable and efficient Optical" [X Link](https://x.com/semivision_tw/status/1998608119320953180) 2025-12-10T04:18Z 3910 followers, 1893 engagements "🟦SemiVision : At TPCA show 2025 SCREENs new exposure system combined with Resonacs dry film is now ready for next-generation CoWoP (Chip-on-Wafer-on-PCB) substrate applications. The demo shows that SCREENs LUPIOS lithography tool can achieve high-precision mSAP patterning with L/S XX m and XXX m alignment accuracy meeting the demanding specs of SLP (Substrate-Like PCB) production for CoWoP platforms. This collaboration highlights how optical exposure accuracy and resist performance are becoming critical enablers for advanced PCB substrates bridging the gap between CoWoS and PCB. #SCREEN" [X Link](https://x.com/semivision_tw/status/1981307012937126329) 2025-10-23T10:29Z 3914 followers, 1941 engagements "Comparison with Other Industry Players As AI training continues to scale other major players in the industry have taken different approaches to address the Scale-Up challenge: #NVIDIA: NVIDIA has continued along a path of GPU cluster expansion coupled with advanced packaging. Its latest-generation Blackwell Ultra GPU adopts a dual-die design with XXX billion transistors delivering roughly XX% higher performance than its predecessor the H100. #SemiVision #Semiconductor #SiPh #SiliconPhotonics #CPO #Photonics #AI #Insight #Technology" [X Link](https://x.com/semivision_tw/status/1995346624063652255) 2025-12-01T04:18Z 3914 followers, 2101 engagements "#NVIDIA also plans to introduce the Vera Rubin superchip in 20252026 which will combine the next-generation Rubin GPU and Vera CPU. Built on a 3nm process and paired with HBM4 memory (offering XX Tbps bandwidth a major leap from the H100s HBM3E at X Tbps) the Rubin GPU will deliver XX PFLOPS (4-bit) inference peak performance about XXX the Blackwell architecture. The follow-up Rubin Ultra essentially packaging two Rubin GPUs together is projected to reach XXX PFLOPS FP4 performance with nearly X TB of unified memory. #SemiVision #Semiconductor #SiPh #SiliconPhotonics #CPO #Photonics #AI" [X Link](https://x.com/semivision_tw/status/1995349668906115138) 2025-12-01T04:30Z 3914 followers, 1071 engagements "#Marvell is advancing custom HBM subsystem design where logic cores (XPUs) are modularly integrated with high-speed wideband memory through CPO SerDes and Die-to-Die (D2D) interconnects. This not only supports traditional DRAM-based memory hierarchies but also paves the way for chiplet-based heterogeneous integrationideal for generative AI large language model inference and high-performance computing systems" [X Link](https://x.com/semivision_tw/status/1997466534026047494) 2025-12-07T00:41Z 3914 followers, 5498 engagements "#TSMC Chairman C.C. Wei is reportedly set to travel to mainland China on December X accompanied by two vice presidents to attend TSMCs Open Innovation Platform (OIP) Ecosystem Forum in Nanjing. During the trip he is also expected to visit Alibaba and several other chip design houses to explore potential collaboration opportunities. The 2025 TSMC OIP Ecosystem Forum began on September XX with events held sequentially in Santa Clara (Silicon Valley) Tokyo Hsinchu and Amsterdam. The final session is scheduled for December X at the Shangri-La Hotel in Nanjing. According to TSMCs official event" [X Link](https://x.com/semivision_tw/status/1995676156436337144) 2025-12-02T02:07Z 3914 followers, XXX engagements "GlobalFoundries has announced its acquisition of Advanced Micro Foundry(AMF) the silicon photonics foundry based in Singaporemarking a major milestone in GFs push to scale innovation and strengthen its leadership in silicon photonics. This acquisition: Positions GF as the largest pure-play silicon photonics foundry by revenue Expands its silicon photonics portfolio R&D capabilities and manufacturing capacity in Singapore Opens new market opportunities across next-generation datacenter and communications applications Improves supply-chain resilience enabling customers to source secure and" [X Link](https://x.com/semivision_tw/status/1990954492523917508) 2025-11-19T01:25Z 3916 followers, 1446 engagements "Chinas Electromagnetic Shield to Block Starlink The South China Morning Post recently revealed a Chinese research project suggesting that the PLA could deploy a swarm of drones at an altitude of XX km to form an electromagnetic shield between Starlink satellites and Taiwan effectively blocking communication signals. These drones or alternatively balloons or high-altitude aircraft would align in the sky to create a dense jamming grid that beams noise down to the ground" [X Link](https://x.com/semivision_tw/status/1994322767953703098) 2025-11-28T08:29Z 3916 followers, 1.1M engagements "CPU TPU GPU: A CPU is like a highly intelligent and versatile worker it can do anything but its slow when handling repetitive tasks. A GPU is like thousands of general-purpose workers all working together at the same time. A TPU is like an automated assembly line customized for a single task. Once the machines are arranged theres almost no back-and-forth movement. A TPU only accepts data not instructions. It doesnt need to choose from hundreds of operation codes and it" [X Link](https://x.com/semivision_tw/status/1994376766719418437) 2025-11-28T12:04Z 3916 followers, 110.5K engagements "Most critically in the often-overlooked domain of electro-optical co-testing the trio of TSMC NVIDIA and ficonTEC is establishing foundational infrastructure. Among them ficonTEC plays a pivotal role by delivering the worlds first 300mm double-sided wafer test platform seamlessly integrating automated electro-optical alignment active optical probing and high-throughput test flows. Their system allows for concurrent electrical and photonic characterization at the wafer level an essential capability for validating the performance and yield of high-speed optical engines in real manufacturing" [X Link](https://x.com/semivision_tw/status/1998224341884981614) 2025-12-09T02:53Z 3916 followers, 6443 engagements "In Taiwan semiconductor giants such as TSMC ASE and SPIL are actively participating in the silicon photonics ecosystem from fabrication to packaging and testing forming a comprehensive and competitive supply chain. TSMC in particular is expected to apply its SoIC (System on Integrated Chips) and advanced packaging technologies to integrated photonic-electronic solutions. #SemiVision #Semiconducctor #AI #Insight #Market #SupplyChain" [X Link](https://x.com/semivision_tw/status/1998788049862308272) 2025-12-10T16:13Z 3914 followers, 1488 engagements "Through platforms such as COUPE EPIC-BOE and iOIS TSMC is steadily building a comprehensive ecosystem to support Co-Packaged Optics (CPO) and high-bandwidth optical modules. Along this trajectory NVIDIA is also on the verge of realizing its Photonic Interconnect vision and TSMCs robust silicon photonics modules and coupling structures are poised to play a foundational role in enabling this optical-electronic convergence. #SemiVision #Semiconductor #SiPh #SiliconPhotonics #CPO #Photonics #AI #Insight #Technology" [X Link](https://x.com/semivision_tw/status/1998946095200669887) 2025-12-11T02:41Z 3914 followers, 1326 engagements "Next year Taiwans economic indicators will look exceptionally strong. Its GDP growth rate will tie with Hong Kong for the top spot among the Four Asian Tigers and per-capita GDP will surpass USD 40000 for the first timeovertaking Japan and South Korea. Taiwans stock market capitalization has already entered the global top ten exceeding even Germany. These are the winners standing on one side of the widening fault line. But on the other side lie the losers. While Taiwans electronics and technology exports continue breaking records traditional industries are almost in a state of paralysis." [X Link](https://x.com/semivision_tw/status/1999035887532081475) 2025-12-11T08:37Z 3915 followers, XXX engagements "✴In earthquake-prone regions like Japan and Taiwan semiconductor fabs cannot rely on ordinary construction methods. Modern foundries require purpose-built seismic-isolation engineering to protect multi-story cleanrooms ultra-sensitive lithography tools and high-value production lines. One of the pioneers of this approach is Kajima Corporation a Japanese engineering firm that developed advanced base-isolation systems specifically for semiconductor cleanrooms. Their design combines laminated rubber bearings sliding supports and oil dampers to dramatically reduce seismic motion transmitted to" [X Link](https://x.com/semivision_tw/status/1999082893138948344) 2025-12-11T11:44Z 3916 followers, 1029 engagements "Photondelta: Were thrilled to welcome David Lazovsky Founder & CEO of Celestial AI a startup that just got acquired by Marvell Technology for $XXX billion to the PIC Summit USA 2026 speaker lineup A recognised leader in the semiconductor and photonics industries David brings deep expertise spanning advanced manufacturing integrated photonics and AI-driven architectures. His career includes founding and taking Intermolecular public serving in senior executive roles at Applied Materials managing over $1B in business and guiding multiple deep tech companies as Executive Chairman and Venture" [X Link](https://x.com/semivision_tw/status/1999277068346097867) 2025-12-12T00:36Z 3916 followers, XXX engagements "Not sure if this is true. Its finally allowed ChatGPT reportedly confirms that an adult modeincluding the removal of restrictions on explicit conversationswill go live at a specific time. #OpenAI reportedly stated that adult mode will be launched in Q1 2026. Technology ultimately comes from human nature" [X Link](https://x.com/semivision_tw/status/1999356142804418731) 2025-12-12T05:50Z 3916 followers, XXX engagements "Oracles Data Center for OpenAI Delayed to 2028 The data center that Oracle is building for OpenAI has been pushed back to 2028 due to shortages of materials and labor. Adding to the pressure Broadcom has also stated that its AI order backlog has exceeded USD XX billion. As a result U.S. equities are seeing a sharp sell-off across the board" [X Link](https://x.com/semivision_tw/status/1999535470259384333) 2025-12-12T17:43Z 3916 followers, XXX engagements
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@semivision_tw SemiVision👁️👁️
SemiVision👁️👁️ posts on X about ai, taiwan, china, the first the most. They currently have XXXXX followers and XX posts still getting attention that total XXXXX engagements in the last XX hours.
Engagements: XXXXX #
- X Week XXXXXX -XX%
- X Month XXXXXXXXX +617%
- X Months XXXXXXXXX +1,509%
Mentions: XX #
- X Week XX -X%
- X Month XXX -XXXX%
- X Months XXX +429%
Followers: XXXXX #
- X Week XXXXX +4.50%
- X Month XXXXX +60%
- X Months XXXXX +427%
CreatorRank: XXXXXXXXX #
Social Influence
Social category influence countries XX% stocks XX% technology brands XXXXX% finance XXXX% travel destinations XXXX% currencies XXXX% automotive brands XXXX%
Social topic influence ai 16.25%, taiwan #620, china 5%, the first 3.75%, compact 2.5%, future 2.5%, investment 2.5%, acquisition 2.5%, strong 2.5%, inference XXX%
Top accounts mentioned or mentioned by @richieriiicch @marvelltech @hihi89710699232 @roy8uk @danzwku @djrockysmith
Top assets mentioned Taiwan Semiconductor (TSM) Applied Materials, Inc. (AMAT) Oracle Corporation (ORCL)
Top Social Posts
Top posts by engagements in the last XX hours
"In todays focus we turn to Metalens a breakthrough technology that has rapidly drawn intense attention across the semiconductor and photonics sectors. Since TSMC demonstrated the use of Metalens as an optical-coupling element in its COUPE (Compact Universal Photonic Engine) platform many readers have begun asking: What exactly is the role of Metalens How is it fundamentally different from traditional Lens or micro-lens arrays Why is it emerging as a key interface for silicon photonics (SiPh) in chip-to-fiber and chip-to-chip optical links #SemiVision #Semiconductor #SiPh #SiliconPhotonics"
X Link 2025-12-03T02:45Z 3916 followers, XXX engagements
"This study presented by the Intel team at ECTC 2025 focuses on a hybrid TIM1 solution based on liquid metal fillers embedded in a silicone matrix. The work specifically addresses the thermal and mechanical challenges associated with large 2.5D fan-out lidded package architectures proposing an optimized material and process design that delivers both high thermal performance and mechanical reliability. Through dual-domain modelingthermal and mechanical simulationthe study identifies Bond Line Thickness (BLT) and coverage as critical design targets. It also validates these insights through"
X Link 2025-12-07T20:18Z 3916 followers, 2172 engagements
"Future of AI Accelerators Ayar Labs and Alchip are teaming up to bring optics directly on-package for next-gen XPUs. Key highlights: X full-reticle AI accelerators X HBM stacks X Ayar Labs TeraPHY optical engines Integrated passive devices (IPD) for better signal integrity UCIe protocol converter chiplets for scale-up This collaboration blends high-bandwidth low-latency optical I/O with advanced packaging shaping the future of heterogeneous AI compute. #AI #Semiconductors #Optical #AdvancedPackaging"
X Link 2025-09-30T04:55Z 3916 followers, 8327 engagements
"ASE Expands in Taiwan: NT$4.2 Billion Investment to Boost Advanced Packaging Capacity in Zhongli ASE Technology Holding has announced a major expansion in Taiwan exercising its contractual right of first refusal to acquire XXXXX% ownership of a second-phase facility from Hung Ching Development & Construction Co. Ltd. The acquisition covers: 14065 ping of building area ( 46400 m) 2119 ping of land ( 7000 m) This facility will be used to expand advanced packaging and testing capacity at ASEs Zhongli campus supporting the companys growth in high-end OSAT processes as global demand surges for AI"
X Link 2025-11-25T04:07Z 3916 followers, XXX engagements
"China is building an aerial front line on the roof of the world. Near Tingriclose to Mount Everest and more than 4300 meters above sea levelconstruction crews are carving runways into terrain defined by perpetual cold and thin air. Officially these new airports are meant to improve transportation links in remote regions. Yet their ultra-long runways reinforced concrete shelters and hardened blast-resistant hangars reveal a parallel purpose: military power projection. Over the past decade China has rapidly expanded aviation infrastructure across the Tibetan Plateau and a Wall Street Journal"
X Link 2025-12-08T03:51Z 3916 followers, XXX engagements
"Zhen Ding Tech advancing ABF substrate technology From 2005 to 2026 ABF substrates have undergone dramatic scaling: -Body size expanded from 3131 mm to 120140+ mm (20 growth) -Layer count increased from X to 28+ (4 growth) -Bump count jumped from 1K to over 300K500K (300 growth)"
X Link 2025-08-18T07:37Z 3879 followers, 1044 engagements
"AI at scale needs optical I/O. #AyarLabs and Alchip are partnering to bring co-packaged optics into nextgen AI and HPC platforms. By combining #Alchips ASIC and advanced packaging with Ayar Labs CPO solutions were enabling higher bandwidth lower latency and better power efficiency for hyperscalers"
X Link 2025-09-08T06:30Z 3896 followers, 6430 engagements
"Semicon Taiwan last day #Lasertec #Heraeus #TDK #Mitsubishi"
X Link 2025-09-12T05:50Z 3895 followers, 1657 engagements
"TSMC x Nvidia : Breaking the Thermal Wall: How Advanced Cooling Is Powering the Future of Computing"
X Link 2025-10-17T05:55Z 3878 followers, XXX engagements
"Unimicrons Next-Gen High Layer Count PCB Roadmap @ IMPACT 2025 Unimicron showcased its HLC PCB (High Layer Count PCB) roadmap through 2027 pushing multilayer PCB manufacturing into new territory for AI servers HPC and advanced packaging. Presented at: IMPACT 2025 (20th Anniversary) Credit: SemiVision"
X Link 2025-10-21T01:46Z 3902 followers, 1384 engagements
"SUMCO noted that while artificial intelligence is driving strong demand for XXX mm (12-inch) advanced-node wafers the global XXX mm market remains sluggish due to the slow recovery of mature-node demand ongoing U.S.China tech decoupling and Chinas increasing self-sufficiency"
X Link 2025-11-25T23:26Z 3902 followers, XXX engagements
"Nan Ya Plastics partners with Japans Nittobo to jointly expand specialty glass-fiber production for the fast-growing AI supply chain. As AI demand accelerates the global market for high-performance specialty fiberglass fabrics is tightening. To address this surge Nan Ya Plastics and Nittobo have formed a strategic partnership to co-develop and co-produce advanced specialty glass fabrics enhancing supply resilience and meeting rapid market growth. Nan Ya will leverage its deep experience in electronic materials fiberglass copper foil and resin technologies while Nittobo contributes its"
X Link 2025-11-28T08:35Z 3884 followers, 3071 engagements
"Intel to Conduct AI Packaging at Amkors Songdo Plant in Incheon Korea #Intel is advancing its AI semiconductor packaging technologies at Amkor Technologys facility in Songdo Incheon. Until now Intel had always carried out its AI-related packaging processes in its own factoriesmaking this the first time the company has outsourced such work. The decision to place this workflow in Korea is seen as a strategic move to strengthen Intels global semiconductor supply chain. According to industry sources on December X Intel has installed production lines for its advanced packaging technology EMIB at"
X Link 2025-12-01T13:08Z 3901 followers, XXX engagements
"The Compact Universal Photonic Engine (COUPE) platform jointly developed by TSMC and NVIDIA is reshaping the landscape of optoelectronic integration. COUPE not only integrates an advanced Co-Packaged Optics (CPO) architecture but also establishes a scalable production-ready photonic integration framework across optical coupling packaging and materials engineering. #SemiVision #Semiconductor #SiPh #SiliconPhotonics #CPO #Photonics #AI #Insight #Technology"
X Link 2025-12-03T04:18Z 3900 followers, 1388 engagements
"UMC x Polar Semiconductor: A Strategic Move for U.S. Onshore Chip Production UMC and Polar Semiconductor just announced a new collaboration to explore U.S. onshore manufacturing of power and sensor chipscore components for automotive data centers industrial systems and other mission-critical markets. The partnership combines Polars 8-inch wafer production capacity in Bloomington Minnesota and its strong manufacturing track record with UMCs broad technology portfolio and global customer base. For customers this means stronger multi-sourcing flexibility and a more secure domestic supply of"
X Link 2025-12-05T00:41Z 3901 followers, XXX engagements
"Emerging 3D integration technologies such as SoIC Foveros Intel ODI and M3Das plotted in the graphrequire vertical interconnects below XX m pitch. These ultra-fine interfaces drive up the demand for high-performance TIMs capable of maintaining consistent BLT (bond line thickness) and low Rc (contact resistance) even in the face of chip-level warpage and localized thermal hotspots. Looking ahead as packaging evolves toward near-memory computing and logic-to-memory stacks (L1/L2/L3) become thermally co-located the role of TIM1 becomes central to power delivery integrity cooling efficiency and"
X Link 2025-12-07T04:18Z 3881 followers, XXX engagements
"Amkor Global Footprint Amkor's New Advanced Packaging Technology"
X Link 2025-12-07T13:55Z 3901 followers, XXX engagements
"🔵SemiVision : Physical AI is not just about algorithms humanoid robots require an entire ecosystem of high-performance electromechanical actuators. Walking balancing grasping lifting rotating a joint with human-like precision all of these depend on advanced motors gearboxes and drivers working together. These displays show exactly that: a full-body joint solution for humanoid robotics from neck and shoulder torque motors to elbow knee hip wrist and even finger actuators. Each joint demands different thrust torque rigidity and response speed. In the era of Physical AI motors are the new"
X Link 2025-12-09T02:11Z 3879 followers, XXX engagements
"In addition the Taiwan delegation included representatives from the Hon Hai Research Institute where Dr. Hao-Chung Kuo delivered a panel talk sharing insights on Taiwans latest progress in semiconductorphotonics integration and advanced packaging innovations highlighting how Taiwans ecosystem can collaborate with European partners to accelerate technology commercialization and mass production in the photonics domain. Dr. Hao-Chung Kuo outlined Foxconns 3+3 Strategyleveraging resources mastering advanced technologies and strengthening integrationas the engine behind its growth in EVs digital"
X Link 2025-11-18T04:53Z 3913 followers, XXX engagements
"The semiconductor ecosystem is increasingly showing a dual-axis pattern: Technological concentration geographically dispersed capacity and services. 🔷 Front-End (WFE): Dominated by a handful of playersASML Applied Materials (AMAT) Lam Research Tokyo Electron (TEL) and KLA. 🔷Back-End (Advanced Packaging): Led by OSAT majors ASE Amkor JCET along with key equipment vendors such as Disco Besi ASMPT K&S and Semes. #SemiVision #Semiconducctor #AI #Insight #Market #SupplyChain"
X Link 2025-12-04T04:18Z 3912 followers, 1112 engagements
"⚛French quantum computing chip company #Quobly announced a major milestone in the industrialization of quantum semiconductor technology. The first batch of customized 28Si FD-SOI substrates manufactured on #Soitecs industrial production line has officially entered #STMicroelectronics 300mm fab in Crolles France for process development and technology validation. This achievement marks a significant step forward in the strategic collaboration among the three companies and represents the worlds first integration of a high-purity 28Si silicon channel into FD-SOI technology. It highlights the"
X Link 2025-12-12T04:20Z 3916 followers, XXX engagements
"Reports from #Taiwans Mirror Media highlight a new layer of U.S.Taiwan semiconductor tension: President Trump is pressuring TSMC to share profits from its U.S. fabs. The concept echoes #NVIDIAs experience in China where sales of downgraded H20 GPUs became a way to navigate export restrictions while still capturing revenue. For TSMC the stakes are much higher. Profit-sharing demands challenge the foundrys long-standing neutral business model. U.S. fab costs are already multiples higher than Taiwan. Geopolitical bargaining risks turning advanced manufacturing into a policy-driven concession. If"
X Link 2025-09-03T00:12Z 3911 followers, XXX engagements
"#Nvidia is investing USD X billion to acquire #Synopsys shares at USD XXXXXX each integrating GPU + CUDA directly into EDA toolscovering everything from chips and automobiles to aerospace and industrial applications. This is more than an investment. It marks a full migration of engineering simulation into a new era powered by AI + GPU acceleration. Design cycles that once took weeks will be compressed into hours fundamentally transforming how engineers work"
X Link 2025-12-02T00:36Z 3905 followers, XXX engagements
"To support such massive compute power #NVIDIA is upgrading its interconnect technologies: the next-generation NVLink X point-to-point interface provides up to XXX Tbps total bandwidth per node. At the same time NVIDIA is rolling out photonics-based datacenter switches (e.g. Spectrum-X Quantum-X) offering port speeds up to XXX Gbps capable of linking millions of GPUs. #SemiVision #Semiconductor #SiPh #SiliconPhotonics #CPO #Photonics #AI #Insight #Technology"
X Link 2025-12-02T01:15Z 3908 followers, XXX engagements
"Hot topic how do you think #Academiaisjustajob"
X Link 2025-12-10T00:34Z 3910 followers, XXX engagements
"The Foxconn Research Institute serves as the core innovation engine driving the Foxconn Technology Groups transformation and upgrade. It focuses on disruptive technologies expected to shape the next X to X years including semiconductor processes AI computing robotics systems and electric vehicle platforms. In the semiconductor domain the institute adopts an application-driven approachworking backward from system-level needs to materials and processes. It emphasizes innovation across advanced packaging thermal management optoelectronic integration and AI chip platforms thereby strengthening"
X Link 2025-12-10T03:13Z 3910 followers, XXX engagements
"Driven by the demands of AI and high-performance computing (HPC) data center interconnects are reaching the limits of bandwidth power efficiency and latency. Silicon photonics has emerged as a key solution for next-generation optical interconnects offering high speed low power consumption and seamless integration with advanced packaging. As a global leader in semiconductor manufacturing TSMC is actively developing heterogeneous photonic-electronic integration architectures with a particular focus on enhancing coupler design and process controlcritical enablers for stable and efficient Optical"
X Link 2025-12-10T04:18Z 3910 followers, 1893 engagements
"🟦SemiVision : At TPCA show 2025 SCREENs new exposure system combined with Resonacs dry film is now ready for next-generation CoWoP (Chip-on-Wafer-on-PCB) substrate applications. The demo shows that SCREENs LUPIOS lithography tool can achieve high-precision mSAP patterning with L/S XX m and XXX m alignment accuracy meeting the demanding specs of SLP (Substrate-Like PCB) production for CoWoP platforms. This collaboration highlights how optical exposure accuracy and resist performance are becoming critical enablers for advanced PCB substrates bridging the gap between CoWoS and PCB. #SCREEN"
X Link 2025-10-23T10:29Z 3914 followers, 1941 engagements
"Comparison with Other Industry Players As AI training continues to scale other major players in the industry have taken different approaches to address the Scale-Up challenge: #NVIDIA: NVIDIA has continued along a path of GPU cluster expansion coupled with advanced packaging. Its latest-generation Blackwell Ultra GPU adopts a dual-die design with XXX billion transistors delivering roughly XX% higher performance than its predecessor the H100. #SemiVision #Semiconductor #SiPh #SiliconPhotonics #CPO #Photonics #AI #Insight #Technology"
X Link 2025-12-01T04:18Z 3914 followers, 2101 engagements
"#NVIDIA also plans to introduce the Vera Rubin superchip in 20252026 which will combine the next-generation Rubin GPU and Vera CPU. Built on a 3nm process and paired with HBM4 memory (offering XX Tbps bandwidth a major leap from the H100s HBM3E at X Tbps) the Rubin GPU will deliver XX PFLOPS (4-bit) inference peak performance about XXX the Blackwell architecture. The follow-up Rubin Ultra essentially packaging two Rubin GPUs together is projected to reach XXX PFLOPS FP4 performance with nearly X TB of unified memory. #SemiVision #Semiconductor #SiPh #SiliconPhotonics #CPO #Photonics #AI"
X Link 2025-12-01T04:30Z 3914 followers, 1071 engagements
"#Marvell is advancing custom HBM subsystem design where logic cores (XPUs) are modularly integrated with high-speed wideband memory through CPO SerDes and Die-to-Die (D2D) interconnects. This not only supports traditional DRAM-based memory hierarchies but also paves the way for chiplet-based heterogeneous integrationideal for generative AI large language model inference and high-performance computing systems"
X Link 2025-12-07T00:41Z 3914 followers, 5498 engagements
"#TSMC Chairman C.C. Wei is reportedly set to travel to mainland China on December X accompanied by two vice presidents to attend TSMCs Open Innovation Platform (OIP) Ecosystem Forum in Nanjing. During the trip he is also expected to visit Alibaba and several other chip design houses to explore potential collaboration opportunities. The 2025 TSMC OIP Ecosystem Forum began on September XX with events held sequentially in Santa Clara (Silicon Valley) Tokyo Hsinchu and Amsterdam. The final session is scheduled for December X at the Shangri-La Hotel in Nanjing. According to TSMCs official event"
X Link 2025-12-02T02:07Z 3914 followers, XXX engagements
"GlobalFoundries has announced its acquisition of Advanced Micro Foundry(AMF) the silicon photonics foundry based in Singaporemarking a major milestone in GFs push to scale innovation and strengthen its leadership in silicon photonics. This acquisition: Positions GF as the largest pure-play silicon photonics foundry by revenue Expands its silicon photonics portfolio R&D capabilities and manufacturing capacity in Singapore Opens new market opportunities across next-generation datacenter and communications applications Improves supply-chain resilience enabling customers to source secure and"
X Link 2025-11-19T01:25Z 3916 followers, 1446 engagements
"Chinas Electromagnetic Shield to Block Starlink The South China Morning Post recently revealed a Chinese research project suggesting that the PLA could deploy a swarm of drones at an altitude of XX km to form an electromagnetic shield between Starlink satellites and Taiwan effectively blocking communication signals. These drones or alternatively balloons or high-altitude aircraft would align in the sky to create a dense jamming grid that beams noise down to the ground"
X Link 2025-11-28T08:29Z 3916 followers, 1.1M engagements
"CPU TPU GPU: A CPU is like a highly intelligent and versatile worker it can do anything but its slow when handling repetitive tasks. A GPU is like thousands of general-purpose workers all working together at the same time. A TPU is like an automated assembly line customized for a single task. Once the machines are arranged theres almost no back-and-forth movement. A TPU only accepts data not instructions. It doesnt need to choose from hundreds of operation codes and it"
X Link 2025-11-28T12:04Z 3916 followers, 110.5K engagements
"Most critically in the often-overlooked domain of electro-optical co-testing the trio of TSMC NVIDIA and ficonTEC is establishing foundational infrastructure. Among them ficonTEC plays a pivotal role by delivering the worlds first 300mm double-sided wafer test platform seamlessly integrating automated electro-optical alignment active optical probing and high-throughput test flows. Their system allows for concurrent electrical and photonic characterization at the wafer level an essential capability for validating the performance and yield of high-speed optical engines in real manufacturing"
X Link 2025-12-09T02:53Z 3916 followers, 6443 engagements
"In Taiwan semiconductor giants such as TSMC ASE and SPIL are actively participating in the silicon photonics ecosystem from fabrication to packaging and testing forming a comprehensive and competitive supply chain. TSMC in particular is expected to apply its SoIC (System on Integrated Chips) and advanced packaging technologies to integrated photonic-electronic solutions. #SemiVision #Semiconducctor #AI #Insight #Market #SupplyChain"
X Link 2025-12-10T16:13Z 3914 followers, 1488 engagements
"Through platforms such as COUPE EPIC-BOE and iOIS TSMC is steadily building a comprehensive ecosystem to support Co-Packaged Optics (CPO) and high-bandwidth optical modules. Along this trajectory NVIDIA is also on the verge of realizing its Photonic Interconnect vision and TSMCs robust silicon photonics modules and coupling structures are poised to play a foundational role in enabling this optical-electronic convergence. #SemiVision #Semiconductor #SiPh #SiliconPhotonics #CPO #Photonics #AI #Insight #Technology"
X Link 2025-12-11T02:41Z 3914 followers, 1326 engagements
"Next year Taiwans economic indicators will look exceptionally strong. Its GDP growth rate will tie with Hong Kong for the top spot among the Four Asian Tigers and per-capita GDP will surpass USD 40000 for the first timeovertaking Japan and South Korea. Taiwans stock market capitalization has already entered the global top ten exceeding even Germany. These are the winners standing on one side of the widening fault line. But on the other side lie the losers. While Taiwans electronics and technology exports continue breaking records traditional industries are almost in a state of paralysis."
X Link 2025-12-11T08:37Z 3915 followers, XXX engagements
"✴In earthquake-prone regions like Japan and Taiwan semiconductor fabs cannot rely on ordinary construction methods. Modern foundries require purpose-built seismic-isolation engineering to protect multi-story cleanrooms ultra-sensitive lithography tools and high-value production lines. One of the pioneers of this approach is Kajima Corporation a Japanese engineering firm that developed advanced base-isolation systems specifically for semiconductor cleanrooms. Their design combines laminated rubber bearings sliding supports and oil dampers to dramatically reduce seismic motion transmitted to"
X Link 2025-12-11T11:44Z 3916 followers, 1029 engagements
"Photondelta: Were thrilled to welcome David Lazovsky Founder & CEO of Celestial AI a startup that just got acquired by Marvell Technology for $XXX billion to the PIC Summit USA 2026 speaker lineup A recognised leader in the semiconductor and photonics industries David brings deep expertise spanning advanced manufacturing integrated photonics and AI-driven architectures. His career includes founding and taking Intermolecular public serving in senior executive roles at Applied Materials managing over $1B in business and guiding multiple deep tech companies as Executive Chairman and Venture"
X Link 2025-12-12T00:36Z 3916 followers, XXX engagements
"Not sure if this is true. Its finally allowed ChatGPT reportedly confirms that an adult modeincluding the removal of restrictions on explicit conversationswill go live at a specific time. #OpenAI reportedly stated that adult mode will be launched in Q1 2026. Technology ultimately comes from human nature"
X Link 2025-12-12T05:50Z 3916 followers, XXX engagements
"Oracles Data Center for OpenAI Delayed to 2028 The data center that Oracle is building for OpenAI has been pushed back to 2028 due to shortages of materials and labor. Adding to the pressure Broadcom has also stated that its AI order backlog has exceeded USD XX billion. As a result U.S. equities are seeing a sharp sell-off across the board"
X Link 2025-12-12T17:43Z 3916 followers, XXX engagements