[GUEST ACCESS MODE: Data is scrambled or limited to provide examples. Make requests using your API key to unlock full data. Check https://lunarcrush.ai/auth for authentication information.] #  @semivision_tw Semi Vision👁️👁️ Semi Vision👁️👁️ posts on X about chips, #ai, momentum, electronics the most. They currently have XXXXX followers and XX posts still getting attention that total XXX engagements in the last XX hours. ### Engagements: XXX [#](/creator/twitter::1881240196756504576/interactions)  - X Week XXXXXX +275% - X Month XXXXXX -XXXX% ### Mentions: XX [#](/creator/twitter::1881240196756504576/posts_active)  - X Week XX +19% - X Month XXX +68% ### Followers: XXXXX [#](/creator/twitter::1881240196756504576/followers)  - X Week XXXXX +11% - X Month XXXXX +32% ### CreatorRank: XXXXXXXXX [#](/creator/twitter::1881240196756504576/influencer_rank)  ### Social Influence [#](/creator/twitter::1881240196756504576/influence) --- **Social category influence** [technology brands](/list/technology-brands) XXXXX% [stocks](/list/stocks) XXXXX% [countries](/list/countries) XXXX% [fashion brands](/list/fashion-brands) XXXX% [currencies](/list/currencies) XXXX% [travel destinations](/list/travel-destinations) XXXX% [finance](/list/finance) XXXX% **Social topic influence** [chips](/topic/chips) 11.86%, [#ai](/topic/#ai) 10.17%, [momentum](/topic/momentum) 3.39%, [electronics](/topic/electronics) 3.39%, [soc](/topic/soc) 3.39%, [samsung](/topic/samsung) 3.39%, [$7936t](/topic/$7936t) 3.39%, [asics](/topic/asics) 3.39%, [taiwan](/topic/taiwan) 1.69%, [playing](/topic/playing) XXXX% **Top accounts mentioned or mentioned by** [@kapioyang](/creator/undefined) [@richieriiicch](/creator/undefined) **Top assets mentioned** [Applied Materials, Inc. (AMAT)](/topic/$amat) ### Top Social Posts [#](/creator/twitter::1881240196756504576/posts) --- Top posts by engagements in the last XX hours "As the global semiconductor landscape rapidly evolves and supply chain innovation becomes ever more critical #Taiwan and the United Kingdom are forging closer ties to co-develop the next generation of technology industry partnerships. Playing a key role in the UK's tech diplomacy and industrial development Innovate #UK is actively driving this momentum through its flagship initiativethe Global Business Innovation Programme (GBIP)injecting new energy into the innovation ecosystems across academia research and industry in both regions"  [@semivision_tw](/creator/x/semivision_tw) on [X](/post/tweet/1948606368195182956) 2025-07-25 04:48:56 UTC 1034 followers, X engagements "🟥SemiVision : As #AI and electrification accelerate demand for higher power efficiency and reliability continues to soar. Today (2025/7/18) #Microchip Technology Inc. announced a strategic partnership with #Delta Electronics to integrate Microchips mSiC products and technologies into Deltas designs. Both companies aim to leverage this collaboration to accelerate the development of innovative #SiC solutions and energy-saving products and systems driving progress toward a more sustainable future"  [@semivision_tw](/creator/x/semivision_tw) on [X](/post/tweet/1946381993178271766) 2025-07-19 01:30:03 UTC 1035 followers, XXX engagements "MR-MUF & Its New Materials: The Missing Pieces to the Heat Control Puzzle As SK hynix was developing HBM2E the third generation of HBM controlling heat became a major focal point for improvement. Even when TC-NCF was being recognized as a packaging solution suitable for densely stacked products SK hynix challenged the status quo and strove to develop a new packaging technology offering improved heat dissipation. After countless tests and trials the company unveiled its new packaging technology MR-MUF in 2019 which would change the future of the #HBM market"  [@semivision_tw](/creator/x/semivision_tw) on [X](/post/tweet/1947152179162165449) 2025-07-21 04:30:30 UTC 1031 followers, XXX engagements "Industry Collaboration and Market Penetration In 2024 #Besi received orders for hybrid bonding systems with XXX nm alignment capabilities indicating readiness for next-generation nodes. Strategic partnership with Applied Materials (#AMAT) since 2020 deepening in 2025 as AMAT became Besis largest shareholder (9%) enabling tight integration from deposition to final assembly"  [@semivision_tw](/creator/x/semivision_tw) on [X](/post/tweet/1944227867031658511) 2025-07-13 02:50:20 UTC 1030 followers, XXX engagements "Demand for edge #AI chips is gaining momentum. All three major smartphone SoC vendorsApple #Qualcomm and #MediaTekhave adopted #TSMCs N3P process this year. PC chips are also expected to migrate toward 3nm to meet the rising computational demands of AI workloads. As a result TSMCs advanced process capacity is expected to remain tight throughout the year"  [@semivision_tw](/creator/x/semivision_tw) on [X](/post/tweet/1947828252091064643) 2025-07-23 01:16:58 UTC 1034 followers, XXX engagements "#Marvell highlights that with its proprietary D2D (die-to-die) I/O it can accommodate XX% more logic chips in custom XPU designs and install XX% more CHBM memory packages alongside the compute chips increasing the available DRAM capacity for processors. The company anticipates a XX% reduction in memory interface power consumption"  [@semivision_tw](/creator/x/semivision_tw) on [X](/post/tweet/1947028329439113414) 2025-07-20 20:18:22 UTC 1034 followers, 1385 engagements "🌈CPO (Co-Packaged Optics) is Poised to Power Large-Scale AI Supercomputing As AI workloads push the limits of bandwidth and latency embedded optical I/O technologies including OBO NPO and CPO are rapidly replacing traditional copper interconnects revolutionizing chip-to-chip data transmission. CPO a leading form of embedded optical interconnect integrates optical and electronic components within the same package representing an advanced step toward fully optical data pathways in compute architectures. The optical future of #AI infrastructure is coming faster cooler and more scalable than"  [@semivision_tw](/creator/x/semivision_tw) on [X](/post/tweet/1945339192323809473) 2025-07-16 04:26:20 UTC 1034 followers, 15.7K engagements "The market is closely watching whether miniaturized AI computing will become a lasting trend. As #AI adoption grows workstations are evolving toward more personalized integrated and user-friendly designs to support a wide range of applications. #NVIDIA is also making aggressive moves into the consumer CPU market based on Arm architecture a development that could become a new growth engine for #MediaTek"  [@semivision_tw](/creator/x/semivision_tw) on [X](/post/tweet/1948561088468988410) 2025-07-25 01:49:00 UTC 1034 followers, XXX engagements "🌈#SemiVision : Global Silicon Photonics Supply Chain Overview"  [@semivision_tw](/creator/x/semivision_tw) on [X](/post/tweet/1927588864845091067) 2025-05-28 04:52:52 UTC 1034 followers, 38.8K engagements "As a result silicon #photonics has become increasingly important due to its high reliabilityachieved through semiconductor manufacturing processesas well as its low power consumption. The realization of silicon photonics however heavily depends on foundry capabilities. Ultimately it requires the integration of photonic integrated circuits (PICs) with electronic integrated circuits (EICs) through advanced packaging techniques forming what is known as an #optical engine"  [@semivision_tw](/creator/x/semivision_tw) on [X](/post/tweet/1947857454416400865) 2025-07-23 03:13:01 UTC 1035 followers, XXX engagements "#TSMCs SoW Renaissance: Defending the AI Frontier Where NVIDIA Sells Ecosystem Not Chips"  [@semivision_tw](/creator/x/semivision_tw) on [X](/post/tweet/1947114575457034715) 2025-07-21 02:01:05 UTC 1028 followers, XXX engagements "Test Equipment Vendors and Market Opportunities #TEL #ficonTEC #MPI #advantest #formfactor"  [@semivision_tw](/creator/x/semivision_tw) on [X](/post/tweet/1945806533184590174) 2025-07-17 11:23:23 UTC 1035 followers, XXX engagements "The AI battlefield is expanding from the cloud to the edge. NVIDIA and #AMD have each launched next-generation AI computing platforms tailored for edge #AI development and high-throughput inference. #NVIDIAs AI supercomputer the DGX Spark is set to begin shipping soon while AMDs Radeon AI PRO R9700 graphics carddesigned for AI workstationswill officially become available on the 23rd. Both products utilize TSMCs advanced process technologies. MediaTek is also benefiting from the ramp-up of its GB10 chip further expanding its presence in the edge AI market"  [@semivision_tw](/creator/x/semivision_tw) on [X](/post/tweet/1948229151917228143) 2025-07-24 03:50:00 UTC 1029 followers, X engagements "High-Performance Silicon Photonics Platform for Next-Gen Data Communications #TSMC has developed an advanced silicon photonics foundry platform using 300mm wafer processing integrating #PIC (N65 and beyond) and #EIC (N7 and beyond) process nodes"  [@semivision_tw](/creator/x/semivision_tw) on [X](/post/tweet/1948053753912824119) 2025-07-23 16:13:02 UTC 1034 followers, XXX engagements "Eventually once TSMC Samsung and Intel fully ramp 2nm companies like Hua Hong CXMT and SMIC might have opportunities in sub-10nm but for now only the big three are making serious moves"  [@semivision_tw](/creator/x/semivision_tw) on [X](/post/tweet/1946742771081175233) 2025-07-20 01:23:40 UTC 1030 followers, XXX engagements "Chinese media: Jensen Huang has arrived in Beijing and met with Lei Jun for a photo together. A media press conference is being held in Beijing. (Photo: Tencent Technology) #NVIDIA #MI"  [@semivision_tw](/creator/x/semivision_tw) on [X](/post/tweet/1944687167630147737) 2025-07-14 09:15:25 UTC 1033 followers, XXX engagements "#TSMC continues to dominate the leading-edge process segment. From cloud to edge AI workloads the vast majority of chips are produced by TSMC. This includes AI chips and ASICs from NVIDIA AMD and all four major cloud service providers (CSPs)"  [@semivision_tw](/creator/x/semivision_tw) on [X](/post/tweet/1947827639353544963) 2025-07-23 01:14:32 UTC 1034 followers, XXX engagements "Hybrid bonding is regarded as one of the most transformative innovations in semiconductor manufacturing since extreme ultraviolet (EUV) lithography. Not only does it significantly improve the precision and performance of chip stacking but it also redefines how chip designers approach 3D architectures and system integration"  [@semivision_tw](/creator/x/semivision_tw) on [X](/post/tweet/1943528614592651750) 2025-07-11 04:31:45 UTC 1025 followers, XXX engagements "Currently #ASMLs revenue contribution from #EUV and #DUV isnt that far apart. While EUV systems are primarily ordered by #TSMC #Intel and #Samsung the urgency for High NA EUV isnt quite there yet. Intel and Samsungs 2nm mass production remains delayed and even CC admits theres no immediate need for High NA in the short term. On the other hand DUV demand is booming especially from China. Although the export of 1970i and above systems is restricted with resolution enhancement DUV can still handle 7nm. Chinese fabs are actively deploying 1965i systems and with sufficient overlay accuracy they"  [@semivision_tw](/creator/x/semivision_tw) on [X](/post/tweet/1946742557742121355) 2025-07-20 01:22:49 UTC 1034 followers, XXX engagements "To understand #NVIDIAs direction in silicon photonics we must first analyze TSMCs progress in this field. The reason is straightforwardNVIDIA is actively collaborating with TSMC. As a semiconductor giant #TSMCs broad range of process nodes allows it to leverage mature processes for PIC (Photonic Integrated Circuit) manufacturing"  [@semivision_tw](/creator/x/semivision_tw) on [X](/post/tweet/1947505672272122034) 2025-07-22 03:55:09 UTC 1030 followers, XXX engagements "With the growing demand for advanced packaging we have seen companies like #Marvell and #Broadcom launching their own advanced packaging platforms. For example:"  [@semivision_tw](/creator/x/semivision_tw) on [X](/post/tweet/1946749761643577506) 2025-07-20 01:51:26 UTC 1034 followers, XXX engagements "#Intel refocuses global fab strategy: No more blank checks says Intels Lin-Wu Chen Intel has scrapped its plans to build new wafer fabs in Germany and Poland and will consolidate its testing and assembly operations across Vietnam and Malaysia according to Intel executive Lin-Wu Chen. In addition the company will slow down construction of its advanced chip facility in Ohio citing the need for greater clarity on customer demand and anchor tenants before moving forward"  [@semivision_tw](/creator/x/semivision_tw) on [X](/post/tweet/1948563200406159628) 2025-07-25 01:57:24 UTC 1034 followers, XXX engagements "Future Outlook The race to innovate in #HBM and advanced packaging will continue to intensify as #AI and high-performance computing drive demand. Companies entering this space must not only focus on technology development but also ensure a secure and scalable supply chain. In subsequent discussions I can delve deeper into specific technologies market dynamics and the strategies needed to succeed in the rapidly evolving HBM landscape"  [@semivision_tw](/creator/x/semivision_tw) on [X](/post/tweet/1947490065661276346) 2025-07-22 02:53:08 UTC 1029 followers, XXX engagements "Broadcoms 3.5DXDSiP utilizes #TSMCs CoWoS-L packaging technology enabling a packaging size approximately XXX times larger than the reticle size with a total area of 4719 mm. It integrates logic ICs up to XX HBM3/HBM4 stacks and additional I/O chips"  [@semivision_tw](/creator/x/semivision_tw) on [X](/post/tweet/1946764561790427396) 2025-07-20 02:50:15 UTC 1031 followers, XXX engagements "To maximize performance Broadcom recommends decomposing the compute chip design and employing Hybrid Copper Bonding (HCB) in a face-to-face (F2F) configuration to stack one logic chip on top of another. This approach utilizes bumpless hybrid bonding directly connecting the metal layers of the upper and lower silicon dies. Compared to face-to-back (F2B) configurations that rely on through-silicon vias (TSVs) this method represents a key advantage of Broadcoms 3DXDSiP platform"  [@semivision_tw](/creator/x/semivision_tw) on [X](/post/tweet/1946780659378270536) 2025-07-20 03:54:13 UTC 1034 followers, 8518 engagements "🤝 HPE Completes Acquisition of Juniper Networks Hewlett Packard Enterprise has officially acquired Juniper Networks a leading AI-native networking solutions provider. This strategic move positions HPE to capitalize on the fast-growing AI and hybrid cloud markets by delivering a cloud-native AI-driven IT portfolio including a fully modernized networking stack. #HPE #JuniperNetworks #AINetworking #HybridCloud #AI #NetworkSolutions"  [@semivision_tw](/creator/x/semivision_tw) on [X](/post/tweet/1941007173007691789) 2025-07-04 05:32:26 UTC 1032 followers, XXX engagements "As advanced packaging technologies continue to evolve #Fluxless Thermo-Compression Bonding (#TCB) is rapidly emerging as a critical process for supporting AI chips high-bandwidth memory (such as HBM) and silicon photonics modules. Traditional TCB relies on flux and reflow processes to facilitate solder wetting and oxide removal. However in fine-pitch bondingparticularly below 40mthis approach often leads to voids residual contamination and reduced reliability falling short of the precision requirements"  [@semivision_tw](/creator/x/semivision_tw) on [X](/post/tweet/1945320778792116573) 2025-07-16 03:13:10 UTC 1034 followers, 1314 engagements "As a global leader in IC design #MediaTek has evolved from its consumer electronics SoC roots to expand into Edge AI #ASICs and automotive markets. In doing so it has increasingly recognized advanced packaging not merely as a manufacturing consideration but as a strategic capability. This evolution touches not only how chips are architected and IPs are integrated but how system-level synergy across performance thermal design and power consumption can be fully optimized"  [@semivision_tw](/creator/x/semivision_tw) on [X](/post/tweet/1946604517107118179) 2025-07-19 16:14:17 UTC 1026 followers, XXX engagements "🚀 Big news from the 2025 China RISC-V Summit #NVIDIAs VP of Hardware Engineering Frans Sijstermans just announced that the CUDA software platform will officially support RISC-V processors a major breakthrough for the open-source architectures path into data centers and the AI ecosystem. Historically x86 and Arm have dominated AI and HPC thanks to deep integration with CUDA from Intel and AMD chips powering data centers to NVIDIAs Jetson modules and Grace CPUs tightly coupled with Arm. In contrast RISC-V despite its openness and scalability has struggled to gain traction due to a lack of key"  [@semivision_tw](/creator/x/semivision_tw) on [X](/post/tweet/1947811281790206333) 2025-07-23 00:09:32 UTC 1035 followers, 2086 engagements "Edge #AI has become a highly contested frontier. AMDs newly announced Radeon AI PRO R9700 targets training of medium- to large-scale AI models featuring 32GB of GDDR6 high-speed memory and 32GB of VRAM enabling efficient model training and testing"  [@semivision_tw](/creator/x/semivision_tw) on [X](/post/tweet/1948410851662114918) 2025-07-24 15:52:01 UTC 1034 followers, XXX engagements "Traditional data transmission methods such as copper interconnections are typically high-speed and #optimal for short-distance communication. However as transmission distances increase power consumption significantly rises. This makes copper interconnections primarily suitable for inter-chip on-board and backplane applications"  [@semivision_tw](/creator/x/semivision_tw) on [X](/post/tweet/1947834803023159586) 2025-07-23 01:43:00 UTC 1034 followers, XXX engagements "In NVIDIAs substrate supply chain #Ibiden holds a market share of approximately 6575% #Unimicron around 1525% and #Kinsus about 510%. The Japanese leader Ibiden has most of its high-end capacity fully occupied by #NVIDIA. Unimicron has a proven track record of supplying substrates for NVIDIAs Blackwell series as well as high-end HDI boards for server OAM modules"  [@semivision_tw](/creator/x/semivision_tw) on [X](/post/tweet/1942027572457656645) 2025-07-07 01:07:09 UTC 1034 followers, XXX engagements
[GUEST ACCESS MODE: Data is scrambled or limited to provide examples. Make requests using your API key to unlock full data. Check https://lunarcrush.ai/auth for authentication information.]
@semivision_tw Semi Vision👁️👁️
Semi Vision👁️👁️ posts on X about chips, #ai, momentum, electronics the most. They currently have XXXXX followers and XX posts still getting attention that total XXX engagements in the last XX hours.
Engagements: XXX #
- X Week XXXXXX +275%
- X Month XXXXXX -XXXX%
Mentions: XX #
- X Week XX +19%
- X Month XXX +68%
Followers: XXXXX #
- X Week XXXXX +11%
- X Month XXXXX +32%
CreatorRank: XXXXXXXXX #
Social Influence #
Social category influence technology brands XXXXX% stocks XXXXX% countries XXXX% fashion brands XXXX% currencies XXXX% travel destinations XXXX% finance XXXX%
Social topic influence chips 11.86%, #ai 10.17%, momentum 3.39%, electronics 3.39%, soc 3.39%, samsung 3.39%, $7936t 3.39%, asics 3.39%, taiwan 1.69%, playing XXXX%
Top accounts mentioned or mentioned by @kapioyang @richieriiicch
Top assets mentioned Applied Materials, Inc. (AMAT)
Top Social Posts #
Top posts by engagements in the last XX hours
"As the global semiconductor landscape rapidly evolves and supply chain innovation becomes ever more critical #Taiwan and the United Kingdom are forging closer ties to co-develop the next generation of technology industry partnerships. Playing a key role in the UK's tech diplomacy and industrial development Innovate #UK is actively driving this momentum through its flagship initiativethe Global Business Innovation Programme (GBIP)injecting new energy into the innovation ecosystems across academia research and industry in both regions"
@semivision_tw on X 2025-07-25 04:48:56 UTC 1034 followers, X engagements
"🟥SemiVision : As #AI and electrification accelerate demand for higher power efficiency and reliability continues to soar. Today (2025/7/18) #Microchip Technology Inc. announced a strategic partnership with #Delta Electronics to integrate Microchips mSiC products and technologies into Deltas designs. Both companies aim to leverage this collaboration to accelerate the development of innovative #SiC solutions and energy-saving products and systems driving progress toward a more sustainable future" @semivision_tw on X 2025-07-19 01:30:03 UTC 1035 followers, XXX engagements
"MR-MUF & Its New Materials: The Missing Pieces to the Heat Control Puzzle As SK hynix was developing HBM2E the third generation of HBM controlling heat became a major focal point for improvement. Even when TC-NCF was being recognized as a packaging solution suitable for densely stacked products SK hynix challenged the status quo and strove to develop a new packaging technology offering improved heat dissipation. After countless tests and trials the company unveiled its new packaging technology MR-MUF in 2019 which would change the future of the #HBM market" @semivision_tw on X 2025-07-21 04:30:30 UTC 1031 followers, XXX engagements
"Industry Collaboration and Market Penetration In 2024 #Besi received orders for hybrid bonding systems with XXX nm alignment capabilities indicating readiness for next-generation nodes. Strategic partnership with Applied Materials (#AMAT) since 2020 deepening in 2025 as AMAT became Besis largest shareholder (9%) enabling tight integration from deposition to final assembly" @semivision_tw on X 2025-07-13 02:50:20 UTC 1030 followers, XXX engagements
"Demand for edge #AI chips is gaining momentum. All three major smartphone SoC vendorsApple #Qualcomm and #MediaTekhave adopted #TSMCs N3P process this year. PC chips are also expected to migrate toward 3nm to meet the rising computational demands of AI workloads. As a result TSMCs advanced process capacity is expected to remain tight throughout the year" @semivision_tw on X 2025-07-23 01:16:58 UTC 1034 followers, XXX engagements
"#Marvell highlights that with its proprietary D2D (die-to-die) I/O it can accommodate XX% more logic chips in custom XPU designs and install XX% more CHBM memory packages alongside the compute chips increasing the available DRAM capacity for processors. The company anticipates a XX% reduction in memory interface power consumption" @semivision_tw on X 2025-07-20 20:18:22 UTC 1034 followers, 1385 engagements
"🌈CPO (Co-Packaged Optics) is Poised to Power Large-Scale AI Supercomputing As AI workloads push the limits of bandwidth and latency embedded optical I/O technologies including OBO NPO and CPO are rapidly replacing traditional copper interconnects revolutionizing chip-to-chip data transmission. CPO a leading form of embedded optical interconnect integrates optical and electronic components within the same package representing an advanced step toward fully optical data pathways in compute architectures. The optical future of #AI infrastructure is coming faster cooler and more scalable than" @semivision_tw on X 2025-07-16 04:26:20 UTC 1034 followers, 15.7K engagements
"The market is closely watching whether miniaturized AI computing will become a lasting trend. As #AI adoption grows workstations are evolving toward more personalized integrated and user-friendly designs to support a wide range of applications. #NVIDIA is also making aggressive moves into the consumer CPU market based on Arm architecture a development that could become a new growth engine for #MediaTek" @semivision_tw on X 2025-07-25 01:49:00 UTC 1034 followers, XXX engagements
"🌈#SemiVision : Global Silicon Photonics Supply Chain Overview" @semivision_tw on X 2025-05-28 04:52:52 UTC 1034 followers, 38.8K engagements
"As a result silicon #photonics has become increasingly important due to its high reliabilityachieved through semiconductor manufacturing processesas well as its low power consumption. The realization of silicon photonics however heavily depends on foundry capabilities. Ultimately it requires the integration of photonic integrated circuits (PICs) with electronic integrated circuits (EICs) through advanced packaging techniques forming what is known as an #optical engine" @semivision_tw on X 2025-07-23 03:13:01 UTC 1035 followers, XXX engagements
"#TSMCs SoW Renaissance: Defending the AI Frontier Where NVIDIA Sells Ecosystem Not Chips" @semivision_tw on X 2025-07-21 02:01:05 UTC 1028 followers, XXX engagements
"Test Equipment Vendors and Market Opportunities #TEL #ficonTEC #MPI #advantest #formfactor" @semivision_tw on X 2025-07-17 11:23:23 UTC 1035 followers, XXX engagements
"The AI battlefield is expanding from the cloud to the edge. NVIDIA and #AMD have each launched next-generation AI computing platforms tailored for edge #AI development and high-throughput inference. #NVIDIAs AI supercomputer the DGX Spark is set to begin shipping soon while AMDs Radeon AI PRO R9700 graphics carddesigned for AI workstationswill officially become available on the 23rd. Both products utilize TSMCs advanced process technologies. MediaTek is also benefiting from the ramp-up of its GB10 chip further expanding its presence in the edge AI market" @semivision_tw on X 2025-07-24 03:50:00 UTC 1029 followers, X engagements
"High-Performance Silicon Photonics Platform for Next-Gen Data Communications #TSMC has developed an advanced silicon photonics foundry platform using 300mm wafer processing integrating #PIC (N65 and beyond) and #EIC (N7 and beyond) process nodes" @semivision_tw on X 2025-07-23 16:13:02 UTC 1034 followers, XXX engagements
"Eventually once TSMC Samsung and Intel fully ramp 2nm companies like Hua Hong CXMT and SMIC might have opportunities in sub-10nm but for now only the big three are making serious moves" @semivision_tw on X 2025-07-20 01:23:40 UTC 1030 followers, XXX engagements
"Chinese media: Jensen Huang has arrived in Beijing and met with Lei Jun for a photo together. A media press conference is being held in Beijing. (Photo: Tencent Technology) #NVIDIA #MI" @semivision_tw on X 2025-07-14 09:15:25 UTC 1033 followers, XXX engagements
"#TSMC continues to dominate the leading-edge process segment. From cloud to edge AI workloads the vast majority of chips are produced by TSMC. This includes AI chips and ASICs from NVIDIA AMD and all four major cloud service providers (CSPs)" @semivision_tw on X 2025-07-23 01:14:32 UTC 1034 followers, XXX engagements
"Hybrid bonding is regarded as one of the most transformative innovations in semiconductor manufacturing since extreme ultraviolet (EUV) lithography. Not only does it significantly improve the precision and performance of chip stacking but it also redefines how chip designers approach 3D architectures and system integration" @semivision_tw on X 2025-07-11 04:31:45 UTC 1025 followers, XXX engagements
"Currently #ASMLs revenue contribution from #EUV and #DUV isnt that far apart. While EUV systems are primarily ordered by #TSMC #Intel and #Samsung the urgency for High NA EUV isnt quite there yet. Intel and Samsungs 2nm mass production remains delayed and even CC admits theres no immediate need for High NA in the short term. On the other hand DUV demand is booming especially from China. Although the export of 1970i and above systems is restricted with resolution enhancement DUV can still handle 7nm. Chinese fabs are actively deploying 1965i systems and with sufficient overlay accuracy they" @semivision_tw on X 2025-07-20 01:22:49 UTC 1034 followers, XXX engagements
"To understand #NVIDIAs direction in silicon photonics we must first analyze TSMCs progress in this field. The reason is straightforwardNVIDIA is actively collaborating with TSMC. As a semiconductor giant #TSMCs broad range of process nodes allows it to leverage mature processes for PIC (Photonic Integrated Circuit) manufacturing" @semivision_tw on X 2025-07-22 03:55:09 UTC 1030 followers, XXX engagements
"With the growing demand for advanced packaging we have seen companies like #Marvell and #Broadcom launching their own advanced packaging platforms. For example:" @semivision_tw on X 2025-07-20 01:51:26 UTC 1034 followers, XXX engagements
"#Intel refocuses global fab strategy: No more blank checks says Intels Lin-Wu Chen Intel has scrapped its plans to build new wafer fabs in Germany and Poland and will consolidate its testing and assembly operations across Vietnam and Malaysia according to Intel executive Lin-Wu Chen. In addition the company will slow down construction of its advanced chip facility in Ohio citing the need for greater clarity on customer demand and anchor tenants before moving forward" @semivision_tw on X 2025-07-25 01:57:24 UTC 1034 followers, XXX engagements
"Future Outlook The race to innovate in #HBM and advanced packaging will continue to intensify as #AI and high-performance computing drive demand. Companies entering this space must not only focus on technology development but also ensure a secure and scalable supply chain. In subsequent discussions I can delve deeper into specific technologies market dynamics and the strategies needed to succeed in the rapidly evolving HBM landscape" @semivision_tw on X 2025-07-22 02:53:08 UTC 1029 followers, XXX engagements
"Broadcoms 3.5DXDSiP utilizes #TSMCs CoWoS-L packaging technology enabling a packaging size approximately XXX times larger than the reticle size with a total area of 4719 mm. It integrates logic ICs up to XX HBM3/HBM4 stacks and additional I/O chips" @semivision_tw on X 2025-07-20 02:50:15 UTC 1031 followers, XXX engagements
"To maximize performance Broadcom recommends decomposing the compute chip design and employing Hybrid Copper Bonding (HCB) in a face-to-face (F2F) configuration to stack one logic chip on top of another. This approach utilizes bumpless hybrid bonding directly connecting the metal layers of the upper and lower silicon dies. Compared to face-to-back (F2B) configurations that rely on through-silicon vias (TSVs) this method represents a key advantage of Broadcoms 3DXDSiP platform" @semivision_tw on X 2025-07-20 03:54:13 UTC 1034 followers, 8518 engagements
"🤝 HPE Completes Acquisition of Juniper Networks Hewlett Packard Enterprise has officially acquired Juniper Networks a leading AI-native networking solutions provider. This strategic move positions HPE to capitalize on the fast-growing AI and hybrid cloud markets by delivering a cloud-native AI-driven IT portfolio including a fully modernized networking stack. #HPE #JuniperNetworks #AINetworking #HybridCloud #AI #NetworkSolutions" @semivision_tw on X 2025-07-04 05:32:26 UTC 1032 followers, XXX engagements
"As advanced packaging technologies continue to evolve #Fluxless Thermo-Compression Bonding (#TCB) is rapidly emerging as a critical process for supporting AI chips high-bandwidth memory (such as HBM) and silicon photonics modules. Traditional TCB relies on flux and reflow processes to facilitate solder wetting and oxide removal. However in fine-pitch bondingparticularly below 40mthis approach often leads to voids residual contamination and reduced reliability falling short of the precision requirements" @semivision_tw on X 2025-07-16 03:13:10 UTC 1034 followers, 1314 engagements
"As a global leader in IC design #MediaTek has evolved from its consumer electronics SoC roots to expand into Edge AI #ASICs and automotive markets. In doing so it has increasingly recognized advanced packaging not merely as a manufacturing consideration but as a strategic capability. This evolution touches not only how chips are architected and IPs are integrated but how system-level synergy across performance thermal design and power consumption can be fully optimized" @semivision_tw on X 2025-07-19 16:14:17 UTC 1026 followers, XXX engagements
"🚀 Big news from the 2025 China RISC-V Summit #NVIDIAs VP of Hardware Engineering Frans Sijstermans just announced that the CUDA software platform will officially support RISC-V processors a major breakthrough for the open-source architectures path into data centers and the AI ecosystem. Historically x86 and Arm have dominated AI and HPC thanks to deep integration with CUDA from Intel and AMD chips powering data centers to NVIDIAs Jetson modules and Grace CPUs tightly coupled with Arm. In contrast RISC-V despite its openness and scalability has struggled to gain traction due to a lack of key" @semivision_tw on X 2025-07-23 00:09:32 UTC 1035 followers, 2086 engagements
"Edge #AI has become a highly contested frontier. AMDs newly announced Radeon AI PRO R9700 targets training of medium- to large-scale AI models featuring 32GB of GDDR6 high-speed memory and 32GB of VRAM enabling efficient model training and testing" @semivision_tw on X 2025-07-24 15:52:01 UTC 1034 followers, XXX engagements
"Traditional data transmission methods such as copper interconnections are typically high-speed and #optimal for short-distance communication. However as transmission distances increase power consumption significantly rises. This makes copper interconnections primarily suitable for inter-chip on-board and backplane applications" @semivision_tw on X 2025-07-23 01:43:00 UTC 1034 followers, XXX engagements
"In NVIDIAs substrate supply chain #Ibiden holds a market share of approximately 6575% #Unimicron around 1525% and #Kinsus about 510%. The Japanese leader Ibiden has most of its high-end capacity fully occupied by #NVIDIA. Unimicron has a proven track record of supplying substrates for NVIDIAs Blackwell series as well as high-end HDI boards for server OAM modules" @semivision_tw on X 2025-07-07 01:07:09 UTC 1034 followers, XXX engagements