[GUEST ACCESS MODE: Data is scrambled or limited to provide examples. Make requests using your API key to unlock full data. Check https://lunarcrush.ai/auth for authentication information.] #  @semivision_tw SemiVision👁️👁️ SemiVision👁️👁️ posts on X about hybrid, open ai, asics, $7936t the most. They currently have XXXXX followers and XXX posts still getting attention that total XXXXX engagements in the last XX hours. ### Engagements: XXXXX [#](/creator/twitter::1881240196756504576/interactions)  - X Week XXXXXX -XX% - X Month XXXXXXX +46% - X Months XXXXXXX +653% ### Mentions: XX [#](/creator/twitter::1881240196756504576/posts_active)  - X Week XX no change - X Month XXX +32% - X Months XXX +1,752% ### Followers: XXXXX [#](/creator/twitter::1881240196756504576/followers)  - X Week XXXXX +2% - X Month XXXXX +20% - X Months XXXXX +536% ### CreatorRank: XXXXXXXXX [#](/creator/twitter::1881240196756504576/influencer_rank)  ### Social Influence [#](/creator/twitter::1881240196756504576/influence) --- **Social category influence** [technology brands](/list/technology-brands) XXXX% [stocks](/list/stocks) XXXX% [countries](/list/countries) XXXX% [fashion brands](/list/fashion-brands) XXXX% [travel destinations](/list/travel-destinations) XXXX% [celebrities](/list/celebrities) XXXX% [finance](/list/finance) XXXX% **Social topic influence** [hybrid](/topic/hybrid) 0.92%, [open ai](/topic/open-ai) 0.92%, [asics](/topic/asics) 0.61%, [$7936t](/topic/$7936t) 0.61%, [integration](/topic/integration) #1061, [chips](/topic/chips) #554, [japan](/topic/japan) 0.61%, [forum](/topic/forum) #218, [gpu](/topic/gpu) 0.31%, [compact](/topic/compact) XXXX% **Top accounts mentioned or mentioned by** [@richieriiicch](/creator/undefined) [@nvidia](/creator/undefined) [@semivisiontw](/creator/undefined) [@wolfyxbt](/creator/undefined) [@sydneysweeney](/creator/undefined) [@kawausosuki0513](/creator/undefined) [@kwoneunbi](/creator/undefined) [@bluejay87476298](/creator/undefined) [@whitehouse](/creator/undefined) [@semitaipei](/creator/undefined) [@nav09284172](/creator/undefined) [@jaredwerba](/creator/undefined) [@drfrederickchen](/creator/undefined) [@schott_ag](/creator/undefined) [@fredvfalcone](/creator/undefined) [@kapioyang](/creator/undefined) [@treasureh8nter](/creator/undefined) [@shihcolin](/creator/undefined) **Top assets mentioned** [NVIDIA Corp. (NVDA)](/topic/$nvda) [Microsoft Corp. (MSFT)](/topic/microsoft) [Arista Networks Inc (ANET)](/topic/$anet) ### Top Social Posts [#](/creator/twitter::1881240196756504576/posts) --- Top posts by engagements in the last XX hours "AI at scale needs optical I/O. #AyarLabs and Alchip are partnering to bring co-packaged optics into nextgen AI and HPC platforms. By combining #Alchips ASIC and advanced packaging with Ayar Labs CPO solutions were enabling higher bandwidth lower latency and better power efficiency for hyperscalers" [X Link](https://x.com/semivision_tw/status/1964939502616805687) [@semivision_tw](/creator/x/semivision_tw) 2025-09-08T06:30Z 2129 followers, 6383 engagements "Broadcoms CPO (Co-Packaged Optics) Manufacturing Assembly Flow clearly illustrates the complexity and precision required to bring optical engines and ASICs together at the package level from known good die to rack-level integration. As the industry moves toward co-packaged architectures to break through bandwidth and power bottlenecks such end-to-end integration flows are becoming foundational for next-generation AI data centers. #CPO #CoPackagedOptics #Broadcom #OpticalInterconnect #AdvancedPackaging #AIInfrastructure #Semiconductor #Photonics #SystemIntegration #SemiVision" [X Link](https://x.com/semivision_tw/status/1978844315989528686) [@semivision_tw](/creator/x/semivision_tw) 2025-10-16T15:23Z 2129 followers, XXX engagements "NVIDIA DGX Spark The Personal AI Supercomputer launches on October XX Powered by the GB10 Superchip co-designed by MediaTek and NVIDIA the system integrates a 20-core Grace CPU Blackwell GPU and XXX GB of memory delivering up to X PFLOP of AI compute . It can run 200B-parameter large models locally and two units linked together can scale up to 405B parameters Compact and energy-efficient the DGX Spark fits neatly on a desk enabling developers to prototype fine-tune and run AI inference entirely on-premises. #MediaTek #NVIDIA #SparkSomethingBig #DGXSpark #GB10 #GraceBlackwell #Superchip" [X Link](https://x.com/semivision_tw/status/1979103639202599095) [@semivision_tw](/creator/x/semivision_tw) 2025-10-17T08:34Z 2129 followers, XXX engagements "At Computex 2025 (Taipei) #Fabric8Labs and #Wiwynn a leading Taiwanese server manufacturer jointly showcased ECAM cold plate applications for AI data centers at Taipei Nangang Exhibition Center. The demo combined Fabric8Labs advanced thermal structures with Wiwynns liquid-cooled rack solutions marking an important deployment signal for ECAM technology within Taiwans AI infrastructure ecosystem" [X Link](https://x.com/semivision_tw/status/1978822572704776477) [@semivision_tw](/creator/x/semivision_tw) 2025-10-16T13:57Z 2126 followers, XXX engagements "Today Applied Materials together with Arizona State University we marked the official opening of the Materials-to-Fab Center a shared world-class $XXX million research development and prototyping facility inside the universitys MacroTechnology Works at ASUs Research Park in Tempe" [X Link](https://x.com/semivision_tw/status/1976526034754498782) [@semivision_tw](/creator/x/semivision_tw) 2025-10-10T05:51Z 2126 followers, XXX engagements "In front-end wafer manufacturing the sector is almost monopolized by five major playersASML Applied Materials Lam Research Tokyo Electron (TEL) and KLAon which foundries such as TSMC Samsung Intel and UMC are highly dependent. While U.S. and Dutch firms remain global leaders in lithography deposition and etching export controls and policies such as the CHIPS Act and the European Chips Act have compelled equipment suppliers to adjust their footprints establishing new production and service bases across North America Europe Japan and Southeast Asia to strengthen supply chain resilience." [X Link](https://x.com/semivision_tw/status/1975000805821341699) [@semivision_tw](/creator/x/semivision_tw) 2025-10-06T00:51Z 2125 followers, 1135 engagements "Custom ASIC design house #Alchip Technologies and optical I/O company #AyarLabs have unveiled a reference design platform for AI ASICs with multiple optical die-die I/O engines. Enabling scale-up network and extended memory this design would allow 200-250 Tb/s bidirectional bandwidth from a single SiP" [X Link](https://x.com/semivision_tw/status/1971056394712551547) [@semivision_tw](/creator/x/semivision_tw) 2025-09-25T03:37Z 2128 followers, XXX engagements "Unlike previous technology nodes where ramp-up was primarily driven by smartphones N2 will benefit from both mobile and HPC customers. MediaTek Qualcomm and major CSPs are also expected to gradually adopt the technology" [X Link](https://x.com/semivision_tw/status/1979060862154322049) [@semivision_tw](/creator/x/semivision_tw) 2025-10-17T05:44Z 2129 followers, XXX engagements "Jensen Huang was visiting TSMCs Arizona Fab XX to celebrate the birth of the first U.S.-made NVIDIA Blackwell chips. As Huang remarked This is a historic moment. To witness this milestone firsthand was truly moving a defining chapter in semiconductor history. Picture from Threads" [X Link](https://x.com/semivision_tw/status/1979393788721401901) [@semivision_tw](/creator/x/semivision_tw) 2025-10-18T03:47Z 2129 followers, XXX engagements "Big moment at WESEMiBAY Shanghai Jiao Tong Universitys CHIPX team officially released the thin-film lithium niobate photonic chip PDK marking a key step forward for Chinas integrated photonics ecosystem" [X Link](https://x.com/semivision_tw/status/1978308307132518793) [@semivision_tw](/creator/x/semivision_tw) 2025-10-15T03:53Z 2126 followers, XXX engagements "Hybrid Bonding at Scale: BESIs Vision and Industry Evolution in 3D Integration" [X Link](https://x.com/semivision_tw/status/1976102984900804694) [@semivision_tw](/creator/x/semivision_tw) 2025-10-09T01:50Z 2126 followers, XXX engagements "We are seeing new innovative materials emerging across CoWoS HBM and silicon photonics. Therefore in the future the semiconductor industry will need to shift its mindset toward the integration of materials as a core consideration" [X Link](https://x.com/semivision_tw/status/1975393904489886049) [@semivision_tw](/creator/x/semivision_tw) 2025-10-07T02:53Z 2129 followers, 2099 engagements "Tray for co-packaged optics developed by #SENKO Advanced Components Inc. and #Marvell Technology being shown this week at ECOC 2025. From Custom SRAM to Optical SerDes: How Marvell Builds the Data Highways for AI Chips" [X Link](https://x.com/semivision_tw/status/1973271415408439362) [@semivision_tw](/creator/x/semivision_tw) 2025-10-01T06:19Z 2121 followers, XXX engagements "NVIDIA CEO Jensen Huang joined Y.L. Wang TSMC vice president of operations and Ray Chuang CEO of TSMC Arizona in Phoenix today to celebrate the first NVIDIA Blackwell wafer produced in the United States. This achievement marks a huge step forward in paving the way for sustained American leadership in AI. Onshoring world-class chipmaking to American soil is crucial to meeting the growing demand for AI. Within the next four years NVIDIA plans to produce up to one-half-trillion dollars of AI infrastructure in the U.S. collaborating with TSMC Foxconn Wistron Amkor and SPIL. Manufacturing the" [X Link](https://x.com/semivision_tw/status/1979379061597389080) [@semivision_tw](/creator/x/semivision_tw) 2025-10-18T02:48Z 2129 followers, XXX engagements "Bose speaker on the back" [X Link](https://x.com/semivision_tw/status/1979110534659346873) [@semivision_tw](/creator/x/semivision_tw) 2025-10-17T09:01Z 2129 followers, XXX engagements "History repeats itself but this time the lead roles have changed. NVIDIA CEO Jensen Huang personally handed over the worlds first DGX Spark a desktop-scale AI supercomputer with petaflop performance to Elon Musk at SpaceXs Starbase. Nine years ago Huang delivered the very first DGX-1 to the newly founded OpenAI where Musk was one of the co-founders. Today Musk is leading xAI in open competition with OpenAI and Huang is once again playing the role of AI arms dealer personally delivering this powerful machine capable of running 200-billion-parameter models locally into Musks hands. From OpenAI" [X Link](https://x.com/semivision_tw/status/1977976731723256085) [@semivision_tw](/creator/x/semivision_tw) 2025-10-14T05:56Z 2121 followers, 1047 engagements "Future of AI Accelerators Ayar Labs and Alchip are teaming up to bring optics directly on-package for next-gen XPUs. Key highlights: X full-reticle AI accelerators X HBM stacks X Ayar Labs TeraPHY optical engines Integrated passive devices (IPD) for better signal integrity UCIe protocol converter chiplets for scale-up This collaboration blends high-bandwidth low-latency optical I/O with advanced packaging shaping the future of heterogeneous AI compute. #AI #Semiconductors #Optical #AdvancedPackaging" [X Link](https://x.com/semivision_tw/status/1972887967883800596) [@semivision_tw](/creator/x/semivision_tw) 2025-09-30T04:55Z 2129 followers, 8174 engagements "FUJITSUMONAKA-X (1.4 nm) The Worlds Most Advanced Processor Made in Japan for AI" [X Link](https://x.com/semivision_tw/status/1976932073840820337) [@semivision_tw](/creator/x/semivision_tw) 2025-10-11T08:45Z 2129 followers, XXX engagements "Flight to Shenzhen Semiconductor Industry Ecosystem Expo (SEMIBAY) 2025" [X Link](https://x.com/semivision_tw/status/1978002925315342800) [@semivision_tw](/creator/x/semivision_tw) 2025-10-14T07:40Z 2127 followers, XXX engagements "Powertech Technology Inc. (PTI) stated that the company has been investing in FOPLP (Fan-Out Panel-Level Packaging) for many years and has co-developed technologies with multiple AI and networking chip customers. This year yield rates have surpassed the mass-production threshold marking the official entry of FOPLP into the commercialization stage. PTI also plans to further expand its investment in 2025 and establish large-scale FOPLP production lines in 2026. The company expects this to begin contributing meaningfully to revenue while forming a comprehensive technology portfolio alongside its" [X Link](https://x.com/semivision_tw/status/1972869653195370964) [@semivision_tw](/creator/x/semivision_tw) 2025-09-30T03:42Z 2126 followers, XXX engagements "Imec has joined forces with AIXTRON GlobalFoundries KLA Corporation Synopsys and Veeco to launch a XXX mm GaN Open Innovation Program. The initiative aims to develop XXX mm GaN epitaxy and process flows for both low- and high-voltage GaN high electron mobility transistors (HEMTs) with the goals of reducing manufacturing costs and enabling the development of more advanced power devices" [X Link](https://x.com/semivision_tw/status/1975733889282023637) [@semivision_tw](/creator/x/semivision_tw) 2025-10-08T01:24Z 2125 followers, XXX engagements "Powering the Next Generation of AI Chips Besi Applied Materials Besi Switzerland AG has announced its collaboration with Applied Materials on the newly introduced Kinex Bonding System the industrys first fully integrated die-to-wafer hybrid bonder. As AI and high-performance computing chips grow increasingly complex the demand for tighter integration higher accuracy and better process efficiency continues to rise" [X Link](https://x.com/semivision_tw/status/1976103070334640182) [@semivision_tw](/creator/x/semivision_tw) 2025-10-09T01:51Z 2126 followers, XX engagements "♥It was a pleasure to participate in the Optical Chip Design & Packaging Technology Forum at WESEMiBAY in Shenzhen (2025/10/15-17). A big thank you to the organizers for the kind invitation. I hope everyone enjoyed SemiVision s sharing session #Semiconductor #Packaging #Photonics #OpticalChips #SemiVision #WESEMiBAY #Shenzhen" [X Link](https://x.com/semivision_tw/status/1978822931859026186) [@semivision_tw](/creator/x/semivision_tw) 2025-10-16T13:58Z 2126 followers, XXX engagements "🟣At SEMICON Taiwan I spotted a showcase from LIST Technology (Zhen Ding Tech. Group) highlighting their high-layer FCBGA substrate for AI servers. XX layers ABF GL107 material XX XXX mm body size 11/11 m L/S Over 160K bump counts As AI accelerators push toward higher bandwidth and power delivery substrates like these become the true enablers. Advanced packaging isnt just about stacking chipsits about building the complex highways underneath that make AI scale possible. The race for high-layer count finer line/space substrates is intensifying and Taiwans ecosystem is clearly at the forefront." [X Link](https://x.com/semivision_tw/status/1966017853238419786) [@semivision_tw](/creator/x/semivision_tw) 2025-09-11T05:55Z 2126 followers, 16.9K engagements "N2 is scheduled to begin mass production in Hsinchu Baoshan and Kaohsiung in 2H25 with Apple and AMD as the first wave of adopters. In addition N2P and N2X are expected to enter mass production in 2H26 and 2027 respectively" [X Link](https://x.com/semivision_tw/status/1979060214226727046) [@semivision_tw](/creator/x/semivision_tw) 2025-10-17T05:41Z 2129 followers, XXX engagements "Resonac's Packaging Solution Center (PSC) is a leading global research and development site dedicated to advanced semiconductor packaging. It is located on the 3rd and 4th floors of the Resonac facility in AIRBIC Kawasaki City Japan with a total floor area of approximately 7757 m" [X Link](https://x.com/semivision_tw/status/1966294076879417558) [@semivision_tw](/creator/x/semivision_tw) 2025-09-12T00:13Z 2125 followers, XXX engagements "On the logic process side TSMCs evolution from N3 N2 A16 involves more than geometric scalingit represents a transistor architecture transition: from FinFET to GAA (Gate-All-Around) and finally to the Super Power Rail architecture in the A16 generation. This series of changes is aimed at achieving the optimal balance of PPA (Power Performance and Area) laying the foundation for high-efficiency AI computing" [X Link](https://x.com/semivision_tw/status/1975761323934843286) [@semivision_tw](/creator/x/semivision_tw) 2025-10-08T03:13Z 2129 followers, XXX engagements "Money-Making Code: On October XX OpenAI CEO Sam Altman announced on social media platform X that the company will soon relax ChatGPTs safety restrictions allowing verified adult users to engage in erotic conversations with the chatbot and making the AIs responses more human-like and approachable" [X Link](https://x.com/semivision_tw/status/1978306270177407462) [@semivision_tw](/creator/x/semivision_tw) 2025-10-15T03:45Z 2125 followers, XXX engagements "Entering the AI and high-performance computing (HPC) era demand for advanced packaging platformsincluding 2.5D/3D packaging Hybrid Bonding and CoWoSis surging reshaping the back-end equipment landscape. This paper analyzes the core elements of both WFE and back-end packaging supply chains while exploring how equipment vendors are responding to the challenges of geopolitics and globalization" [X Link](https://x.com/semivision_tw/status/1974668376795430946) [@semivision_tw](/creator/x/semivision_tw) 2025-10-05T02:50Z 2122 followers, XXX engagements "WESEMiBAY 2025 #Semiconductor" [X Link](https://x.com/semivision_tw/status/1978296451647046002) [@semivision_tw](/creator/x/semivision_tw) 2025-10-15T03:06Z 2126 followers, XXX engagements "#Broadcom is proud to be a part of a new Scale-Up Networking Collaboration to advance Ethernet for AI scale-up systems with industry leaders AMD Arm Arista Networks Cisco HPE Networking Marvell Technology Meta Microsoft NVIDIA OpenAI and Oracle. This open forum will drive technical collaboration interoperability and standards alignment" [X Link](https://x.com/semivision_tw/status/1977973496992174592) [@semivision_tw](/creator/x/semivision_tw) 2025-10-14T05:43Z 2124 followers, XXX engagements
[GUEST ACCESS MODE: Data is scrambled or limited to provide examples. Make requests using your API key to unlock full data. Check https://lunarcrush.ai/auth for authentication information.]
SemiVision👁️👁️ posts on X about hybrid, open ai, asics, $7936t the most. They currently have XXXXX followers and XXX posts still getting attention that total XXXXX engagements in the last XX hours.
Social category influence technology brands XXXX% stocks XXXX% countries XXXX% fashion brands XXXX% travel destinations XXXX% celebrities XXXX% finance XXXX%
Social topic influence hybrid 0.92%, open ai 0.92%, asics 0.61%, $7936t 0.61%, integration #1061, chips #554, japan 0.61%, forum #218, gpu 0.31%, compact XXXX%
Top accounts mentioned or mentioned by @richieriiicch @nvidia @semivisiontw @wolfyxbt @sydneysweeney @kawausosuki0513 @kwoneunbi @bluejay87476298 @whitehouse @semitaipei @nav09284172 @jaredwerba @drfrederickchen @schott_ag @fredvfalcone @kapioyang @treasureh8nter @shihcolin
Top assets mentioned NVIDIA Corp. (NVDA) Microsoft Corp. (MSFT) Arista Networks Inc (ANET)
Top posts by engagements in the last XX hours
"AI at scale needs optical I/O. #AyarLabs and Alchip are partnering to bring co-packaged optics into nextgen AI and HPC platforms. By combining #Alchips ASIC and advanced packaging with Ayar Labs CPO solutions were enabling higher bandwidth lower latency and better power efficiency for hyperscalers"
X Link @semivision_tw 2025-09-08T06:30Z 2129 followers, 6383 engagements
"Broadcoms CPO (Co-Packaged Optics) Manufacturing Assembly Flow clearly illustrates the complexity and precision required to bring optical engines and ASICs together at the package level from known good die to rack-level integration. As the industry moves toward co-packaged architectures to break through bandwidth and power bottlenecks such end-to-end integration flows are becoming foundational for next-generation AI data centers. #CPO #CoPackagedOptics #Broadcom #OpticalInterconnect #AdvancedPackaging #AIInfrastructure #Semiconductor #Photonics #SystemIntegration #SemiVision"
X Link @semivision_tw 2025-10-16T15:23Z 2129 followers, XXX engagements
"NVIDIA DGX Spark The Personal AI Supercomputer launches on October XX Powered by the GB10 Superchip co-designed by MediaTek and NVIDIA the system integrates a 20-core Grace CPU Blackwell GPU and XXX GB of memory delivering up to X PFLOP of AI compute . It can run 200B-parameter large models locally and two units linked together can scale up to 405B parameters Compact and energy-efficient the DGX Spark fits neatly on a desk enabling developers to prototype fine-tune and run AI inference entirely on-premises. #MediaTek #NVIDIA #SparkSomethingBig #DGXSpark #GB10 #GraceBlackwell #Superchip"
X Link @semivision_tw 2025-10-17T08:34Z 2129 followers, XXX engagements
"At Computex 2025 (Taipei) #Fabric8Labs and #Wiwynn a leading Taiwanese server manufacturer jointly showcased ECAM cold plate applications for AI data centers at Taipei Nangang Exhibition Center. The demo combined Fabric8Labs advanced thermal structures with Wiwynns liquid-cooled rack solutions marking an important deployment signal for ECAM technology within Taiwans AI infrastructure ecosystem"
X Link @semivision_tw 2025-10-16T13:57Z 2126 followers, XXX engagements
"Today Applied Materials together with Arizona State University we marked the official opening of the Materials-to-Fab Center a shared world-class $XXX million research development and prototyping facility inside the universitys MacroTechnology Works at ASUs Research Park in Tempe"
X Link @semivision_tw 2025-10-10T05:51Z 2126 followers, XXX engagements
"In front-end wafer manufacturing the sector is almost monopolized by five major playersASML Applied Materials Lam Research Tokyo Electron (TEL) and KLAon which foundries such as TSMC Samsung Intel and UMC are highly dependent. While U.S. and Dutch firms remain global leaders in lithography deposition and etching export controls and policies such as the CHIPS Act and the European Chips Act have compelled equipment suppliers to adjust their footprints establishing new production and service bases across North America Europe Japan and Southeast Asia to strengthen supply chain resilience."
X Link @semivision_tw 2025-10-06T00:51Z 2125 followers, 1135 engagements
"Custom ASIC design house #Alchip Technologies and optical I/O company #AyarLabs have unveiled a reference design platform for AI ASICs with multiple optical die-die I/O engines. Enabling scale-up network and extended memory this design would allow 200-250 Tb/s bidirectional bandwidth from a single SiP"
X Link @semivision_tw 2025-09-25T03:37Z 2128 followers, XXX engagements
"Unlike previous technology nodes where ramp-up was primarily driven by smartphones N2 will benefit from both mobile and HPC customers. MediaTek Qualcomm and major CSPs are also expected to gradually adopt the technology"
X Link @semivision_tw 2025-10-17T05:44Z 2129 followers, XXX engagements
"Jensen Huang was visiting TSMCs Arizona Fab XX to celebrate the birth of the first U.S.-made NVIDIA Blackwell chips. As Huang remarked This is a historic moment. To witness this milestone firsthand was truly moving a defining chapter in semiconductor history. Picture from Threads"
X Link @semivision_tw 2025-10-18T03:47Z 2129 followers, XXX engagements
"Big moment at WESEMiBAY Shanghai Jiao Tong Universitys CHIPX team officially released the thin-film lithium niobate photonic chip PDK marking a key step forward for Chinas integrated photonics ecosystem"
X Link @semivision_tw 2025-10-15T03:53Z 2126 followers, XXX engagements
"Hybrid Bonding at Scale: BESIs Vision and Industry Evolution in 3D Integration"
X Link @semivision_tw 2025-10-09T01:50Z 2126 followers, XXX engagements
"We are seeing new innovative materials emerging across CoWoS HBM and silicon photonics. Therefore in the future the semiconductor industry will need to shift its mindset toward the integration of materials as a core consideration"
X Link @semivision_tw 2025-10-07T02:53Z 2129 followers, 2099 engagements
"Tray for co-packaged optics developed by #SENKO Advanced Components Inc. and #Marvell Technology being shown this week at ECOC 2025. From Custom SRAM to Optical SerDes: How Marvell Builds the Data Highways for AI Chips"
X Link @semivision_tw 2025-10-01T06:19Z 2121 followers, XXX engagements
"NVIDIA CEO Jensen Huang joined Y.L. Wang TSMC vice president of operations and Ray Chuang CEO of TSMC Arizona in Phoenix today to celebrate the first NVIDIA Blackwell wafer produced in the United States. This achievement marks a huge step forward in paving the way for sustained American leadership in AI. Onshoring world-class chipmaking to American soil is crucial to meeting the growing demand for AI. Within the next four years NVIDIA plans to produce up to one-half-trillion dollars of AI infrastructure in the U.S. collaborating with TSMC Foxconn Wistron Amkor and SPIL. Manufacturing the"
X Link @semivision_tw 2025-10-18T02:48Z 2129 followers, XXX engagements
"Bose speaker on the back"
X Link @semivision_tw 2025-10-17T09:01Z 2129 followers, XXX engagements
"History repeats itself but this time the lead roles have changed. NVIDIA CEO Jensen Huang personally handed over the worlds first DGX Spark a desktop-scale AI supercomputer with petaflop performance to Elon Musk at SpaceXs Starbase. Nine years ago Huang delivered the very first DGX-1 to the newly founded OpenAI where Musk was one of the co-founders. Today Musk is leading xAI in open competition with OpenAI and Huang is once again playing the role of AI arms dealer personally delivering this powerful machine capable of running 200-billion-parameter models locally into Musks hands. From OpenAI"
X Link @semivision_tw 2025-10-14T05:56Z 2121 followers, 1047 engagements
"Future of AI Accelerators Ayar Labs and Alchip are teaming up to bring optics directly on-package for next-gen XPUs. Key highlights: X full-reticle AI accelerators X HBM stacks X Ayar Labs TeraPHY optical engines Integrated passive devices (IPD) for better signal integrity UCIe protocol converter chiplets for scale-up This collaboration blends high-bandwidth low-latency optical I/O with advanced packaging shaping the future of heterogeneous AI compute. #AI #Semiconductors #Optical #AdvancedPackaging"
X Link @semivision_tw 2025-09-30T04:55Z 2129 followers, 8174 engagements
"FUJITSUMONAKA-X (1.4 nm) The Worlds Most Advanced Processor Made in Japan for AI"
X Link @semivision_tw 2025-10-11T08:45Z 2129 followers, XXX engagements
"Flight to Shenzhen Semiconductor Industry Ecosystem Expo (SEMIBAY) 2025"
X Link @semivision_tw 2025-10-14T07:40Z 2127 followers, XXX engagements
"Powertech Technology Inc. (PTI) stated that the company has been investing in FOPLP (Fan-Out Panel-Level Packaging) for many years and has co-developed technologies with multiple AI and networking chip customers. This year yield rates have surpassed the mass-production threshold marking the official entry of FOPLP into the commercialization stage. PTI also plans to further expand its investment in 2025 and establish large-scale FOPLP production lines in 2026. The company expects this to begin contributing meaningfully to revenue while forming a comprehensive technology portfolio alongside its"
X Link @semivision_tw 2025-09-30T03:42Z 2126 followers, XXX engagements
"Imec has joined forces with AIXTRON GlobalFoundries KLA Corporation Synopsys and Veeco to launch a XXX mm GaN Open Innovation Program. The initiative aims to develop XXX mm GaN epitaxy and process flows for both low- and high-voltage GaN high electron mobility transistors (HEMTs) with the goals of reducing manufacturing costs and enabling the development of more advanced power devices"
X Link @semivision_tw 2025-10-08T01:24Z 2125 followers, XXX engagements
"Powering the Next Generation of AI Chips Besi Applied Materials Besi Switzerland AG has announced its collaboration with Applied Materials on the newly introduced Kinex Bonding System the industrys first fully integrated die-to-wafer hybrid bonder. As AI and high-performance computing chips grow increasingly complex the demand for tighter integration higher accuracy and better process efficiency continues to rise"
X Link @semivision_tw 2025-10-09T01:51Z 2126 followers, XX engagements
"♥It was a pleasure to participate in the Optical Chip Design & Packaging Technology Forum at WESEMiBAY in Shenzhen (2025/10/15-17). A big thank you to the organizers for the kind invitation. I hope everyone enjoyed SemiVision s sharing session #Semiconductor #Packaging #Photonics #OpticalChips #SemiVision #WESEMiBAY #Shenzhen"
X Link @semivision_tw 2025-10-16T13:58Z 2126 followers, XXX engagements
"🟣At SEMICON Taiwan I spotted a showcase from LIST Technology (Zhen Ding Tech. Group) highlighting their high-layer FCBGA substrate for AI servers. XX layers ABF GL107 material XX XXX mm body size 11/11 m L/S Over 160K bump counts As AI accelerators push toward higher bandwidth and power delivery substrates like these become the true enablers. Advanced packaging isnt just about stacking chipsits about building the complex highways underneath that make AI scale possible. The race for high-layer count finer line/space substrates is intensifying and Taiwans ecosystem is clearly at the forefront."
X Link @semivision_tw 2025-09-11T05:55Z 2126 followers, 16.9K engagements
"N2 is scheduled to begin mass production in Hsinchu Baoshan and Kaohsiung in 2H25 with Apple and AMD as the first wave of adopters. In addition N2P and N2X are expected to enter mass production in 2H26 and 2027 respectively"
X Link @semivision_tw 2025-10-17T05:41Z 2129 followers, XXX engagements
"Resonac's Packaging Solution Center (PSC) is a leading global research and development site dedicated to advanced semiconductor packaging. It is located on the 3rd and 4th floors of the Resonac facility in AIRBIC Kawasaki City Japan with a total floor area of approximately 7757 m"
X Link @semivision_tw 2025-09-12T00:13Z 2125 followers, XXX engagements
"On the logic process side TSMCs evolution from N3 N2 A16 involves more than geometric scalingit represents a transistor architecture transition: from FinFET to GAA (Gate-All-Around) and finally to the Super Power Rail architecture in the A16 generation. This series of changes is aimed at achieving the optimal balance of PPA (Power Performance and Area) laying the foundation for high-efficiency AI computing"
X Link @semivision_tw 2025-10-08T03:13Z 2129 followers, XXX engagements
"Money-Making Code: On October XX OpenAI CEO Sam Altman announced on social media platform X that the company will soon relax ChatGPTs safety restrictions allowing verified adult users to engage in erotic conversations with the chatbot and making the AIs responses more human-like and approachable"
X Link @semivision_tw 2025-10-15T03:45Z 2125 followers, XXX engagements
"Entering the AI and high-performance computing (HPC) era demand for advanced packaging platformsincluding 2.5D/3D packaging Hybrid Bonding and CoWoSis surging reshaping the back-end equipment landscape. This paper analyzes the core elements of both WFE and back-end packaging supply chains while exploring how equipment vendors are responding to the challenges of geopolitics and globalization"
X Link @semivision_tw 2025-10-05T02:50Z 2122 followers, XXX engagements
"WESEMiBAY 2025 #Semiconductor"
X Link @semivision_tw 2025-10-15T03:06Z 2126 followers, XXX engagements
"#Broadcom is proud to be a part of a new Scale-Up Networking Collaboration to advance Ethernet for AI scale-up systems with industry leaders AMD Arm Arista Networks Cisco HPE Networking Marvell Technology Meta Microsoft NVIDIA OpenAI and Oracle. This open forum will drive technical collaboration interoperability and standards alignment"
X Link @semivision_tw 2025-10-14T05:43Z 2124 followers, XXX engagements
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