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# ![@semivision_tw Avatar](https://lunarcrush.com/gi/w:26/cr:twitter::1881240196756504576.png) @semivision_tw SemiVision👁️👁️

SemiVision👁️👁️ posts on X about ai, taiwan, investment, china the most. They currently have XXXXX followers and XX posts still getting attention that total XXXXX engagements in the last XX hours.

### Engagements: XXXXX [#](/creator/twitter::1881240196756504576/interactions)
![Engagements Line Chart](https://lunarcrush.com/gi/w:600/cr:twitter::1881240196756504576/c:line/m:interactions.svg)

- X Week XXXXXX -XX%
- X Month XXXXXXX +498%
- X Months XXXXXXXXX +1,554%

### Mentions: XX [#](/creator/twitter::1881240196756504576/posts_active)
![Mentions Line Chart](https://lunarcrush.com/gi/w:600/cr:twitter::1881240196756504576/c:line/m:posts_active.svg)

- X Week XX -XX%
- X Month XXX -XX%
- X Months XXX +432%

### Followers: XXXXX [#](/creator/twitter::1881240196756504576/followers)
![Followers Line Chart](https://lunarcrush.com/gi/w:600/cr:twitter::1881240196756504576/c:line/m:followers.svg)

- X Week XXXXX +4.50%
- X Month XXXXX +58%
- X Months XXXXX +461%

### CreatorRank: XXXXXXX [#](/creator/twitter::1881240196756504576/influencer_rank)
![CreatorRank Line Chart](https://lunarcrush.com/gi/w:600/cr:twitter::1881240196756504576/c:line/m:influencer_rank.svg)

### Social Influence

**Social category influence**
[technology brands](/list/technology-brands)  XXXX% [countries](/list/countries)  XX% [finance](/list/finance)  XXXX% [stocks](/list/stocks)  XXXX% [currencies](/list/currencies)  XXXX% [travel destinations](/list/travel-destinations)  XXX% [social networks](/list/social-networks)  XXXX% [automotive brands](/list/automotive-brands)  XXXX% [fashion brands](/list/fashion-brands)  XXXX%

**Social topic influence**
[ai](/topic/ai) 20%, [taiwan](/topic/taiwan) #586, [investment](/topic/investment) 6.25%, [china](/topic/china) 5%, [future](/topic/future) 2.5%, [$6857t](/topic/$6857t) #5, [surge](/topic/surge) 2.5%, [dram](/topic/dram) #66, [the first](/topic/the-first) 2.5%, [acquisition](/topic/acquisition) #1570

**Top accounts mentioned or mentioned by**
[@semitaipei](/creator/undefined) [@ranierisecho](/creator/undefined) [@roy8uk](/creator/undefined) [@richieriiicch](/creator/undefined) [@elonmusk](/creator/undefined) [@dpyfungfung](/creator/undefined) [@theaiinvestor](/creator/undefined) [@marvelltech](/creator/undefined) [@danzwku](/creator/undefined) [@djrockysmith](/creator/undefined) [@badguydoubble](/creator/undefined) [@symaski62](/creator/undefined) [@derek_j_scv](/creator/undefined) [@gork](/creator/undefined) [@asymmetricmind](/creator/undefined) [@qubitium](/creator/undefined) [@thejetnamedchet](/creator/undefined) [@jkylebass](/creator/undefined) [@maggiemmmm1](/creator/undefined) [@tshirtnjeans2](/creator/undefined)

**Top assets mentioned**
[Dell Technologies, Inc. (DELL)](/topic/dell) [Applied Materials, Inc. (AMAT)](/topic/$amat) [Nokia Corporation (NOK)](/topic/$nok)
### Top Social Posts
Top posts by engagements in the last XX hours

"Future of AI Accelerators Ayar Labs and Alchip are teaming up to bring optics directly on-package for next-gen XPUs. Key highlights: X full-reticle AI accelerators X HBM stacks X Ayar Labs TeraPHY optical engines Integrated passive devices (IPD) for better signal integrity UCIe protocol converter chiplets for scale-up This collaboration blends high-bandwidth low-latency optical I/O with advanced packaging shaping the future of heterogeneous AI compute. #AI #Semiconductors #Optical #AdvancedPackaging"  
[X Link](https://x.com/semivision_tw/status/1972887967883800596)  2025-09-30T04:55Z 3832 followers, 8318 engagements


"Chinas Electromagnetic Shield to Block Starlink The South China Morning Post recently revealed a Chinese research project suggesting that the PLA could deploy a swarm of drones at an altitude of XX km to form an electromagnetic shield between Starlink satellites and Taiwan effectively blocking communication signals. These drones or alternatively balloons or high-altitude aircraft would align in the sky to create a dense jamming grid that beams noise down to the ground"  
[X Link](https://x.com/semivision_tw/status/1994322767953703098)  2025-11-28T08:29Z 3831 followers, 1.1M engagements


"🌈Todays focus at SWTest Asia 2025 was about silicon photonics testing especially how production-scale wafer testing is evolving with platforms like the #Advantest V93000 SOC ATE. From #Marvell Technology s work on integrated photonic devices to the testing innovations showcased by Advantest and #JENOPTIK its clear that test engineering is becoming a critical bottleneck and opportunity for next-generation optical I/O and co-packaged optics"  
[X Link](https://x.com/semivision_tw/status/1991731071508271110)  2025-11-21T04:51Z 3832 followers, XXX engagements


"CPU TPU GPU: A CPU is like a highly intelligent and versatile worker it can do anything but its slow when handling repetitive tasks. A GPU is like thousands of general-purpose workers all working together at the same time. A TPU is like an automated assembly line customized for a single task. Once the machines are arranged theres almost no back-and-forth movement. A TPU only accepts data not instructions. It doesnt need to choose from hundreds of operation codes and it"  
[X Link](https://x.com/semivision_tw/status/1994376766719418437)  2025-11-28T12:04Z 3832 followers, 110.2K engagements


"This year whether from keynote talks by Micron Marvell Advantest Teradyne MPI and other leading companies or from technical discussions throughout the forum one theme was consistent: testing is now essential for high-speed SerDes KGD validation multi-stacked memory system-level reliability and thermal integrity. As AI/HPC chips increase in package size and push signaling frequency ever higher test strategies must evolve beyond traditional wafer sort toward a new electrical optical thermal tri-domain framework. This shift is gradually turning testing into a critical engineering platformone"  
[X Link](https://x.com/semivision_tw/status/1995709007177150905)  2025-12-02T04:18Z 3832 followers, XXX engagements


"🟣At SEMICON Taiwan I spotted a showcase from LIST Technology (Zhen Ding Tech. Group) highlighting their high-layer FCBGA substrate for AI servers. XX layers ABF GL107 material XX XXX mm body size 11/11 m L/S Over 160K bump counts As AI accelerators push toward higher bandwidth and power delivery substrates like these become the true enablers. Advanced packaging isnt just about stacking chipsits about building the complex highways underneath that make AI scale possible. The race for high-layer count finer line/space substrates is intensifying and Taiwans ecosystem is clearly at the forefront."  
[X Link](https://x.com/semivision_tw/status/1966017853238419786)  2025-09-11T05:55Z 3834 followers, 16.9K engagements


"China is building an aerial front line on the roof of the world. Near Tingriclose to Mount Everest and more than 4300 meters above sea levelconstruction crews are carving runways into terrain defined by perpetual cold and thin air. Officially these new airports are meant to improve transportation links in remote regions. Yet their ultra-long runways reinforced concrete shelters and hardened blast-resistant hangars reveal a parallel purpose: military power projection. Over the past decade China has rapidly expanded aviation infrastructure across the Tibetan Plateau and a Wall Street Journal"  
[X Link](https://x.com/semivision_tw/status/1997876693852402015)  2025-12-08T03:51Z 3834 followers, XXX engagements


"Nan Ya Plastics partners with Japans Nittobo to jointly expand specialty glass-fiber production for the fast-growing AI supply chain. As AI demand accelerates the global market for high-performance specialty fiberglass fabrics is tightening. To address this surge Nan Ya Plastics and Nittobo have formed a strategic partnership to co-develop and co-produce advanced specialty glass fabrics enhancing supply resilience and meeting rapid market growth. Nan Ya will leverage its deep experience in electronic materials fiberglass copper foil and resin technologies while Nittobo contributes its"  
[X Link](https://x.com/semivision_tw/status/1994324347222413381)  2025-11-28T08:35Z 3830 followers, 3062 engagements


"Emerging 3D integration technologies such as SoIC Foveros Intel ODI and M3Das plotted in the graphrequire vertical interconnects below XX m pitch. These ultra-fine interfaces drive up the demand for high-performance TIMs capable of maintaining consistent BLT (bond line thickness) and low Rc (contact resistance) even in the face of chip-level warpage and localized thermal hotspots. Looking ahead as packaging evolves toward near-memory computing and logic-to-memory stacks (L1/L2/L3) become thermally co-located the role of TIM1 becomes central to power delivery integrity cooling efficiency and"  
[X Link](https://x.com/semivision_tw/status/1997520956017828119)  2025-12-07T04:18Z 3831 followers, XXX engagements


"Musk: The essence of inflation and deflation is the ratio between the output of goods and services and the money supply. U.S. interest payments on federal debt have already surpassed the defense budget and that represents a massive crisis. Only by dramatically boosting productivity through AI and robotics can this be fixed. In about three years the growth of goods and services will exceed the growth of the money supply triggering deflation and ultimately resolving the U.S. debt problem"  
[X Link](https://x.com/semivision_tw/status/1997645181730832754)  2025-12-07T12:31Z 3831 followers, XXX engagements


"According to the latest report from the tech YouTube channel Moores Law Is Dead the global DRAM market is facing a perfect storm triggered by #OpenAIone that could force multiple highly anticipated graphics cards to be delayed or canceled while pushing memory prices to new highs. Insiders claim that OpenAI CEO Sam Altman recently orchestrated an extremely aggressive procurement move. On the same dayOctober 1OpenAI reportedly signed massive contracts with both Samsung and SK Hynix securing roughly XX% of the worlds DRAM supply"  
[X Link](https://x.com/semivision_tw/status/1997662803436683459)  2025-12-07T13:41Z 3832 followers, XXX engagements


"💥 Memory Prices Are Surging And PC Makers Cant Hold the Line Anymore The DRAM price spike is now spilling into the consumer market. Both Dell and Lenovo have officially begun adjusting product prices marking the first wave of downstream price hikes. 🔵 Dell Price hikes will begin mid-December Increase range: 15%20% Example: A 32GB DDR5 module jumping from $XXX $XXX 🔴 Lenovo Existing price quotes are no longer valid Reason: Supply chain stress Market volatility: Prices doubling every XX days Starting 2026 prices will adjust based purely on market conditions"  
[X Link](https://x.com/semivision_tw/status/1997888221955731756)  2025-12-08T04:37Z 3832 followers, 1205 engagements


"Semicon Taiwan last day #Lasertec #Heraeus #TDK #Mitsubishi"  
[X Link](https://x.com/semivision_tw/status/1966378753048850948)  2025-09-12T05:50Z 3790 followers, 1654 engagements


"Powertech Technology Inc. (PTI) stated that the company has been investing in FOPLP (Fan-Out Panel-Level Packaging) for many years and has co-developed technologies with multiple AI and networking chip customers. This year yield rates have surpassed the mass-production threshold marking the official entry of FOPLP into the commercialization stage. PTI also plans to further expand its investment in 2025 and establish large-scale FOPLP production lines in 2026. The company expects this to begin contributing meaningfully to revenue while forming a comprehensive technology portfolio alongside its"  
[X Link](https://x.com/semivision_tw/status/1972869653195370964)  2025-09-30T03:42Z 3805 followers, XXX engagements


"TSMC x Nvidia : Breaking the Thermal Wall: How Advanced Cooling Is Powering the Future of Computing"  
[X Link](https://x.com/semivision_tw/status/1979063706697748802)  2025-10-17T05:55Z 3791 followers, XXX engagements


"🟥Former Taiwan President Tsai Ing-wen visited ESMC (European Semiconductor Manufacturing Company) in Dresden a joint venture between TSMC Bosch Infineon Technologies and NXP Semiconductors that represents Europes largest semiconductor investment to date. Tsai emphasized that Taiwans semiconductor expertise is not only an essential part of the global economy but also a pillar of resilience and cooperation. She expressed confidence that ESMC will become a key milestone in Europes semiconductor advancement bringing Taiwans experience in manufacturing engineering and ecosystem collaboration to"  
[X Link](https://x.com/semivision_tw/status/1988516801173422085)  2025-11-12T07:58Z 3814 followers, XXX engagements


"GlobalFoundries has announced its acquisition of Advanced Micro Foundry(AMF) the silicon photonics foundry based in Singaporemarking a major milestone in GFs push to scale innovation and strengthen its leadership in silicon photonics. This acquisition: Positions GF as the largest pure-play silicon photonics foundry by revenue Expands its silicon photonics portfolio R&D capabilities and manufacturing capacity in Singapore Opens new market opportunities across next-generation datacenter and communications applications Improves supply-chain resilience enabling customers to source secure and"  
[X Link](https://x.com/semivision_tw/status/1990954492523917508)  2025-11-19T01:25Z 3814 followers, 1436 engagements


"✴ A paper published in Nature validated the feasibility of photonics for AI acceleration from another perspective. The study showcased the first photonic processor capable of executing advanced neural networks such as ResNet and BERT achieving accuracy close to that of 32-bit floating-point digital accelerators across multiple complex tasks. This photonic processor employed a multi-chip integrated package vertically combining six chips within a single package (four 128128 photonic tensor cores PTCs plus two 12nm digital control interfaces DCIs). High-speed interfaces connected the photonic"  
[X Link](https://x.com/semivision_tw/status/1995225833955381676)  2025-11-30T20:18Z 3790 followers, 9684 engagements


"Comparison with Other Industry Players As AI training continues to scale other major players in the industry have taken different approaches to address the Scale-Up challenge: #NVIDIA: NVIDIA has continued along a path of GPU cluster expansion coupled with advanced packaging. Its latest-generation Blackwell Ultra GPU adopts a dual-die design with XXX billion transistors delivering roughly XX% higher performance than its predecessor the H100. #SemiVision #Semiconductor #SiPh #SiliconPhotonics #CPO #Photonics #AI #Insight #Technology"  
[X Link](https://x.com/semivision_tw/status/1995346624063652255)  2025-12-01T04:18Z 3816 followers, 2091 engagements


"#Nvidia is investing USD X billion to acquire #Synopsys shares at USD XXXXXX each integrating GPU + CUDA directly into EDA toolscovering everything from chips and automobiles to aerospace and industrial applications. This is more than an investment. It marks a full migration of engineering simulation into a new era powered by AI + GPU acceleration. Design cycles that once took weeks will be compressed into hours fundamentally transforming how engineers work"  
[X Link](https://x.com/semivision_tw/status/1995653235412271442)  2025-12-02T00:36Z 3807 followers, XXX engagements


"#TSMC Chairman C.C. Wei is reportedly set to travel to mainland China on December X accompanied by two vice presidents to attend TSMCs Open Innovation Platform (OIP) Ecosystem Forum in Nanjing. During the trip he is also expected to visit Alibaba and several other chip design houses to explore potential collaboration opportunities. The 2025 TSMC OIP Ecosystem Forum began on September XX with events held sequentially in Santa Clara (Silicon Valley) Tokyo Hsinchu and Amsterdam. The final session is scheduled for December X at the Shangri-La Hotel in Nanjing. According to TSMCs official event"  
[X Link](https://x.com/semivision_tw/status/1995676156436337144)  2025-12-02T02:07Z 3814 followers, XXX engagements


"The semiconductor ecosystem is increasingly showing a dual-axis pattern: Technological concentration geographically dispersed capacity and services. 🔷 Front-End (WFE): Dominated by a handful of playersASML Applied Materials (AMAT) Lam Research Tokyo Electron (TEL) and KLA. 🔷Back-End (Advanced Packaging): Led by OSAT majors ASE Amkor JCET along with key equipment vendors such as Disco Besi ASMPT K&S and Semes. #SemiVision #Semiconducctor #AI #Insight #Market #SupplyChain"  
[X Link](https://x.com/semivision_tw/status/1996433788826456115)  2025-12-04T04:18Z 3814 followers, 1091 engagements


"Supply Chain Landscape and Market Dynamics 🔷 Front-End WFE: The market is dominated by five giants (ASML AMAT Lam TEL KLA). In 2024 WFE revenue was approximately USD 13.3B projected to reach USD 16.5B by 2029. In the past two years China has emerged as one of the largest destinations for shipments driving suppliers to expand global service and manufacturing nodes. #SemiVision #Semiconducctor #AI #Insight #Market #SupplyChain"  
[X Link](https://x.com/semivision_tw/status/1996622026572722388)  2025-12-04T16:46Z 3813 followers, XXX engagements


"🔷 Back-End Packaging: The rise of AI/HPC workloads is fueling demand for HB TCB and HBM. Equipment vendors including Besi ASMPT K&S Semes Hanmi Hanwha EVG and SUSS are ramping up capacity and upgrading product lines. By 2030 the TCB equipment market is estimated at USD 936M while HB equipment is projected at USD 397M"  
[X Link](https://x.com/semivision_tw/status/1996622027629678878)  2025-12-04T16:46Z 3806 followers, XXX engagements


"TIMs have evolved from being a passive supporting layer to a critical enabler for system stability in AI processors high-performance computing (HPC) and next-generation advanced packaging. As chip power densities exceed X W/mm local hot spots surge beyond 100C and traditional cooling solutions reach their limits the choice and design of TIMs often become the defining factor for system performance and lifespan. #SemiVision #Semiconducctor #AI #Insight #Market #SupplyChain"  
[X Link](https://x.com/semivision_tw/status/1996796181687443827)  2025-12-05T04:18Z 3787 followers, XXX engagements


"#NVIDIA now has more cash than it can realistically spend. Foreign media point out that the AI giants biggest headache is having over $XX billion in cash on its balance sheet. To accelerate the pace of deploying that capital the company has been aggressively investing in tech giants and AI startups including Synopsys Nokia Intel and Anthropic with total investments reaching $XX billion. Its massive cash pile has become a talking point in the market as the company struggles to digest the surplus"  
[X Link](https://x.com/semivision_tw/status/1996833859481018621)  2025-12-05T06:47Z 3790 followers, XXX engagements


"Custom accelerators are set to surpass GPUs in units shipped by 2028. This marks a profound shift in semiconductor design as AI demand drives the rise of tailored silicon. Slide from #Marvell"  
[X Link](https://x.com/semivision_tw/status/1996893397001572408)  2025-12-05T10:44Z 3785 followers, XXX engagements


"At Computex 2025 (Taipei) #Fabric8Labs and #Wiwynn a leading Taiwanese server manufacturer jointly showcased ECAM cold plate applications for AI data centers at Taipei Nangang Exhibition Center. The demo combined Fabric8Labs advanced thermal structures with Wiwynns liquid-cooled rack solutions marking an important deployment signal for ECAM technology within Taiwans AI infrastructure ecosystem"  
[X Link](https://x.com/semivision_tw/status/1978822572704776477)  2025-10-16T13:57Z 3824 followers, XXX engagements


"Custom ASIC design house #Alchip Technologies and optical I/O company #AyarLabs have unveiled a reference design platform for AI ASICs with multiple optical die-die I/O engines. Enabling scale-up network and extended memory this design would allow 200-250 Tb/s bidirectional bandwidth from a single SiP"  
[X Link](https://x.com/semivision_tw/status/1971056394712551547)  2025-09-25T03:37Z 3815 followers, XXX engagements


"Unimicrons Next-Gen High Layer Count PCB Roadmap @ IMPACT 2025 Unimicron showcased its HLC PCB (High Layer Count PCB) roadmap through 2027 pushing multilayer PCB manufacturing into new territory for AI servers HPC and advanced packaging. Presented at: IMPACT 2025 (20th Anniversary) Credit: SemiVision"  
[X Link](https://x.com/semivision_tw/status/1980450473208680753)  2025-10-21T01:46Z 3814 followers, 1383 engagements


"ASE Expands in Taiwan: NT$4.2 Billion Investment to Boost Advanced Packaging Capacity in Zhongli ASE Technology Holding has announced a major expansion in Taiwan exercising its contractual right of first refusal to acquire XXXXX% ownership of a second-phase facility from Hung Ching Development & Construction Co. Ltd. The acquisition covers: 14065 ping of building area ( 46400 m) 2119 ping of land ( 7000 m) This facility will be used to expand advanced packaging and testing capacity at ASEs Zhongli campus supporting the companys growth in high-end OSAT processes as global demand surges for AI"  
[X Link](https://x.com/semivision_tw/status/1993169630173802989)  2025-11-25T04:07Z 3818 followers, XXX engagements


"SUMCO noted that while artificial intelligence is driving strong demand for XXX mm (12-inch) advanced-node wafers the global XXX mm market remains sluggish due to the slow recovery of mature-node demand ongoing U.S.China tech decoupling and Chinas increasing self-sufficiency"  
[X Link](https://x.com/semivision_tw/status/1993461314786893859)  2025-11-25T23:26Z 3818 followers, XXX engagements


"Sandisk and Samsung Delay NAND Deliveries; Transcend Cut Off Since October Driven by surging demand from large-scale and hyperscale data centersfueled by major cloud service providers aggressive expansion plansthe situation has worsened further in Q4. All major chipmakers are prioritizing supply to these high-volume customers resulting in sharp price increases and extremely limited availability. Just last week alone we were notified of cost increases ranging from XX% to 100%. Prices continue rising at an unusually rapid pace with no sign of stabilization"  
[X Link](https://x.com/semivision_tw/status/1996368774153523434)  2025-12-03T23:59Z 3819 followers, XXX engagements


"SK Hynix Adjusts Its 2025 HBM4 Capacity Ramp A Strategic Shift Aligned With NVIDIAs Roadmap SK Hynix is revising its mass-production schedule for next-generation HBM4 (6th-gen HBM) pushing back its planned capacity surge from late Q2 2025 to Q3. The move is widely interpreted as a strategic adjustment to match NVIDIAs AI chip demand patterns and the launch timeline of its next-generation Rubin platform. According to ZDNet Korea full HBM4 mass production has been delayed by one to two months compared with the original plan. HBM4 is the memory architecture that will power NVIDIAs upcoming Rubin"  
[X Link](https://x.com/semivision_tw/status/1997980903369506874)  2025-12-08T10:45Z 3834 followers, 1285 engagements


"🔵SemiVision : Physical AI is not just about algorithms humanoid robots require an entire ecosystem of high-performance electromechanical actuators. Walking balancing grasping lifting rotating a joint with human-like precision all of these depend on advanced motors gearboxes and drivers working together. These displays show exactly that: a full-body joint solution for humanoid robotics from neck and shoulder torque motors to elbow knee hip wrist and even finger actuators. Each joint demands different thrust torque rigidity and response speed. In the era of Physical AI motors are the new"  
[X Link](https://x.com/semivision_tw/status/1998213768963403849)  2025-12-09T02:11Z 3834 followers, XXX engagements


"Most critically in the often-overlooked domain of electro-optical co-testing the trio of TSMC NVIDIA and ficonTEC is establishing foundational infrastructure. Among them ficonTEC plays a pivotal role by delivering the worlds first 300mm double-sided wafer test platform seamlessly integrating automated electro-optical alignment active optical probing and high-throughput test flows. Their system allows for concurrent electrical and photonic characterization at the wafer level an essential capability for validating the performance and yield of high-speed optical engines in real manufacturing"  
[X Link](https://x.com/semivision_tw/status/1998224341884981614)  2025-12-09T02:53Z 3834 followers, 2466 engagements

[GUEST ACCESS MODE: Data is scrambled or limited to provide examples. Make requests using your API key to unlock full data. Check https://lunarcrush.ai/auth for authentication information.]

@semivision_tw Avatar @semivision_tw SemiVision👁️👁️

SemiVision👁️👁️ posts on X about ai, taiwan, investment, china the most. They currently have XXXXX followers and XX posts still getting attention that total XXXXX engagements in the last XX hours.

Engagements: XXXXX #

Engagements Line Chart

  • X Week XXXXXX -XX%
  • X Month XXXXXXX +498%
  • X Months XXXXXXXXX +1,554%

Mentions: XX #

Mentions Line Chart

  • X Week XX -XX%
  • X Month XXX -XX%
  • X Months XXX +432%

Followers: XXXXX #

Followers Line Chart

  • X Week XXXXX +4.50%
  • X Month XXXXX +58%
  • X Months XXXXX +461%

CreatorRank: XXXXXXX #

CreatorRank Line Chart

Social Influence

Social category influence technology brands XXXX% countries XX% finance XXXX% stocks XXXX% currencies XXXX% travel destinations XXX% social networks XXXX% automotive brands XXXX% fashion brands XXXX%

Social topic influence ai 20%, taiwan #586, investment 6.25%, china 5%, future 2.5%, $6857t #5, surge 2.5%, dram #66, the first 2.5%, acquisition #1570

Top accounts mentioned or mentioned by @semitaipei @ranierisecho @roy8uk @richieriiicch @elonmusk @dpyfungfung @theaiinvestor @marvelltech @danzwku @djrockysmith @badguydoubble @symaski62 @derek_j_scv @gork @asymmetricmind @qubitium @thejetnamedchet @jkylebass @maggiemmmm1 @tshirtnjeans2

Top assets mentioned Dell Technologies, Inc. (DELL) Applied Materials, Inc. (AMAT) Nokia Corporation (NOK)

Top Social Posts

Top posts by engagements in the last XX hours

"Future of AI Accelerators Ayar Labs and Alchip are teaming up to bring optics directly on-package for next-gen XPUs. Key highlights: X full-reticle AI accelerators X HBM stacks X Ayar Labs TeraPHY optical engines Integrated passive devices (IPD) for better signal integrity UCIe protocol converter chiplets for scale-up This collaboration blends high-bandwidth low-latency optical I/O with advanced packaging shaping the future of heterogeneous AI compute. #AI #Semiconductors #Optical #AdvancedPackaging"
X Link 2025-09-30T04:55Z 3832 followers, 8318 engagements

"Chinas Electromagnetic Shield to Block Starlink The South China Morning Post recently revealed a Chinese research project suggesting that the PLA could deploy a swarm of drones at an altitude of XX km to form an electromagnetic shield between Starlink satellites and Taiwan effectively blocking communication signals. These drones or alternatively balloons or high-altitude aircraft would align in the sky to create a dense jamming grid that beams noise down to the ground"
X Link 2025-11-28T08:29Z 3831 followers, 1.1M engagements

"🌈Todays focus at SWTest Asia 2025 was about silicon photonics testing especially how production-scale wafer testing is evolving with platforms like the #Advantest V93000 SOC ATE. From #Marvell Technology s work on integrated photonic devices to the testing innovations showcased by Advantest and #JENOPTIK its clear that test engineering is becoming a critical bottleneck and opportunity for next-generation optical I/O and co-packaged optics"
X Link 2025-11-21T04:51Z 3832 followers, XXX engagements

"CPU TPU GPU: A CPU is like a highly intelligent and versatile worker it can do anything but its slow when handling repetitive tasks. A GPU is like thousands of general-purpose workers all working together at the same time. A TPU is like an automated assembly line customized for a single task. Once the machines are arranged theres almost no back-and-forth movement. A TPU only accepts data not instructions. It doesnt need to choose from hundreds of operation codes and it"
X Link 2025-11-28T12:04Z 3832 followers, 110.2K engagements

"This year whether from keynote talks by Micron Marvell Advantest Teradyne MPI and other leading companies or from technical discussions throughout the forum one theme was consistent: testing is now essential for high-speed SerDes KGD validation multi-stacked memory system-level reliability and thermal integrity. As AI/HPC chips increase in package size and push signaling frequency ever higher test strategies must evolve beyond traditional wafer sort toward a new electrical optical thermal tri-domain framework. This shift is gradually turning testing into a critical engineering platformone"
X Link 2025-12-02T04:18Z 3832 followers, XXX engagements

"🟣At SEMICON Taiwan I spotted a showcase from LIST Technology (Zhen Ding Tech. Group) highlighting their high-layer FCBGA substrate for AI servers. XX layers ABF GL107 material XX XXX mm body size 11/11 m L/S Over 160K bump counts As AI accelerators push toward higher bandwidth and power delivery substrates like these become the true enablers. Advanced packaging isnt just about stacking chipsits about building the complex highways underneath that make AI scale possible. The race for high-layer count finer line/space substrates is intensifying and Taiwans ecosystem is clearly at the forefront."
X Link 2025-09-11T05:55Z 3834 followers, 16.9K engagements

"China is building an aerial front line on the roof of the world. Near Tingriclose to Mount Everest and more than 4300 meters above sea levelconstruction crews are carving runways into terrain defined by perpetual cold and thin air. Officially these new airports are meant to improve transportation links in remote regions. Yet their ultra-long runways reinforced concrete shelters and hardened blast-resistant hangars reveal a parallel purpose: military power projection. Over the past decade China has rapidly expanded aviation infrastructure across the Tibetan Plateau and a Wall Street Journal"
X Link 2025-12-08T03:51Z 3834 followers, XXX engagements

"Nan Ya Plastics partners with Japans Nittobo to jointly expand specialty glass-fiber production for the fast-growing AI supply chain. As AI demand accelerates the global market for high-performance specialty fiberglass fabrics is tightening. To address this surge Nan Ya Plastics and Nittobo have formed a strategic partnership to co-develop and co-produce advanced specialty glass fabrics enhancing supply resilience and meeting rapid market growth. Nan Ya will leverage its deep experience in electronic materials fiberglass copper foil and resin technologies while Nittobo contributes its"
X Link 2025-11-28T08:35Z 3830 followers, 3062 engagements

"Emerging 3D integration technologies such as SoIC Foveros Intel ODI and M3Das plotted in the graphrequire vertical interconnects below XX m pitch. These ultra-fine interfaces drive up the demand for high-performance TIMs capable of maintaining consistent BLT (bond line thickness) and low Rc (contact resistance) even in the face of chip-level warpage and localized thermal hotspots. Looking ahead as packaging evolves toward near-memory computing and logic-to-memory stacks (L1/L2/L3) become thermally co-located the role of TIM1 becomes central to power delivery integrity cooling efficiency and"
X Link 2025-12-07T04:18Z 3831 followers, XXX engagements

"Musk: The essence of inflation and deflation is the ratio between the output of goods and services and the money supply. U.S. interest payments on federal debt have already surpassed the defense budget and that represents a massive crisis. Only by dramatically boosting productivity through AI and robotics can this be fixed. In about three years the growth of goods and services will exceed the growth of the money supply triggering deflation and ultimately resolving the U.S. debt problem"
X Link 2025-12-07T12:31Z 3831 followers, XXX engagements

"According to the latest report from the tech YouTube channel Moores Law Is Dead the global DRAM market is facing a perfect storm triggered by #OpenAIone that could force multiple highly anticipated graphics cards to be delayed or canceled while pushing memory prices to new highs. Insiders claim that OpenAI CEO Sam Altman recently orchestrated an extremely aggressive procurement move. On the same dayOctober 1OpenAI reportedly signed massive contracts with both Samsung and SK Hynix securing roughly XX% of the worlds DRAM supply"
X Link 2025-12-07T13:41Z 3832 followers, XXX engagements

"💥 Memory Prices Are Surging And PC Makers Cant Hold the Line Anymore The DRAM price spike is now spilling into the consumer market. Both Dell and Lenovo have officially begun adjusting product prices marking the first wave of downstream price hikes. 🔵 Dell Price hikes will begin mid-December Increase range: 15%20% Example: A 32GB DDR5 module jumping from $XXX $XXX 🔴 Lenovo Existing price quotes are no longer valid Reason: Supply chain stress Market volatility: Prices doubling every XX days Starting 2026 prices will adjust based purely on market conditions"
X Link 2025-12-08T04:37Z 3832 followers, 1205 engagements

"Semicon Taiwan last day #Lasertec #Heraeus #TDK #Mitsubishi"
X Link 2025-09-12T05:50Z 3790 followers, 1654 engagements

"Powertech Technology Inc. (PTI) stated that the company has been investing in FOPLP (Fan-Out Panel-Level Packaging) for many years and has co-developed technologies with multiple AI and networking chip customers. This year yield rates have surpassed the mass-production threshold marking the official entry of FOPLP into the commercialization stage. PTI also plans to further expand its investment in 2025 and establish large-scale FOPLP production lines in 2026. The company expects this to begin contributing meaningfully to revenue while forming a comprehensive technology portfolio alongside its"
X Link 2025-09-30T03:42Z 3805 followers, XXX engagements

"TSMC x Nvidia : Breaking the Thermal Wall: How Advanced Cooling Is Powering the Future of Computing"
X Link 2025-10-17T05:55Z 3791 followers, XXX engagements

"🟥Former Taiwan President Tsai Ing-wen visited ESMC (European Semiconductor Manufacturing Company) in Dresden a joint venture between TSMC Bosch Infineon Technologies and NXP Semiconductors that represents Europes largest semiconductor investment to date. Tsai emphasized that Taiwans semiconductor expertise is not only an essential part of the global economy but also a pillar of resilience and cooperation. She expressed confidence that ESMC will become a key milestone in Europes semiconductor advancement bringing Taiwans experience in manufacturing engineering and ecosystem collaboration to"
X Link 2025-11-12T07:58Z 3814 followers, XXX engagements

"GlobalFoundries has announced its acquisition of Advanced Micro Foundry(AMF) the silicon photonics foundry based in Singaporemarking a major milestone in GFs push to scale innovation and strengthen its leadership in silicon photonics. This acquisition: Positions GF as the largest pure-play silicon photonics foundry by revenue Expands its silicon photonics portfolio R&D capabilities and manufacturing capacity in Singapore Opens new market opportunities across next-generation datacenter and communications applications Improves supply-chain resilience enabling customers to source secure and"
X Link 2025-11-19T01:25Z 3814 followers, 1436 engagements

"✴ A paper published in Nature validated the feasibility of photonics for AI acceleration from another perspective. The study showcased the first photonic processor capable of executing advanced neural networks such as ResNet and BERT achieving accuracy close to that of 32-bit floating-point digital accelerators across multiple complex tasks. This photonic processor employed a multi-chip integrated package vertically combining six chips within a single package (four 128128 photonic tensor cores PTCs plus two 12nm digital control interfaces DCIs). High-speed interfaces connected the photonic"
X Link 2025-11-30T20:18Z 3790 followers, 9684 engagements

"Comparison with Other Industry Players As AI training continues to scale other major players in the industry have taken different approaches to address the Scale-Up challenge: #NVIDIA: NVIDIA has continued along a path of GPU cluster expansion coupled with advanced packaging. Its latest-generation Blackwell Ultra GPU adopts a dual-die design with XXX billion transistors delivering roughly XX% higher performance than its predecessor the H100. #SemiVision #Semiconductor #SiPh #SiliconPhotonics #CPO #Photonics #AI #Insight #Technology"
X Link 2025-12-01T04:18Z 3816 followers, 2091 engagements

"#Nvidia is investing USD X billion to acquire #Synopsys shares at USD XXXXXX each integrating GPU + CUDA directly into EDA toolscovering everything from chips and automobiles to aerospace and industrial applications. This is more than an investment. It marks a full migration of engineering simulation into a new era powered by AI + GPU acceleration. Design cycles that once took weeks will be compressed into hours fundamentally transforming how engineers work"
X Link 2025-12-02T00:36Z 3807 followers, XXX engagements

"#TSMC Chairman C.C. Wei is reportedly set to travel to mainland China on December X accompanied by two vice presidents to attend TSMCs Open Innovation Platform (OIP) Ecosystem Forum in Nanjing. During the trip he is also expected to visit Alibaba and several other chip design houses to explore potential collaboration opportunities. The 2025 TSMC OIP Ecosystem Forum began on September XX with events held sequentially in Santa Clara (Silicon Valley) Tokyo Hsinchu and Amsterdam. The final session is scheduled for December X at the Shangri-La Hotel in Nanjing. According to TSMCs official event"
X Link 2025-12-02T02:07Z 3814 followers, XXX engagements

"The semiconductor ecosystem is increasingly showing a dual-axis pattern: Technological concentration geographically dispersed capacity and services. 🔷 Front-End (WFE): Dominated by a handful of playersASML Applied Materials (AMAT) Lam Research Tokyo Electron (TEL) and KLA. 🔷Back-End (Advanced Packaging): Led by OSAT majors ASE Amkor JCET along with key equipment vendors such as Disco Besi ASMPT K&S and Semes. #SemiVision #Semiconducctor #AI #Insight #Market #SupplyChain"
X Link 2025-12-04T04:18Z 3814 followers, 1091 engagements

"Supply Chain Landscape and Market Dynamics 🔷 Front-End WFE: The market is dominated by five giants (ASML AMAT Lam TEL KLA). In 2024 WFE revenue was approximately USD 13.3B projected to reach USD 16.5B by 2029. In the past two years China has emerged as one of the largest destinations for shipments driving suppliers to expand global service and manufacturing nodes. #SemiVision #Semiconducctor #AI #Insight #Market #SupplyChain"
X Link 2025-12-04T16:46Z 3813 followers, XXX engagements

"🔷 Back-End Packaging: The rise of AI/HPC workloads is fueling demand for HB TCB and HBM. Equipment vendors including Besi ASMPT K&S Semes Hanmi Hanwha EVG and SUSS are ramping up capacity and upgrading product lines. By 2030 the TCB equipment market is estimated at USD 936M while HB equipment is projected at USD 397M"
X Link 2025-12-04T16:46Z 3806 followers, XXX engagements

"TIMs have evolved from being a passive supporting layer to a critical enabler for system stability in AI processors high-performance computing (HPC) and next-generation advanced packaging. As chip power densities exceed X W/mm local hot spots surge beyond 100C and traditional cooling solutions reach their limits the choice and design of TIMs often become the defining factor for system performance and lifespan. #SemiVision #Semiconducctor #AI #Insight #Market #SupplyChain"
X Link 2025-12-05T04:18Z 3787 followers, XXX engagements

"#NVIDIA now has more cash than it can realistically spend. Foreign media point out that the AI giants biggest headache is having over $XX billion in cash on its balance sheet. To accelerate the pace of deploying that capital the company has been aggressively investing in tech giants and AI startups including Synopsys Nokia Intel and Anthropic with total investments reaching $XX billion. Its massive cash pile has become a talking point in the market as the company struggles to digest the surplus"
X Link 2025-12-05T06:47Z 3790 followers, XXX engagements

"Custom accelerators are set to surpass GPUs in units shipped by 2028. This marks a profound shift in semiconductor design as AI demand drives the rise of tailored silicon. Slide from #Marvell"
X Link 2025-12-05T10:44Z 3785 followers, XXX engagements

"At Computex 2025 (Taipei) #Fabric8Labs and #Wiwynn a leading Taiwanese server manufacturer jointly showcased ECAM cold plate applications for AI data centers at Taipei Nangang Exhibition Center. The demo combined Fabric8Labs advanced thermal structures with Wiwynns liquid-cooled rack solutions marking an important deployment signal for ECAM technology within Taiwans AI infrastructure ecosystem"
X Link 2025-10-16T13:57Z 3824 followers, XXX engagements

"Custom ASIC design house #Alchip Technologies and optical I/O company #AyarLabs have unveiled a reference design platform for AI ASICs with multiple optical die-die I/O engines. Enabling scale-up network and extended memory this design would allow 200-250 Tb/s bidirectional bandwidth from a single SiP"
X Link 2025-09-25T03:37Z 3815 followers, XXX engagements

"Unimicrons Next-Gen High Layer Count PCB Roadmap @ IMPACT 2025 Unimicron showcased its HLC PCB (High Layer Count PCB) roadmap through 2027 pushing multilayer PCB manufacturing into new territory for AI servers HPC and advanced packaging. Presented at: IMPACT 2025 (20th Anniversary) Credit: SemiVision"
X Link 2025-10-21T01:46Z 3814 followers, 1383 engagements

"ASE Expands in Taiwan: NT$4.2 Billion Investment to Boost Advanced Packaging Capacity in Zhongli ASE Technology Holding has announced a major expansion in Taiwan exercising its contractual right of first refusal to acquire XXXXX% ownership of a second-phase facility from Hung Ching Development & Construction Co. Ltd. The acquisition covers: 14065 ping of building area ( 46400 m) 2119 ping of land ( 7000 m) This facility will be used to expand advanced packaging and testing capacity at ASEs Zhongli campus supporting the companys growth in high-end OSAT processes as global demand surges for AI"
X Link 2025-11-25T04:07Z 3818 followers, XXX engagements

"SUMCO noted that while artificial intelligence is driving strong demand for XXX mm (12-inch) advanced-node wafers the global XXX mm market remains sluggish due to the slow recovery of mature-node demand ongoing U.S.China tech decoupling and Chinas increasing self-sufficiency"
X Link 2025-11-25T23:26Z 3818 followers, XXX engagements

"Sandisk and Samsung Delay NAND Deliveries; Transcend Cut Off Since October Driven by surging demand from large-scale and hyperscale data centersfueled by major cloud service providers aggressive expansion plansthe situation has worsened further in Q4. All major chipmakers are prioritizing supply to these high-volume customers resulting in sharp price increases and extremely limited availability. Just last week alone we were notified of cost increases ranging from XX% to 100%. Prices continue rising at an unusually rapid pace with no sign of stabilization"
X Link 2025-12-03T23:59Z 3819 followers, XXX engagements

"SK Hynix Adjusts Its 2025 HBM4 Capacity Ramp A Strategic Shift Aligned With NVIDIAs Roadmap SK Hynix is revising its mass-production schedule for next-generation HBM4 (6th-gen HBM) pushing back its planned capacity surge from late Q2 2025 to Q3. The move is widely interpreted as a strategic adjustment to match NVIDIAs AI chip demand patterns and the launch timeline of its next-generation Rubin platform. According to ZDNet Korea full HBM4 mass production has been delayed by one to two months compared with the original plan. HBM4 is the memory architecture that will power NVIDIAs upcoming Rubin"
X Link 2025-12-08T10:45Z 3834 followers, 1285 engagements

"🔵SemiVision : Physical AI is not just about algorithms humanoid robots require an entire ecosystem of high-performance electromechanical actuators. Walking balancing grasping lifting rotating a joint with human-like precision all of these depend on advanced motors gearboxes and drivers working together. These displays show exactly that: a full-body joint solution for humanoid robotics from neck and shoulder torque motors to elbow knee hip wrist and even finger actuators. Each joint demands different thrust torque rigidity and response speed. In the era of Physical AI motors are the new"
X Link 2025-12-09T02:11Z 3834 followers, XXX engagements

"Most critically in the often-overlooked domain of electro-optical co-testing the trio of TSMC NVIDIA and ficonTEC is establishing foundational infrastructure. Among them ficonTEC plays a pivotal role by delivering the worlds first 300mm double-sided wafer test platform seamlessly integrating automated electro-optical alignment active optical probing and high-throughput test flows. Their system allows for concurrent electrical and photonic characterization at the wafer level an essential capability for validating the performance and yield of high-speed optical engines in real manufacturing"
X Link 2025-12-09T02:53Z 3834 followers, 2466 engagements

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