#  @semivision_tw Semi Vision Semi Vision posts on X about ai, taiwan, future, in the the most. They currently have [-----] followers and [----] posts still getting attention that total [-----] engagements in the last [--] hours. ### Engagements: [-----] [#](/creator/twitter::1881240196756504576/interactions)  - [--] Week [-------] -33% - [--] Month [-------] +52% - [--] Months [---------] -88% - [--] Year [----------] +164,110,800% ### Mentions: [--] [#](/creator/twitter::1881240196756504576/posts_active)  - [--] Month [---] +53% - [--] Months [---] +205% - [--] Year [-----] +62,750% ### Followers: [-----] [#](/creator/twitter::1881240196756504576/followers)  - [--] Week [-----] +4.50% - [--] Month [-----] +37% - [--] Months [-----] +413% - [--] Year [-----] +20,618% ### CreatorRank: [-------] [#](/creator/twitter::1881240196756504576/influencer_rank)  ### Social Influence **Social category influence** [technology brands](/list/technology-brands) [stocks](/list/stocks) [countries](/list/countries) [finance](/list/finance) [currencies](/list/currencies) [celebrities](/list/celebrities) [fashion brands](/list/fashion-brands) [travel destinations](/list/travel-destinations) [automotive brands](/list/automotive-brands) [products](/list/products) **Social topic influence** [ai](/topic/ai), [taiwan](/topic/taiwan) #695, [future](/topic/future), [in the](/topic/in-the), [china](/topic/china), [investment](/topic/investment), [core](/topic/core), [chips](/topic/chips), [global](/topic/global), [united states](/topic/united-states) **Top accounts mentioned or mentioned by** [@elonmusk](/creator/undefined) [@grok](/creator/undefined) [@thehedgeberg](/creator/undefined) [@qingpinghe1](/creator/undefined) [@serapeum1103](/creator/undefined) [@semiconjpn](/creator/undefined) [@xai](/creator/undefined) [@nvidia](/creator/undefined) [@theaiinvestor](/creator/undefined) [@polymarket](/creator/undefined) [@ryanair](/creator/undefined) [@mrbeast](/creator/undefined) [@xingpt](/creator/undefined) [@caizhenghai](/creator/undefined) [@semivisiontw](/creator/undefined) [@chiefaioffice](/creator/undefined) [@treasureh8nter](/creator/undefined) [@r00041451](/creator/undefined) [@fatfire74](/creator/undefined) [@ai126f4](/creator/undefined) **Top assets mentioned** [Alphabet Inc Class A (GOOGL)](/topic/$googl) [Microsoft Corp. (MSFT)](/topic/microsoft) [Taiwan Semiconductor (TSM)](/topic/taiwan-semiconductor) ### Top Social Posts Top posts by engagements in the last [--] hours "💻 #AI PCs are the future trend with AI-enabled #PCs expected to surpass 50% of global shipments by [----]. Equipped with dedicated NPUs these devices will enhance AI performance directly on the device. 🟠 What AI PC can do with #GenAI https://tspasemiconductor.substack.com/p/genai-revolutionizing-smartphones https://tspasemiconductor.substack.com/p/genai-revolutionizing-smartphones" [X Link](https://x.com/semivision_tw/status/1897468200096514318) 2025-03-06T02:04Z [--] followers, [--] engagements "This Dune movie scene is a perfect metaphor for the current state of the #semiconductor industry in #Arizona USA. #TSMC #Intel #Amkor #Nvidia #apple" [X Link](https://x.com/semivision_tw/status/1898654343399674151) 2025-03-09T08:37Z [--] followers, [--] engagements "SK Hynix Delivers #HBM4 12Hi Samples Ahead of Schedule Mass Production Expected in the Second Half of the Year #AI #HBM SK HynixHBM4 12Hi 🔹 SK HynixAI 12HBM4 🔹 [----] 🔹 SKAI https://t.co/bksdM2AWhb SK HynixHBM4 12Hi 🔹 SK HynixAI 12HBM4 🔹 [----] 🔹 SKAI https://t.co/bksdM2AWhb" [X Link](https://x.com/semivision_tw/status/1902604972291977299) 2025-03-20T06:15Z [---] followers, [---] engagements "#SemiVision team is composed of experts with robust #semiconductor backgrounds and hands-on industry experience. Our collective expertise spans the entire value chain: from foundry operations semiconductor manufacturing processes advanced package" [X Link](https://x.com/semivision_tw/status/1904888757255553122) 2025-03-26T13:30Z [---] followers, [--] engagements "Toward Self-Sufficiency: Chinas Equipment Development Strategy #semiconductor #Semicon #China #Sicarrier #Huawei #ASML #AMAT #TEL #TSMC https://open.substack.com/pub/tspasemiconductor/p/toward-self-sufficiency-chinas-equipmentr=4hpdhj&utm_campaign=post&utm_medium=web&showWelcomeOnShare=true https://open.substack.com/pub/tspasemiconductor/p/toward-self-sufficiency-chinas-equipmentr=4hpdhj&utm_campaign=post&utm_medium=web&showWelcomeOnShare=true" [X Link](https://x.com/semivision_tw/status/1904925804368453663) 2025-03-26T15:57Z [---] followers, [---] engagements "According to the #China National Intellectual Property Administration (CNIPA) #Huawei Technologies Co. Ltd. filed a patent in September [----] titled Method for Manufacturing Semiconductor Device Using Self-Aligned Quadruple Patterning (Publication No. CN117751427A)" [X Link](https://x.com/semivision_tw/status/1905243793529721015) 2025-03-27T13:01Z [---] followers, [--] engagements "Inventec: US+1" [X Link](https://x.com/semivision_tw/status/1905253113943957760) 2025-03-27T13:38Z [----] followers, [--] engagements "#SK Hynix aims to lock in all [----] #HBM orders by mid-2025 Its CEO shrugs off concerns about the potential impact of low-cost Chinese #AI models on HBM demand https://www.kedglobal.com/korean-chipmakers/newsView/ked202503270004 https://www.kedglobal.com/korean-chipmakers/newsView/ked202503270004" [X Link](https://x.com/semivision_tw/status/1905498332321165742) 2025-03-28T05:52Z [---] followers, [--] engagements "#SMIC is semiconductor Deepseek Interesting According to SemiVision DeepSeek is planning to manufacture chips using SMICs 5nm process. https://t.co/WgRYjoVjBq https://t.co/6G2ophWyLS Interesting According to SemiVision DeepSeek is planning to manufacture chips using SMICs 5nm process. https://t.co/WgRYjoVjBq https://t.co/6G2ophWyLS" [X Link](https://x.com/semivision_tw/status/1906210576826552754) 2025-03-30T05:03Z [---] followers, [---] engagements "January: DeepSeek R1 launched IQ [---] February: o3-mini launched IQ [---] March: Geminie [---] launched IQ [---] At this rate we can expect to see AI models with IQs between [---] and [---] by the second half of the year at the latest.This will accelerate the speed of AIs self-reinforced learning. Whats most interesting is that the IQ of LLMs also follows a normal distribution just like humans XD" [X Link](https://x.com/semivision_tw/status/1906706702768251089) 2025-03-31T13:54Z [---] followers, [----] engagements "🌏 Global #Semiconductor Equipment Spending Overview #China : Continues to lead with equipment investment reaching $38 billion in [----] but this marks a 24% decline from its peak in [----]. South #Korea: Driven by AI-induced memory demand investment is projected to grow by 29% in [----] and reach $27 billion in [----] potentially becoming the second-largest globally. #Taiwan: Continues to enhance its advanced technology and capacity layout maintaining its position as the third-largest in global semiconductor equipment spending. Investments are expected to reach $21 billion in [----] and $24.5 billion" [X Link](https://x.com/semivision_tw/status/1906998614490231024) 2025-04-01T09:14Z [---] followers, [--] engagements "According to tech media TweakTown #NVIDIA has rebranded itself as NVID AI to strengthen its position in the AI field. Insiders from CEO Jensen Huangs inner circle revealed that NVIDIAs leadership wants #AI to become synonymous with the brand while still preserving its traditional identity and brand recognition" [X Link](https://x.com/semivision_tw/status/1907238139737039347) 2025-04-02T01:06Z [----] followers, [---] engagements "Taiwan Semiconductor Local Supply https://www.ctee.com.tw/news/20250401700083-439901 https://www.ctee.com.tw/news/20250401700083-439901" [X Link](https://x.com/semivision_tw/status/1907391794356117595) 2025-04-02T11:16Z [---] followers, [--] engagements "On the afternoon of April 2nd local time (4 a.m. on April 3rd Taiwan time) U.S. President Trump officially announced varying reciprocal tariffs for different countries in the White House Rose Garden effective immediately. Trump stated that most goods entering the United States would be subject to a minimum tariff of 10% while the reciprocal tariff for Taiwan is set at 32%" [X Link](https://x.com/semivision_tw/status/1907566285648703697) 2025-04-02T22:50Z [---] followers, [---] engagements "#Trump announced the imposition of reciprocal tariffs on a range of countries stating that the United States will apply the following tariffs on imports: 34% on goods from China 20% on the European Union 26% on India 25% on South Korea 24% on Japan 32% on Taiwan 31% on Switzerland 46% on Vietnam and 10% on both the United Kingdom and Brazil" [X Link](https://x.com/semivision_tw/status/1907569108025225322) 2025-04-02T23:01Z [---] followers, [---] engagements "The Pacific region is a majorly affected area under the tariff impact as shown on the map. Countries in East and Southeast Asia particularly China Vietnam Thailand and other ASEAN nations are shaded in darker blue indicating higher tariff rates. The region is notably impacted due to its extensive trade relations with the United States particularly in manufacturing and electronics exports. This concentration of high tariffs is likely due to strategic economic measures targeting these countries substantial export volumes and the perceived trade imbalances. Additionally the broader Asia-Pacific" [X Link](https://x.com/semivision_tw/status/1907612965190393924) 2025-04-03T01:55Z [---] followers, [---] engagements "Spirited Away: A Tale of the #Semiconductor Industrys Transformation https://open.substack.com/pub/tspasemiconductor/p/spirited-away-a-tale-of-the-semiconductorr=4hpdhj&utm_campaign=post&utm_medium=web&showWelcomeOnShare=false https://open.substack.com/pub/tspasemiconductor/p/spirited-away-a-tale-of-the-semiconductorr=4hpdhj&utm_campaign=post&utm_medium=web&showWelcomeOnShare=false" [X Link](https://x.com/semivision_tw/status/1908928471319076937) 2025-04-06T17:03Z [---] followers, [---] engagements "@WhiteHouse True" [X Link](https://x.com/semivision_tw/status/1910170336148214227) 2025-04-10T03:17Z [---] followers, [--] engagements "SemiVision is an emerging research institute focused on the semiconductor industry. If youre interested in topics such as geopolitics semiconductors NVIDIA TSMC and silicon photonics we invite you to follow our free newsletter on Substack https://tspasemiconductor.substack.com/utm_source=global-search https://tspasemiconductor.substack.com/utm_source=global-search" [X Link](https://x.com/semivision_tw/status/1910209080075116995) 2025-04-10T05:51Z [---] followers, [---] engagements "This Gartner chart compares GenAI use cases for IT organizations by value and feasibility. Use cases in the Likely wins quadrantlike code generation job analysis and data quality managementoffer high feasibility and value. Calculated risks offer high value but may be harder to implement" [X Link](https://x.com/semivision_tw/status/1911988466998714797) 2025-04-15T03:42Z [---] followers, [---] engagements "TSMCs Q1 revenue rose 35% year-over-year to $25.53 billion with gross margin slightly declining to 58.8%. Net income surged 60% to $10.9 billion with earnings per share (EPS) of $2.12. Strong AI demand drove HPC revenue to grow over 70% YoY now accounting for nearly 60% of total revenue" [X Link](https://x.com/semivision_tw/status/1912757941360525562) 2025-04-17T06:40Z [---] followers, [--] engagements "U.S. semiconductor design software giant Synopsys has announced its acquisition of simulation software provider Ansys a deal that has drawn significant international attention. Both Synopsys and Ansys offer products in the fields of Electronic Design Automation (EDA) software optical software and photonics software and they compete horizontally in these markets. To address concerns over potential anti-competitive effects due to overlapping businesses Synopsys will divest its optical and photonics software divisions as well as Ansyss PowerArtist (RTL) software business to Keysight Technologies" [X Link](https://x.com/semivision_tw/status/1913824425214156909) 2025-04-20T05:17Z [---] followers, [---] engagements "💵 Semiconductor Equipment Market Revenue China North America Taiwan Europe Source: semi" [X Link](https://x.com/semivision_tw/status/1914311963007660526) 2025-04-21T13:35Z [---] followers, [---] engagements "According to industry sources cited by South Korean media outlet ChosunBiz construction of #Samsung 's plant in Taylor #Texas has reached 99.6% completion nearing the final stages. At this point equipment installation would typically begin; however reports suggest that Samsung is facing hesitation and has yet to place orders for the equipment indicating a state of indecision" [X Link](https://x.com/semivision_tw/status/1914918658822037612) 2025-04-23T05:46Z [---] followers, [---] engagements "🌈SemiVision OFC50 How Do Co-Packaged Optics (CPO) Become Manufacturable As the data center ecosystem rapidly transitions toward Co-Packaged Optics (CPO) and Optical I/O (OIO) to meet the unprecedented demands of AI-driven bandwidth several key technical and manufacturing challenges stand in the way of commercialization. These challenges are not merely theoretical; they are deeply intertwined with cost energy efficiency physical form factor and silicon photonics manufacturing scalability 👉Read more: https://lnkd.in/gXzP5qid https://lnkd.in/gXzP5qid" [X Link](https://x.com/semivision_tw/status/1916086581955596698) 2025-04-26T11:06Z [---] followers, [---] engagements "According to the latest forecasts the global semiconductor market is expected to achieve approximately 10% annual growth in [----] maintaining a steady and healthy expansion trend. This growth is driven by the simultaneous advancement across multiple sectors including high-performance computing (HPC) smartphones automotive electronics IoT and emerging applications creating a diversified and resilient market structure" [X Link](https://x.com/semivision_tw/status/1917114528481087952) 2025-04-29T07:11Z [---] followers, [--] engagements "🔵Advanced Packaging Intel EMIB Tsmc CoWoS Read more: Captain Intel: Reassembling the Semiconductor Avengers [----] TSMC NorthAmerica Technology Symposium - Review https://lnkd.in/gTEcz6qr https://lnkd.in/gQ25iQSk https://lnkd.in/gTEcz6qr https://lnkd.in/gQ25iQSk" [X Link](https://x.com/semivision_tw/status/1917375431617163464) 2025-04-30T00:28Z [---] followers, [---] engagements "Nvidia CEO Jensen Huang warns China is not behind in AI" [X Link](https://x.com/semivision_tw/status/1917783906113446118) 2025-05-01T03:31Z [---] followers, [---] engagements "#Synopsys has announced EDA and IP collaborations with #Intel Foundry. The agreements include making available its certified AI-driven digital and analogue design flows for Intels 18A process node and production-ready EDA flows for the 18A-P process node with RibbonFET Gate-all-around transistor architecture and the industry's first commercial foundry implementation of PowerVia backside power delivery" [X Link](https://x.com/semivision_tw/status/1917900547325309402) 2025-05-01T11:14Z [---] followers, [---] engagements "From Manufacturer to Ecosystem Enabler: Rather than competing with system companies TSMC positions itself as a collaborative non-competing partner to system-level players such as NVIDIA Broadcom and Marvell" [X Link](https://x.com/semivision_tw/status/1918617930952286233) 2025-05-03T10:45Z [---] followers, [--] engagements "Chip War: The Strategic Battle Behind Semiconductors The U.S.China chip war has entered a critical phase. With the U.S. investing $52B through the CHIPS Act and offering tax incentives to revitalize domestic semiconductor manufacturing China is responding with strategic export controls on critical metals like germanium materials vital to chipmaking. This geopolitical tech race impacts not only chipmakers but also downstream industries like aviation automotive defense and consumer electronics. As the semiconductor supply chain becomes a national security issue the global tech ecosystem must" [X Link](https://x.com/semivision_tw/status/1918867546520133643) 2025-05-04T03:17Z [---] followers, [--] engagements "SemiVision is a semiconductor industry research institution committed to transforming analysis into vision through comprehensive insights into the semiconductor ecosystem" [X Link](https://x.com/semivision_tw/status/1919046039266377915) 2025-05-04T15:06Z [---] followers, [--] engagements "Aside from semiconductor and IC design giants like TSMC and MediaTek most Taiwanese companies still struggle with razor-thin profit margins of just 3% to 4%. In March the New Taiwan dollar weakened along with the stock market briefly falling below the NT$33 marksome even found relief in minor foreign exchange gains. But in less than two months the situation has reversed sharply. Now profit margins have suddenly turned negative overnight pushing many firms to the brink of survival" [X Link](https://x.com/semivision_tw/status/1919259434301428022) 2025-05-05T05:14Z [---] followers, [---] engagements "As the world progresses semiconductors are becoming a foundational industry that touches every aspect of modern life making it essential for all to grasp its significance. Rooted in Taiwana global hub of semiconductor excellencewe maintain a worldwide perspective bridging local expertise with international trends" [X Link](https://x.com/semivision_tw/status/1919561614237327527) 2025-05-06T01:15Z [---] followers, [--] engagements "N2 (Mass production in 2025) -TSMCs first-generation Gate-All-Around (GAA) process offering a 15% performance improvement over N3E and enabling support for up to 12-layer HBM4 integrationideal for AI and HPC memory bandwidth demands. -N12 N5 and N3 logic base die for HBM4 -N2P (Mass production in 2026) An optimized GAA variant N2P enhances 3D-IC interconnect density to [--] million/mm tailored for chiplet-based architectures and multi-die packaging platforms" [X Link](https://x.com/semivision_tw/status/1919651582943121839) 2025-05-06T07:12Z [---] followers, [---] engagements "#Keysight Technologies announced its collaboration with Intel Foundry to support Embedded Multi-die Interconnect Bridge #EMIB-T technology. This cutting-edge innovation is designed to enhance high-performance packaging solutions for the AI and data center markets and will support #Intels 18A process node" [X Link](https://x.com/semivision_tw/status/1919658522285109560) 2025-05-06T07:40Z [----] followers, [---] engagements "As illustrated in the first diagram TSMC forecasts that by [----] HPC/AI will account for 45% of the global semiconductor market becoming the dominant application platform. This is followed by smartphones at 25% automotive electronics at 15% IoT at 10% and other segments at 5%. Such a shift in market structure indicates a pivotal transition away from mobile-centric demand toward innovation centered around AI and high-throughput compute workloads" [X Link](https://x.com/semivision_tw/status/1919977035138482248) 2025-05-07T04:46Z [---] followers, [--] engagements "Nvidias new processor features a MediaTek-designed CPU based on the Arm architecture integrated with Nvidias Blackwell-architecture GPU to form a new processor series. Nvidia aims to collaborate closely with MediaTek to deliver performance that surpasses AMDs Radeon graphics cards and Qualcomms Adreno GPUs targeting the gaming market and related business opportunities" [X Link](https://x.com/semivision_tw/status/1920036885797196275) 2025-05-07T08:44Z [---] followers, [---] engagements "Synopsys and TSMC are jointly enabling the next era of angstrom-scale design innovation through certified EDA flows on TSMCs A16 and N2P processes. These flows driven by Synopsys. ai deliver optimized digital and analog performance rapid migration paths and unmatched productivity for leading-edge designs. The collaboration spans across multiple generations including early engagement on the A14 node reflecting a shared commitment to delivering high-quality tools and flows for high-performance semiconductor development" [X Link](https://x.com/semivision_tw/status/1920792175928836557) 2025-05-09T10:45Z [---] followers, [---] engagements "Humanoid Robots Will Define the Future of Chip Demand and Integration Technology Humanoid robots represent one of the most complex and silicon-intensive systems envisioned in the coming decade. These machines are expected to combine a wide array of advanced semiconductor components each serving highly specialized functionsfrom perception and spatial awareness to decision-making and actuation. As such humanoid robots will set new benchmarks for chip performance integration density and packaging innovation" [X Link](https://x.com/semivision_tw/status/1921077544360833054) 2025-05-10T05:39Z [---] followers, [---] engagements "Synopsys also provides full 3Dblox support and CoWoS enablement for 5.5x reticle-size integrations accelerating multi-die 3D stacking and chiplet-based system design for next-generation AI chips. Furthermore its broad IP portfolioone of the industrys most completehas been validated for use on both N2 and N2P processes ensuring access to best-in-class IP blocks for advanced SoC design. This partnership underscores the central role of co-optimized EDA IP and advanced process technologies in enabling the performance power and area (PPA) breakthroughs required for the future of AI HPC and beyond" [X Link](https://x.com/semivision_tw/status/1921382539639345162) 2025-05-11T01:51Z [---] followers, [--] engagements "Powered by Cadences industry-leading solvers andNVIDIA Blackwellsystems its optimized for electronic design automation (EDA) system design automation (SDA) and life sciences workloads delivering unmatched scale speed and insights. From semiconductor design and autonomous machines to breakthroughs in drug discovery the Millennium M2000 Supercomputer transforms possibilities into reality" [X Link](https://x.com/semivision_tw/status/1921382925993754688) 2025-05-11T01:52Z [---] followers, [--] engagements "Im really looking forward to the release of this film it will help more people understand the development of Taiwans semiconductor industry. https://youtu.be/TzI-kTINIB8si=WIiiGZJLq7_nlPa1 https://youtu.be/TzI-kTINIB8si=WIiiGZJLq7_nlPa1" [X Link](https://x.com/semivision_tw/status/1921450085746880965) 2025-05-11T06:19Z [---] followers, [---] engagements "TSMC and Nvidia Fuel the Rise of U.S. AI Chips How the Trump Administration Helped Kickstart Americas Semiconductor Revival https://open.substack.com/pub/tspasemiconductor/p/tsmc-and-nvidia-fuel-the-rise-ofr=4hpdhj&utm_campaign=post&utm_medium=web&showWelcomeOnShare=false https://open.substack.com/pub/tspasemiconductor/p/tsmc-and-nvidia-fuel-the-rise-ofr=4hpdhj&utm_campaign=post&utm_medium=web&showWelcomeOnShare=false" [X Link](https://x.com/semivision_tw/status/1921794853811155202) 2025-05-12T05:09Z [---] followers, [--] engagements "🔴 TSMC's U.S. President Rose Castanares recently stated in an interview with Axios that the company has committed a total investment of $165 billion USD to build semiconductor facilities in the United States. Once all fabs are completed and fully operational the investment is expected to create [-----] direct jobs across the country" [X Link](https://x.com/semivision_tw/status/1921794995042099257) 2025-05-12T05:10Z [---] followers, [--] engagements "2025 VLSI Technology Forum - Advanced Substrate for High Performance Heterogeneous Integration https://open.substack.com/pub/tspasemiconductor/p/2025-vlsi-technology-forum-advancedr=4hpdhj&utm_campaign=post&utm_medium=web&showWelcomeOnShare=false https://open.substack.com/pub/tspasemiconductor/p/2025-vlsi-technology-forum-advancedr=4hpdhj&utm_campaign=post&utm_medium=web&showWelcomeOnShare=false" [X Link](https://x.com/semivision_tw/status/1921915142738002195) 2025-05-12T13:07Z [---] followers, [---] engagements "Taiwans fertility rate has fallen below Japans a stunning demographic shift with serious implications. In the semiconductor industry alone every advanced foundry requires thousands of skilled workers to operate and maintain production. From cleanroom engineers to process control specialists human capital is the backbone of chipmaking. But as Taiwans birth rate continues to plunge a severe labor shortage is looming" [X Link](https://x.com/semivision_tw/status/1922097540419486169) 2025-05-13T01:12Z [---] followers, [--] engagements "Without strategic action talent cultivation automation and international recruitment the future of Taiwans high-tech dominance could be at risk. #Semiconductor #Taiwan #FertilityRate #LaborShortage #TechIndustry #Foundry" [X Link](https://x.com/semivision_tw/status/1922097636699451837) 2025-05-13T01:12Z [---] followers, [--] engagements "In particular the surging demand for high-density high-performance and low-power chips in areas such as AI accelerators data center servers and premium mobile devices will continue to drive aggressive innovation and scaling in semiconductor process technologies" [X Link](https://x.com/semivision_tw/status/1922122907485884901) 2025-05-13T02:53Z [---] followers, [--] engagements "According to research by IDC driven by strong demand from high-performance computing customers such as NVIDIA AMD AWS Broadcom and cloud service providers TSMCs CoWoS capacity continues to expand rapidly. The company aims to double its output from [------] wafers in [----] to [------] wafers this year representing a 100% year-over-year growth. The primary growth driver is the CoWoS-L product line which is expected to surge by 470% annually. Additionally capacity expansion is also underway at ASE and Amkor in the United States." [X Link](https://x.com/semivision_tw/status/1922213515911483550) 2025-05-13T08:53Z [---] followers, [---] engagements "President Trump Announces $600B Investment in Saudi Arabia AI as a New Tool of Diplomacy The goal To use AI as a diplomatic instrumenta signal that artificial intelligence is no longer just about innovation but about national power. In the future AI = National Strength and it will redefine how nations compete on the global stage" [X Link](https://x.com/semivision_tw/status/1922511934248882232) 2025-05-14T04:38Z [---] followers, [--] engagements "❇NVIDIA CEO Jensen Huang Speaks at the Saudi-U.S. Investment Forum in Riyadh Jensen Huang announced a new agreement with Saudi Arabias newly established AI company Humain to supply chips for a 500MW AI data center project. Backed by the Public Investment Fund (PIF) Humain plans to scale data center capacity to 1.9GW by [----] as Saudi Arabia doubles down on AI and localized data infrastructure. In the AI era power will be the ceiling for compute. P.S. Jensen looks extra sharp in that leather jacket" [X Link](https://x.com/semivision_tw/status/1922528379645132984) 2025-05-14T05:44Z [---] followers, [---] engagements "SemiVision: While Moores Law historically delivered exponential scaling by shrinking transistor dimensions the semiconductor industry now recognizes that transistor scaling alone is no longer sufficient to meet the demands of AI cloud computing and data-centric workloads. The More-than-Moore paradigm has emerged as a new scaling frontier emphasizing heterogeneous integration system-level co-design and materials innovation as critical enablers of future performance and functionality" [X Link](https://x.com/semivision_tw/status/1922844709149389212) 2025-05-15T02:41Z [---] followers, [---] engagements "Fast forward to [----] and the conversation has evolved. At OFC50 the question is no longer why CPO but how do we make CPO manufacturable As discussed in this article companies such as NVIDIA Broadcom and Marvellhave shared practical insights into testability reliability and scalable integration strategies reflecting the industrys maturity and urgency to overcome real-world deployment barriers" [X Link](https://x.com/semivision_tw/status/1923057374043963780) 2025-05-15T16:46Z [---] followers, [---] engagements "TSMC's VP of advanced technology and mask engineering explained about the roadmap for the incoming nine factories. Stated the demand for CoWoS is "insane". -CoWoS capacity: +80% CAGR (20222025) -3nm chips: +60% shipments in [----] vs [----] -AI chips: [--] more in [----] vs [----] -Global semiconductor market: +10% yearly to reach $1T by 2030" [X Link](https://x.com/semivision_tw/status/1923189138750312736) 2025-05-16T01:29Z [---] followers, [---] engagements "In the next section we explore and compare the silicon photonics concepts and system-level approaches of Intel Ayar Labs and Avicena as part of a broader technical series. This will be followed by a comprehensive cross-company analysis including NVIDIA Broadcom and Marvell enabling a holistic understanding of how the industry is convergingor divergingon the path toward scalable Co-Packaged Optics" [X Link](https://x.com/semivision_tw/status/1923198010739040389) 2025-05-16T02:05Z [----] followers, [---] engagements "El Capitan Organization: Lawrence Livermore National Laboratory (LLNL) Country: United States Technology Providers: HPE (Cray) AMD Frontier Organization: Oak Ridge National Laboratory (ORNL) Country: United States Technology Providers: HPE (Cray) AMD" [X Link](https://x.com/semivision_tw/status/1923774046086238665) 2025-05-17T16:14Z [---] followers, [--] engagements "Aurora Organization: Argonne National Laboratory (ANL) Country: United States Technology Providers: HPE (Cray) Intel HPC5 Organization: Eni (Italian National Oil Company) Country: Italy Technology Providers: Dell Technologies" [X Link](https://x.com/semivision_tw/status/1923919243373920638) 2025-05-18T01:51Z [---] followers, [---] engagements "Automotive Supply Chain" [X Link](https://x.com/semivision_tw/status/1924049134312689841) 2025-05-18T10:27Z [---] followers, [---] engagements "🔴#SemiVision : Perspective on Semiconductor Industry Development Driven by #AI Application 📌Expert Talk on #NOMURA forum" [X Link](https://x.com/semivision_tw/status/1924296795972403443) 2025-05-19T02:51Z [---] followers, [---] engagements "✳Big news for Taiwans AI future. NVIDIA announces a strategic partnership with Foxconn TSMC and NSTC to build AI infrastructure in Taiwan. From chips to compute Taiwan is shaping up to be a global AI powerhouse. This collaboration represents not just technologybut national-scale ambition. #NVIDIA #TSMC #Foxconn #NSTC #AIInfrastructure #TaiwanAI #DataCenter" [X Link](https://x.com/semivision_tw/status/1924317093308268557) 2025-05-19T04:12Z [---] followers, [---] engagements "The adoption of photonic technology in future supercomputing systems is expected to advance gradually alongside ASIC design evolution. Today ASICs supporting [---] Gbps/lane and [---] Gbps/lane have already been developed. These designs leverage SerDes technology to support electrical connections within server cabinets and the proportion of active links in actual deployments continues to grow. However ASICs targeting [---] Gbps/lane are still under development and face significant challenges including very short electrical reach and rising SerDes power consumption" [X Link](https://x.com/semivision_tw/status/1924659631541952857) 2025-05-20T02:53Z [---] followers, [---] engagements "In the future switch ports may feature different personalities including standard Ethernet interfaces (such as those defined by the Ultra Ethernet Consortium UEC) proprietary fabric interconnects and high-performance optical interfaces based on CPO or CPC technologies. This flexible heterogeneous design enables switches to meet the diverse connectivity demands of different applications. By adopting this modular multi-technology integration future switches are expected to achieve ultra-high bandwidth low latency and manufacturabilitybalancing performance with practical deployment considerations" [X Link](https://x.com/semivision_tw/status/1924689850789204308) 2025-05-20T04:53Z [---] followers, [---] engagements "While photonic technologies show great potential in performance and energy efficiency their widespread deployment in mass production systems still faces significant manufacturing integration challenges. Today the most advanced switch ASICs are manufactured using TSMCs N3 or N2P process nodes meaning that any photonic solution must be compatible with these manufacturing flows and supply chains. This reality forces system designers to rely heavily on co-packaged optics (CPO) solutions provided by their existing silicon service providers significantly limiting technology choice and innovation" [X Link](https://x.com/semivision_tw/status/1925027083069149499) 2025-05-21T03:13Z [---] followers, [---] engagements "2025/05/21🌱⚡ TSMC Issues NT$14.1 Billion in Green Corporate Bonds to Support Sustainability Initiatives TSMC announced today the issuance of NT$14.1 billion (approx. US$440 million) in unsecured corporate bonds designated as green bonds. The funds will be allocated toward green buildings renewable energy usage and other environmentally friendly initiatives. The bond issuance consists of: ♻ NT$12.5 billion for a 5-year tranche (Type A) with a fixed annual interest rate of 1.92% ♻NT$1.6 billion for a 10-year tranche (Type B) with a fixed annual interest rate of 2.05% Hua Nan Securities will" [X Link](https://x.com/semivision_tw/status/1925187022110818706) 2025-05-21T13:48Z [---] followers, [---] engagements "The next generation of switch designs is trending toward multi-die packaging combined with direct liquid cooling while also integrating passive optical connections to the card edge. However this highly complex and costly architecture presents several critical challenges including: Yield Concerns: Can such designs be manufactured at acceptable production yields Supply Chain Readiness: Is the supply chain capable of supporting the high complexity of these packaging methods Serviceability: Can these designs offer practical maintenance over the systems operational lifecycle" [X Link](https://x.com/semivision_tw/status/1925549317118365731) 2025-05-22T13:48Z [---] followers, [--] engagements "#MediaTek at Computex We believe MediaTek will continue to gain market share in the smartphone segment. Notably we observed an accelerated adoption timeline for 2nm reflecting the companys strong confidence in its flagship products. In the Cloud AI space beyond MediaTeks ongoing #ASIC collaborations with CSPs we are optimistic about its partnership with Nvidia on NVLink Fusion and the potential opportunities in #AI ASIC" [X Link](https://x.com/semivision_tw/status/1925755999828291984) 2025-05-23T03:29Z [---] followers, [---] engagements "1.MediaTeks keynote centered on AI emphasizing the companys long-standing strengths in edge devices (smartphones Chromebooks IoT automotive) and its strategy to scale those capabilities into the cloud AI domain (supercomputers AI ASICs)" [X Link](https://x.com/semivision_tw/status/1925756069042626696) 2025-05-23T03:30Z [---] followers, [--] engagements "2. MediaTeks advantage lies in boosting performance while reducing power consumption. In the keynote the company announced that its 2nm chip will tape out in September this year offering a 15% performance increase and 25% power savings compared to N3" [X Link](https://x.com/semivision_tw/status/1925756292137726008) 2025-05-23T03:30Z [---] followers, [--] engagements "3. Through #NVLink IP and a chiplet architecture MediaTek and Nvidia are co-developing custom AI ASICs (NVLink Fusion) to deliver solutions with lower total cost of ownership (TCO) greater design flexibility and faster time-to-market for clients. The core NVLink technology enables both horizontal and vertical interconnects supporting scalable AI performance across domains" [X Link](https://x.com/semivision_tw/status/1925756562536087995) 2025-05-23T03:31Z [---] followers, [--] engagements "Beyond Computex: Qualcomms Expanding Role in AI Edge and Data Center Ecosystems https://open.substack.com/pub/tspasemiconductor/p/beyond-computex-qualcomms-expandingr=4hpdhj&utm_campaign=post&utm_medium=web&showWelcomeOnShare=false https://open.substack.com/pub/tspasemiconductor/p/beyond-computex-qualcomms-expandingr=4hpdhj&utm_campaign=post&utm_medium=web&showWelcomeOnShare=false" [X Link](https://x.com/semivision_tw/status/1926665983227318620) 2025-05-25T15:45Z [---] followers, [--] engagements "TSMC Arizona Base: A Strategic Manufacturing Hub Amid the U.S.-China Tech War As of April [----] TSMCs wafer fabrication complex in Phoenix Arizona has emerged as a focal point of the global semiconductor industry. With a total investment of $165 billion this expansion represents one of the largest foreign direct investments in U.S. history symbolizing TSMCs strategic shift in response to geopolitics technological sovereignty and supply chain restructuring" [X Link](https://x.com/semivision_tw/status/1926858434349043894) 2025-05-26T04:30Z [---] followers, [---] engagements "At Computex [----] Qualcomm showcased how its latest generation of products are enabling Edge AI applications while also revealing its strategic move into the data center markethighlighted by its vision to deliver CPU + AI: Building the Core of the Next-Gen Data Center Platform. This article will go beyond just reviewing Qualcomms Computex announcements. It will explore several broader questions surrounding Qualcomms roadmap and industry positioning" [X Link](https://x.com/semivision_tw/status/1927226553877864572) 2025-05-27T04:53Z [---] followers, [---] engagements "We begin with an overview of Qualcomms AI development journey focusing on how its Hexagon NPU (Neural Processing Unit) has evolved to support high-performance low-power AI inference at the edge. Well then turn to Xiaomis latest breakthroughthe launch of its first in-house flagship chip Xring O1and examine the dynamics of Qualcomm and Xiaomis strategic co-opetition where both collaboration and competition coexist" [X Link](https://x.com/semivision_tw/status/1927541115349029062) 2025-05-28T01:43Z [---] followers, [---] engagements "In addition well compare the current status of chip development across five major players: Qualcomm MediaTek Huawei Apple and Xiaomihighlighting their progress in process nodes chip portfolios and market focus. Finally well analyze Qualcomms forward-looking strategy for AI data centers and its motivation behind joining NVIDIAs NVLink Fusion initiative including the technological and ecosystem implications of this move" [X Link](https://x.com/semivision_tw/status/1927556737936077077) 2025-05-28T02:45Z [---] followers, [---] engagements "SemiVision believes that over the past decade both Qualcomm and Xiaomi have venturedsometimes boldly sometimes cautiouslyinto the path of chip self-design and platform integration. Now both companies stand once again at a pivotal turning point in their strategic evolution" [X Link](https://x.com/semivision_tw/status/1927563797109055660) 2025-05-28T03:13Z [---] followers, [---] engagements "Qualcomm for instance made an early attempt to enter the data center market around [----] forming a dedicated server CPU design team and launching its ARM-based Centriq processor lineup aiming to challenge Intels dominance. However due to market immaturity internal resource shifts and strategic recalibrations the project was eventually sold in [----] to Chinese venture HXT (Huaxintong Semiconductor)" [X Link](https://x.com/semivision_tw/status/1927587168060313687) 2025-05-28T04:46Z [---] followers, [---] engagements "This episode reminds us that Qualcomm never truly abandoned its data center ambitionsit was merely waiting for the right conditions to re-emerge. Now with official access to NVIDIAs NVLink Fusion technology Qualcomm is rebuilding its platform capabilities integrating CPUs and AI accelerators to re-enter the AI-centric data center market with renewed force and vision" [X Link](https://x.com/semivision_tw/status/1927752055046684700) 2025-05-28T15:41Z [---] followers, [---] engagements "Today MediaTek celebrates [--] years of innovation and growth. 🎉 For [--] years we've been powering over [--] billion devices annually and making technology accessible to all. This year's anniversary theme "Our Continuous Journey Together" honors the efforts of every MediaTeker and the milestones we've achieved as a team. The journey continues with sustainability at the core. Through initiatives like our Global Go Green in Action campaigns we're turning everyday actions into powerful change" [X Link](https://x.com/semivision_tw/status/1927752605117088139) 2025-05-28T15:43Z [---] followers, [---] engagements "MediaTek (MTK) founded in [----] began as a provider of optical disk drive controller chips. It later gained prominence through its wireless connectivity solutions and mobile system-on-chip (SoC) products. As the smartphone market matured MediaTek actively sought to diversify into new verticalssuch as automotive electronics the Internet of Things (IoT) and edge AIin an effort to reposition itself for the AI era. The following sections outline five key dimensions through which MediaTek has evolved from its original Wi-Fi and mobile SoC-centered business model into a company strategically aligned" [X Link](https://x.com/semivision_tw/status/1927760324033126656) 2025-05-28T16:14Z [---] followers, [---] engagements "Meanwhile Xiaomi is undergoing a profound transformationfrom a consumer electronics assembler to a hardcore tech company. Originally known for its MIUI operating system and fan-driven community ecosystem Xiaomi began with software gradually mastering hardware integration. Today with its smartphone leadership software maturity and robust IoT ecosystem in place CEO Lei Jun is steering the company toward the foundational capabilities of custom chip design and system-level architecture" [X Link](https://x.com/semivision_tw/status/1927918265210208760) 2025-05-29T02:41Z [---] followers, [---] engagements "🟩To gain a competitive edge against #NVIDIA #AMD has announced the acquisition of Enosemi a startup specializing in silicon photonics and the development of photonic integrated circuits (PICs) further strengthening its capabilities in co-packaged optics (CPO). AMD stated that the acquisition reinforces its position as a comprehensive AI solutions provider integrating its leading CPUs GPUs and programmable SoCs while also enhancing its expertise in networking software and system integration. Silicon photonics is regarded as a critical next step in computing technology and over the past year" [X Link](https://x.com/semivision_tw/status/1928094030770098654) 2025-05-29T14:20Z [---] followers, [---] engagements "In its early years #MediaTek s core business revolved around wireless connectivity chipssuch as Wi-Fiand mobile application processors. The company significantly strengthened its position in wireless technology through strategic moves like the acquisition of Ralink in [----]. In recent years it even secured Wi-Fi chip orders for #Apple TV underscoring its competitiveness in the connectivity space" [X Link](https://x.com/semivision_tw/status/1928130762018087373) 2025-05-29T16:46Z [---] followers, [---] engagements "On the mobile front MediaTeks Helio and #Dimensity #SoC series provided cost-effective and high-performance solutions for a wide range of smartphones earning the company a reputation as the King of Chinas Shanzhai phones during the early smartphone boom. However as growth in the mobile device market began to plateau MediaTek began redirecting its R&D efforts toward emerging sectors to sustain long-term momentum" [X Link](https://x.com/semivision_tw/status/1928267425532829704) 2025-05-30T01:49Z [---] followers, [---] engagements "IoT and Edge #AI: Building an Intelligent Connected Ecosystem As the Internet of Things (IoT) and smart devices gained traction MediaTek committed itself to developing AIoT platforms that integrate artificial intelligence into connected environments. In [----] the company launched its NeuroPilot AI platform which incorporates a dedicated AI Processing Unit (APU) and a complete software development kit within its smartphone SoCs. This platform was designed to enable on-device AI processing across a wide range of endpointsincluding #smartphones smart homes and even #autonomous vehicles" [X Link](https://x.com/semivision_tw/status/1928271459358478646) 2025-05-30T02:05Z [---] followers, [---] engagements "SemiVisions Recommendation As a long-term observer of semiconductor packaging photonic-electronic integration AI compute architectures and next-generation interconnect technologies SemiVision strongly recommends all readers researchers and industry professionals who are passionate about technology innovation to actively participate in the [----] ECTC" [X Link](https://x.com/semivision_tw/status/1929007540890722579) 2025-06-01T02:50Z [---] followers, [---] engagements "Welcome to join the [----] Advanced Packaging and Integration Technology Forum a premier gathering where the frontiers of semiconductor packaging photonics integration heterogeneous computing reliability engineering and thermal-mechanical design converge" [X Link](https://x.com/semivision_tw/status/1929013342011580908) 2025-06-01T03:13Z [---] followers, [---] engagements "ASE Semiconductor has announced the launch of its fan-out chip-on-substrate bridge technology with through-silicon vias (TSV) known as FOCoS-Bridge to drive the advancement of artificial intelligence (AI) and accelerate its profound impact on global life. The ASE FOCoS-Bridge leverages TSVs to enable shorter signal paths achieving higher I/O density and improved thermal performance to meet the growing demand for bandwidth. The integration of TSV technology further enhances the capabilities of ASEs VIPack FOCoS-Bridge platform providing critical energy efficiency at a time when demand for AI" [X Link](https://x.com/semivision_tw/status/1929136449812861169) 2025-06-01T11:22Z [---] followers, [----] engagements "We invite you to engage deeply with the thought leaders and innovators shaping the semiconductor industrys next decade where materials design process and system engineering unite to unlock performance scalability and sustainability in the era of data-centric computing" [X Link](https://x.com/semivision_tw/status/1929719915746902363) 2025-06-03T02:00Z [---] followers, [---] engagements "#SemiVision : Attended the [----] UK Semiconductor and Optoelectronics Technology Conference & Matchmaking today Had the chance to connect with several innovative #UK startups and gain insights into the UKs strong momentum in #semiconductor and #optoelectronic technology development. Impressed by the cutting-edge solutions and the collaborative spirit driving UKTaiwan partnerships forward UK in Taiwan" [X Link](https://x.com/semivision_tw/status/1930223690622611514) 2025-06-04T11:22Z [---] followers, [---] engagements "📊 #Semiconductor Fab Capacity Boom: The U.S. Leads the Charge According to SIA and BCG the U.S. is forecast to achieve the highest global growth in semiconductor fab capacity from [----] to [----] a staggering 203% increase. This marks a dramatic shift from the modest 11% growth seen from [----] to [----]. Notably China experienced explosive growth (365%) from [----] to [----] but is expected to normalize in the next decade. In contrast the U.S. is now accelerating backed by strategic policy moves like the CHIPS Act and reshoring incentives. ⛳The semiconductor race is no longer just about technology its" [X Link](https://x.com/semivision_tw/status/1930477450695454747) 2025-06-05T04:11Z [---] followers, [----] engagements "Where Systems Meet Devices: #VLSI & #DRC [----] The Complete Semiconductor Experience https://open.substack.com/pub/tspasemiconductor/p/where-systems-meet-devices-vlsi-andr=4hpdhj&utm_campaign=post&utm_medium=web&showWelcomeOnShare=false https://open.substack.com/pub/tspasemiconductor/p/where-systems-meet-devices-vlsi-andr=4hpdhj&utm_campaign=post&utm_medium=web&showWelcomeOnShare=false" [X Link](https://x.com/semivision_tw/status/1930827260099272953) 2025-06-06T03:21Z [---] followers, [---] engagements "What distinguishes #VLSI Symposium [----] is its unique blend of industry-driven content and collaborative learning. With world-class contributions from #IBM #AMD #TSMC SK hynix #NVIDIA #MediaTek #Samsung #Sony Lam Research #KIOXIA and many more the Symposium goes beyond technical exchangeit becomes a living garden of innovation where theory meets application and seeds of research mature into real-world impact" [X Link](https://x.com/semivision_tw/status/1931189156933173331) 2025-06-07T03:19Z [----] followers, [---] engagements "#SemiVision: While copper interconnects have driven decades of progress in semiconductor scaling their limitations are becoming increasingly pronounced: at advanced nodes. To maintain chip performance and reliability in the face of these constraints the industry must continue to innovate in materials science and process integrationideally without overhauling the entire BEOL infrastructure. These efforts are critical to enabling logic scaling beyond the 2nm node preserving the trajectory of Moores Law. ✅ Next-Generation Low-k Material: ALK (Advanced low k material)" [X Link](https://x.com/semivision_tw/status/1931275972411789459) 2025-06-07T09:04Z [---] followers, [---] engagements "✳ Acer Chairman and CEO Jason Chen Addresses Graduates at NYCU: Optimism Is a Competitive Advantage On the morning of June [--] Acer Chairman and CEO Jason Chen (Chen Jun-Sheng) was invited to deliver a commencement speech at National Yang Ming Chiao Tung University (NYCU). He shared that years ago TSMC founder Morris Chang wrote him a five-word piece of advice: Optimism is a competitive advantage. Chen passed on the same message to the graduates adding: When you face the sun the shadows fall behind you. But if you keep staring at the problems the shadows only grow longer. Keep facing the" [X Link](https://x.com/semivision_tw/status/1931335508631998801) 2025-06-07T13:00Z [----] followers, [---] engagements "The emergence of Silicon Photonics is reshaping AI chip architectures. One of the most discussed topics is how to integrate Silicon Photonics into Optical I/O (OIO) systems particularly by embedding optical engines directly onto the interposer. We have already seen TSMC outline a roadmap in this direction mainly driven by considerations for NVIDIAs future needs" [X Link](https://x.com/semivision_tw/status/1931529428690952492) 2025-06-08T01:51Z [---] followers, [---] engagements "📊 SEMIs latest data shows global semiconductor equipment billings rose 21% YoY in Q1 [----]. China leads by a wide margin followed by Korea Taiwan and North America. Meanwhile Europe still lags significantly behind. 🌍 The message is clear: the world doesnt wait. If the EU aims to hit its [----] chip market share goals investment in equipment must come first" [X Link](https://x.com/semivision_tw/status/1931667053758578964) 2025-06-08T10:58Z [---] followers, [---] engagements "Intels development of silicon photonics represents over two decades of dedicated innovation and progress gradually paving the way for a new era of electro-optical convergence in high-performance computing and data centers. Since [----] Intel has been investing in silicon photonics research tackling the inherent challenge that silicon cannot emit light on its own. By leveraging heterogeneous integration technologies Intel successfully incorporated high-performance III-V materials (such as InP) into silicon chips enabling the creation of hybrid silicon lasers. In [----] the company demonstrated" [X Link](https://x.com/semivision_tw/status/1931808012055773614) 2025-06-08T20:18Z [---] followers, [---] engagements "🌈SemiVision : At #ECTC [----] Sumitomo Electric presented a groundbreaking paper titled Flip-Chip Photonic-Electronic Integration Platform for Co-Packaged Optics using a #Glass Substrate with Vertically-Coupled Beam Expanding Lens. This work introduces an innovative #CPO (Co-Packaged Optics) integration platform that combines a glass substrate with 3D-printed Vertically-Coupled Beam Expanding Lenses (#VCBELs)offering a novel solution to the long-standing alignment and packaging challenges in photonic-electronic co-integration. 📙Read more: https://lnkd.in/g_2UfkHj https://lnkd.in/g_2UfkHj" [X Link](https://x.com/semivision_tw/status/1932248183939424648) 2025-06-10T01:27Z [---] followers, [---] engagements "#Qualcomm Doubles Down on AI with $2.4B #Alphawave Semi Acquisition Key Point 1: Qualcomm is acquiring UK-based IP company Alphawave for $2.4 billion in cash aiming to strengthen its foothold in AI and data centers while reducing reliance on the smartphone market. Key Point 2: The deal includes a 96% premium signaling Qualcomms strong commitment to AI. Alphawaves board has unanimously recommended the offer with support from around half of its shareholders. Key Point 3: Despite recent operational challenges Alphawave has seen growing demand for its high-speed connectivity IP among North" [X Link](https://x.com/semivision_tw/status/1932619247047618937) 2025-06-11T02:01Z [---] followers, [---] engagements "🌈SemiVision : Intel Corporation - Breakthrough Heterogeneous Integration: EMIB + Modular Optical I/O Chiplets #EMIB enables short-reach high-density electro-optical signaling by embedding silicon bridges into the package substrate. This architecture supports: Central XPU dies co-packaged with multiple edge-hanging Optical I/O (#OIO) dies in 2/4/6-die scalable configurations Precise coupling of optical fiber array units (#FAU) using V-groove alignment allowing flexible modular bandwidth provisioning 📙Read more:" [X Link](https://x.com/semivision_tw/status/1932677079075783073) 2025-06-11T05:51Z [----] followers, [---] engagements "Kumamoto Rising: Taiwan-Japan Synergy in the Next #Semiconductor Frontier https://open.substack.com/pub/tspasemiconductor/p/kumamoto-rising-taiwan-japan-synergyr=4hpdhj&utm_campaign=post&utm_medium=web&showWelcomeOnShare=false https://open.substack.com/pub/tspasemiconductor/p/kumamoto-rising-taiwan-japan-synergyr=4hpdhj&utm_campaign=post&utm_medium=web&showWelcomeOnShare=false" [X Link](https://x.com/semivision_tw/status/1932798388241924322) 2025-06-11T13:53Z [---] followers, [---] engagements "🌈 #SemiVision: Broadcoms Co-Packaged Optics (#CPO) platform leverages advanced silicon #photonics to meet the massive bandwidth and power efficiency demands of #AI infrastructure. Designed for scalability it delivers unmatched performance and cost-per-bit and is available across Broadcoms Ethernet switches and XPUs" [X Link](https://x.com/semivision_tw/status/1933008354785571121) 2025-06-12T03:47Z [---] followers, [---] engagements "🔴 SemiVision: On June [--] TSMC and the The University of Tokyo announced the launch of the TSMC-UTokyo Lab a joint initiative to advance research education and talent development in cutting-edge semiconductor technologies. As TSMCs first collaborative laboratory with an overseas university the lab will draw upon the world-leading expertise experience and creativity of both institutions. Through this partnership the University of Tokyo will not only deepen its research capabilities but also provide a comprehensive infrastructure for advanced semiconductor design education and applied" [X Link](https://x.com/semivision_tw/status/1933033723991372049) 2025-06-12T05:28Z [---] followers, [---] engagements "Nikon and Canon primarily focus on the mid- to low-end segments of the market. Although both are long-established players in the industry with early-mover advantages ASML eventually surpassed them by capitalizing on the opportunity presented by immersion lithography. When the industry faced the challenge of breaking through the limitations of the [---] nm wavelength both the scientific and industrial communities were seeking new solutions. It was through close collaboration with #TSMC that ASML first developed a [---] nm immersion lithography machinethree years ahead of Nikon. This breakthrough" [X Link](https://x.com/semivision_tw/status/1933373786012987863) 2025-06-13T04:00Z [---] followers, [---] engagements "🟢NVLink vs. Avicena LightBundle: From High-Speed Electrical to the Future of #Optical Interconnects SemiVision : NVLink is #NVIDIA s proprietary high-speed electrical interconnect designed to meet the bandwidth and latency requirements of GPU-to-GPU communication. Since Pascal and through to Hopper #NVLink has evolved to enhance data sharing and cooperative computing among GPUs. #Avicena Tech s LightBundle by contrast is a parallel optical interconnect platform engineered specifically for chiplet-to-chiplet communication. It addresses fundamental bottlenecks including I/O stagnation high" [X Link](https://x.com/semivision_tw/status/1934095943554768970) 2025-06-15T03:49Z [---] followers, [---] engagements "📚 #SemiVision: The #semiconductor industry today stands at the brink of a technological explosion from #AI chips and #photonic integration to advanced packaging and atomic-level processes every innovation is reshaping the competitive landscape of the global supply chain. This is an extremely highly integrated industry where no single company can independently cover the entire spectrum from materials design manufacturing and packaging to testing. Only through continuous learning and active participation in global technical dialogues can we find our place in an increasingly turbulent future." [X Link](https://x.com/semivision_tw/status/1934516384815583350) 2025-06-16T07:40Z [---] followers, [---] engagements "Blog: "Addressing Stress In Heterogeneous 3D-IC Designs" By Shetha Nolke #Siemens The benefits of 3D #IC architectures are well-documented smaller footprints lower power and increased performance. However the move to heterogeneous #3D designs also introduces a host of new challenges that must be carefully navigated" [X Link](https://x.com/semivision_tw/status/1934957327809171851) 2025-06-17T12:52Z [---] followers, [----] engagements "🌈#SemiVision team will be attending Laser World of #Photonics If you have a booth at the event feel free to drop a comment below or message us wed love to stop by and connect. 🔍If youre working on a unique or cutting-edge #technology were especially excited to hear your story and explore potential coverage or collaboration. Lets meet" [X Link](https://x.com/semivision_tw/status/1934987271952089119) 2025-06-17T14:51Z [---] followers, [---] engagements "🏗Fiercer #HBM3E Competition: #Micron Technology Secures Major Orders from #AMD and #NVIDIA Emerging as a Key Rival to #SKhynix SemiVision : The battle for high-bandwidth memory (#HBM) in #AI servers has entered the HBM3E era and the competition is intensifying. The dominance once held solely by SK Hynix is now being challengednot by #Samsung but by Micron. Following its win with Nvidia Micron has now announced that its 12-high 36GB HBM3E has been selected for AMDs MI350 series. This marks a significant milestone in Microns HBM strategy and signals its emergence as a formidable player in the" [X Link](https://x.com/semivision_tw/status/1935130084274585985) 2025-06-18T00:18Z [---] followers, [---] engagements "As generative #AI pushes the boundaries of data scale and model complexity next-generation system architectures must address unprecedented demands for bandwidth energy efficiency and interconnect scalability. Industry leaders like #NVIDIA are actively re-architecting AI superchip systems with the Feynman architecture serving as a prime example of this evolutiondesigned to support ultra-high-density low-power interconnects for XPU-to-XPU and Switch-to-XPU communication. In this context #TSMCs #COUPE (Compact Universal Photonic Engine) platform emerges as a foundational technology enabling" [X Link](https://x.com/semivision_tw/status/1935166906840846469) 2025-06-18T02:45Z [---] followers, [---] engagements "#TSMC #Avicena: A Strategic Alliance Shaping the Future of #Optical Interconnects Beyond Display As generative #AI and high-performance computing (#HPC) drive exponential demand for bandwidth and energy efficiency in chip-to-chip communication traditional copper interconnects are approaching their physical limits. These legacy interconnects can no longer meet the growing needs for low latency high density and ultra-low power in next-generation system architectures" [X Link](https://x.com/semivision_tw/status/1935173936133620221) 2025-06-18T03:13Z [---] followers, [---] engagements "Great to attend John Laus lecture on co-packaged optics and 3D heterogeneous integration. Learned a lot from his insights and deep industry experience 👏 #Photonics #3DIntegration #CoPackagedOptics #Semiconductor #SemiVision" [X Link](https://x.com/semivision_tw/status/1935188599701651739) 2025-06-18T04:11Z [---] followers, [---] engagements "Taiwans Momentum in C2C Optical Interconnects: Industry and Academia Unite Taiwan is rapidly emerging as a critical hub in the evolution of chip-to-chip (#C2C) optical interconnects driven by dynamic collaborations between academia and industry: #Foxconn Research Institute () has partnered with National Taiwan University and King Abdullah University of Science and Technology (KAUST) to present breakthrough multi-wavelength# LED technology at #CLEO [----]. This achievement enabling high-speed visible-light chip-to-chip communication marks a significant advance toward commercial optical" [X Link](https://x.com/semivision_tw/status/1935370231414730772) 2025-06-18T16:13Z [---] followers, [---] engagements "Leading academic groups including Prof. Ho-Chung Kuo (#) from National Yang Ming Chiao Tung University have published extensively on #GaN #LEDs and their integration with silicon photonicshighlighting Taiwans deep bench in fundamental and applied R&D" [X Link](https://x.com/semivision_tw/status/1935528243118866591) 2025-06-19T02:41Z [----] followers, [---] engagements "In the rapidly evolving landscape of Taiwans semiconductor and optoelectronic industries Professor Jui-Hwa Hung stands as a pivotal figure. Currently serving as a Chair Professor at the Institute of Electronics National Yang Ming Chiao Tung University (#NYCU) Professor Hung has long dedicated her research to epitaxial thin-film transfer wide bandgap #semiconductor device engineering and micro-scale optoelectronic integration. Her contributions have helped lay the foundation for #Taiwans advancement in high-frequency high-temperature and high-efficiency device technologies" [X Link](https://x.com/semivision_tw/status/1935545635375104144) 2025-06-19T03:50Z [----] followers, [---] engagements "🟢#SemiVision : Were attending the Taiwan Semiconductor Development Forum Amid Global Shifts today at National Yang Ming Chiao Tung University. Topics include AI innovation silicon photonics and compound semiconductors all key to the future of the industry. #Semiconductor #AI #Photonics #Taiwan #NYCU #IndustryForum" [X Link](https://x.com/semivision_tw/status/1935584401464889624) 2025-06-19T06:24Z [----] followers, [---] engagements "🔹2000s: Pluggable Transceivers Optical modules were placed at the edge of the PCB requiring signals to travel over long copper traces between the switch ASIC and the optics. This resulted in high power consumption and significant latency making it increasingly unsustainable for next-generation data center demands" [X Link](https://x.com/semivision_tw/status/1935643963077308585) 2025-06-19T10:20Z [----] followers, [---] engagements "🔹2020: Near-Package Optics (#NPO) NPO brought optical engines even closer to the switch ASIC often connecting them via an interposer. While this approach offered shorter signal paths and better performance it also introduced higher cost and increased integration complexity limiting large-scale adoption" [X Link](https://x.com/semivision_tw/status/1935644184746295508) 2025-06-19T10:21Z [----] followers, [--] engagements "Innovation in Wide Bandgap #Semiconductor Research Amid the global transition from Si and GaN to ultra-wide bandgap materials like -GaO Professor Hung has been at the forefront of this movement in Taiwan. Her research team has achieved significant breakthroughs in integrating -GaO on silicon and sapphire substrates addressing key challenges in heteroepitaxy and high-voltage device architecture. Her work has been recognized with prestigious awards including the Ministry of Science and Technologys Outstanding Research Award" [X Link](https://x.com/semivision_tw/status/1935740928666354125) 2025-06-19T16:46Z [---] followers, [---] engagements "Austin is quickly becoming a real-world AV sandbox where legacy automakers tech startups and AI pioneers converge to test the future of urban mobility. Current AV operators in Austin. https://t.co/xj8fuoujK7 Current AV operators in Austin. https://t.co/xj8fuoujK7" [X Link](https://x.com/semivision_tw/status/1935861952036979067) 2025-06-20T00:47Z [---] followers, [---] engagements "Central to #ASEs next chapter of innovation is photonic integration. As #AI workloads data centers and high-performance computing demand ever-increasing bandwidth and lower latency the limitations of traditional electrical interconnects become apparent. ASE recognizes that photonics is not just a complementary technology but a critical enabler of next-generation HI systems. With investments in silicon photonics packaging optical engine co-packaging and wafer-level photonic assembly technologies ASE is laying the groundwork for an era where #lightnot just copperdrives performance" [X Link](https://x.com/semivision_tw/status/1936457664302662032) 2025-06-21T16:14Z [---] followers, [---] engagements "#ASE a global leader in semiconductor packaging is actively steering the industry into a new era of heterogeneous integration (HI)a paradigm where logic memory RF and now photonics converge within advanced packaging ecosystems. In this transformation photonic integration is no longer a niche or experimental fieldit is becoming a foundational technology for achieving the ultra-high bandwidth low latency and energy efficiency required by next-generation #AI and #HPC workloads" [X Link](https://x.com/semivision_tw/status/1936633839532589362) 2025-06-22T03:54Z [---] followers, [---] engagements "🔮SoftBanks Masayoshi Son proposes Project Crystal Land a $1 Trillion AI Robotics Hub in the U.S. SemiVision : SoftBank is reportedly planning an industrial mega-project in Arizona aiming to create an American version of Shenzhen. The initiative codenamed Project Crystal Land would focus on building AI-powered industrial robots and advanced tech infrastructure. Key highlights: 🔺Estimated cost: $1 trillion 🔺Location: Arizona 🔺Focus: AI robotics smart manufacturing 🔺Seeking partners: #TSMC #Samsung Semiconductor 🔺Engaged in early talks with Trump-aligned officials for tax incentives This" [X Link](https://x.com/semivision_tw/status/1936667523010695669) 2025-06-22T06:08Z [---] followers, [---] engagements "Having chaired the #SEMICON Taiwan PKG & TEST Committee since [----] and co-chaired since [----] Dr. Hung has been instrumental in aligning ASEs roadmap with international packaging trends. His panel discussion reflects ASEs strategic commitment to not only keep pace with the industrys demandsbut to shape them through innovation and collaborative leadership" [X Link](https://x.com/semivision_tw/status/1936950117933703168) 2025-06-23T00:51Z [---] followers, [---] engagements "✅Advanced #Semiconductor Packaging 2025-2035: Forecasts Technologies Applications Source: IDTechEx" [X Link](https://x.com/semivision_tw/status/1937033651545669956) 2025-06-23T06:23Z [---] followers, [---] engagements "🟢JX Advanced Metals Corporation together with its subsidiary Toho Titanium Co. Ltd. has brought its newly installed capacity for next-generation #semiconductor CVD/ALD materials online and is now running at full scale" [X Link](https://x.com/semivision_tw/status/1937140067782250519) 2025-06-23T13:25Z [---] followers, [---] engagements "🔴Counterpoint Research Teardown: Xiaomi 15S Pro and the XRING O1 SoC Recent analysis by Counterpoint Research reveals the impressive chip-level architecture behind the #Xiaomi 15S Pro powered by Xiaomis self-developed XRING O1 flagship SoC. Featuring a multi-rail power design and built on a 3rd-gen 3nm process the XRING O1 integrates a 10-core CPU (dual Cortex-X925 @ 3.9GHz) a 16-core Immortalis-G925 GPU and a 6-core NPUpacking [--] billion transistors and scoring over [--] million points on AnTuTu placing it firmly in the top performance tier. Key Hardware Highlights: Memory: #SKhynix LPDDR5T" [X Link](https://x.com/semivision_tw/status/1937756314228129818) 2025-06-25T06:14Z [---] followers, [---] engagements "🌈Ultra-High-Speed Low-Power VCSEL Breakthrough from NCU Powering the AI Revolution SemiVision : As #AI technology rapidly advances achieving low power consumption in high-speed data transmission has become a critical challenge. Now a research team led by Prof. Hsu Tzu-Chieh at National Central University (#NCU) with support from Taiwans NSTC has developed a next-generation single-mode ultra-fast low-power #VCSEL light source By combining single-mode VCSELs with single-mode optical fiberswithout the need for complex signal processingthe team has overcome the performance bottlenecks of" [X Link](https://x.com/semivision_tw/status/1937811220716724242) 2025-06-25T09:52Z [---] followers, [---] engagements "🚀Dell Technologies Accelerates AI Server Momentum Toward $15B Goal SemiVision : Dell Technologies is rapidly scaling its #AI server business from nearly $0 in 1H24 to a projected $15B+ in shipments by FY26E reflecting a YoY growth rate exceeding 50%. In Q2 alone #Dell secured $1.21B in new AI server orders bringing its cumulative bookings to $14.4B. The demand remains strong across AI infrastructure especially from Tier [--] CSPs enterprises and Neocloud providers. The AI server pipeline continues to expand in both size and diversity now estimated at 5x the booking volume with broad coverage" [X Link](https://x.com/semivision_tw/status/1937879508238877057) 2025-06-25T14:24Z [---] followers, [----] engagements "📚 From Packaging to Platform: #ECTC and #IEDM Lead the Era of System-Level Integration #SemiVision: As the global electronics industry moves into a new wave driven by #AI and high-performance computing (#HPC) advanced packaging technologies are quietly becoming the foundational pillars that support the compute infrastructure of the future. From accelerating inference of large language models (#LLMs) to meeting the data centers growing demand for low-power high-speed transmission this transformation is no longer about isolated innovationit is a full-scalesystem-level integration race. 📙 Read" [X Link](https://x.com/semivision_tw/status/1938260467354370368) 2025-06-26T15:38Z [---] followers, [---] engagements "🟧#SemiVision : At the [----] #IEEE #VLSI Symposium a pivotal panel presentation led by MediaTek clearly outlined the companys comprehensive strategy across four key axes: #AI #ASIC design intelligent edge automotive platforms and #CPO (co-packaged optics) interconnects. This presentation was more than just a roadmap of how a company expands beyond a single application domain to become a leader in custom AI chipsit also reflects the broader redefinition of East Asias IC design ecosystem within the global restructuring of AI computing infrastructure." [X Link](https://x.com/semivision_tw/status/1938867256559128963) 2025-06-28T07:49Z [---] followers, [---] engagements "📊 SEMI 300mm Fab Outlook: Advanced Nodes Driving Capacity Growth According to #SEMI s latest 300mm Fab Outlook report (2Q [----] update) global semiconductor manufacturing capacity is set to maintain strong growth momentum through [----]. Monthly capacity for 7nm nodes is projected to grow from [------] wafers in [----] to [---] million wafers by [----] representing a 14% CAGRtwice the industry average. The chart shows a significant divergence in growth trajectories: 🔴 Advanced nodes (7nm) outpacing 🟢 Mature nodes (7nm) which grow modestly at 68% annually. As #AI #HPC and next-gen mobile applications" [X Link](https://x.com/semivision_tw/status/1938938834684665883) 2025-06-28T12:33Z [---] followers, [---] engagements "#MediaTek is aggressively expanding into the automotive chip market and deepening its collaboration with #NVIDIA. Ephrem Chemaly General Manager and Vice President of MediaTeks Automotive Business Unit is optimistic about the potential of the automotive AI market predicting that cars will evolve from mere transportation tools into digital living rooms. Industry sources point out that the Dimensity Auto Cockpit platform is expected to enter mass production in [----]. The AI acoustic front-end technology developed by #Intelligo has already been integrated into MediaTeks smart cockpit platform" [X Link](https://x.com/semivision_tw/status/1938941977157894486) 2025-06-28T12:46Z [---] followers, [---] engagements "📊 When Trumps signature looks exactly like the VIX chart Is it a coincidence or is market chaos just his vibe Volatility spikes signatures spike [----] might be in for a wild ride. Stay hedged 😅" [X Link](https://x.com/semivision_tw/status/1938944232481591770) 2025-06-28T12:55Z [---] followers, [---] engagements "🌍 Global Power Demand is Shifting Fast Are We Ready According to the International Energy Agency (IEA) electricity demand worldwide is projected to surge by [----] with data centers and air conditioning driving a major portion of that growth. As this chart shows: 🟥 Data centers and 🟩 cooling systems will account for some of the fastest-growing segments of energy consumption.🟧 Electric vehicles 🟦 desalination and other emerging sectors are also rising fast. Traditional sectors like ⚫ heavy industry still dominate but the balance is clearly shifting. This underscores a key challenge: AI" [X Link](https://x.com/semivision_tw/status/1939192298996154602) 2025-06-29T05:20Z [---] followers, [---] engagements "🟩SemiVision : As artificial intelligence (AI) and high-performance computing (HPC) advance at breakneck speed chip packaging is evolving toward unprecedented scale and complexity. Packaging modules have expanded rapidly from the 75mm class to over 120mm with layer counts exceeding [--]. This not only signifies greater computational density but also brings more severe manufacturing challenges and yield pressures. In this wave of packaging evolution the role of build-up substrates has become increasingly criticalespecially within 2.5D heterogeneous integration platforms like TSMC s CoWoS. As the" [X Link](https://x.com/semivision_tw/status/1939380348879786392) 2025-06-29T17:48Z [---] followers, [---] engagements "From #CPO to #CIO Building on CPO #NVIDIA is advancing to a Co-Integrated Optics (CIO) architecture in which optical modules are co-packaged directly with the logic die via the interposeralso referred to as Optical I/O (OIO) in a 2.5D integration context. Using TSMCs COUPE platform and 3D-stacked EIC/PIC integration this architecture delivers over [--] Tbps/mm bandwidth density with scalability up to [--] Tbps/mm in future iterations. https://open.substack.com/pub/tspasemiconductor/p/nvidia-integrating-photonic-in-hpcr=4hpdhj&utm_medium=ios" [X Link](https://x.com/semivision_tw/status/1939543575315857774) 2025-06-30T04:36Z [---] followers, [---] engagements "In an interview aired on June [--] on Fox News Sunday Morning Futures former President #Trump stated that the 90-day grace period for reciprocal tariffs will expire on July [--] and for the vast majority of countries it will not be extended. Trump said that once the deadline is reached the tariff negotiations will conclude and the U.S. government will inform other nations of the trade penalties that will be imposedunless they have already reached an agreement with the United States" [X Link](https://x.com/semivision_tw/status/1939642250146767174) 2025-06-30T11:08Z [---] followers, [---] engagements "As the wave of generative #AI sweeps across the globe the demand it brings is no longer just about stacking #GPUs in the cloud. Rather it signifies a structural reshaping of the computing architecturefrom a traditional "#SoC mindset" to one centered on "system integration and heterogeneous collaboration." Once known primarily for its focus on mobile communications and mid-tier SoCs MediaTek is now undergoing a platform-level transformation across chip design heterogeneous packaging photonic interconnects and edge AI in the era of #AI innovation" [X Link](https://x.com/semivision_tw/status/1940224709666164879) 2025-07-02T01:43Z [---] followers, [---] engagements "Through a comprehensive RTL-in to GDSII-in design service flow #MediaTek has successfully transformed into an ASIC company equipped with four key integrated capabilities: high-efficiency design flexible process support diverse packaging and high-speed interconnects" [X Link](https://x.com/semivision_tw/status/1940270798079504547) 2025-07-02T04:46Z [---] followers, [---] engagements "Japans government-backed chip foundry Rapidus is pushing ahead with its ambitious goal to mass-produce 2nm chips by [----]. To fund this next phase Rapidus has reportedly asked Fujifilm a key player in semiconductor materials to invest in the company. According to Kyodo News #Rapidus is calling on semiconductor-related firms including #Fujifilm to become shareholders aiming to build an industry-wide support system for mass production. The company is also expected to brief its partners on the 2nm pilot production progress on July 18" [X Link](https://x.com/semivision_tw/status/1940346953478606993) 2025-07-02T09:48Z [---] followers, [---] engagements "During its presentation at #VLSI [----] MediaTek revealedfor the first timeits full-scale strategy for custom AI chip development. By leveraging its in-house development of advanced #SerDes (112G / 224G) #SoC design optimized for STCO/DTCO leading-edge process technologies (such as 3nm and #TSMC N2) and advanced packaging approaches (like CPO and CPC) MediaTek is enhancing its #PPA (Performance Power Area) advantages. These capabilities not only serve its mobile platform customers but also directly support hyperscalers in developing next-generation #AI superchips" [X Link](https://x.com/semivision_tw/status/1940443660790677596) 2025-07-02T16:13Z [----] followers, [---] engagements "📢 #Siemens Resumes Software Supply to China After U.S. Lifts Export Restrictions Siemens AG announced that it has received official notification from the U.S. government lifting export controls on semiconductor design software to mainland China. In a press release Siemens confirmed that it has resumed full software and technology deliveries to its Chinese clients. This follows a temporary restriction earlier this year when the U.S. Commerce Departments Bureau of Industry and Security (#BIS) instructed major #EDA vendors in May to halt shipments to Chinese customers. #Semiconductor #ChipAct" [X Link](https://x.com/semivision_tw/status/1940597957340156420) 2025-07-03T02:26Z [----] followers, [---] engagements "MediaTek stated that its #AI ASIC designs have already secured multiple design wins with plans to contribute substantial revenue starting in [----] targeting over USD $1 billion in annual revenue. Some of these customers are rumored to include U.S. tech giants such as Google (potentially related to TPU projects) while others are believed to be connected to #NVIDIAs #NVLink integration effortsa clear indication that #MediaTek is carving out a new strategic position in the cloud AI domain" [X Link](https://x.com/semivision_tw/status/1940601677284769849) 2025-07-03T02:41Z [---] followers, [---] engagements "Industry observers note that TSMCs strategic exit reflects intense pricing pressure from Chinese competitors in the compound semiconductor space. Despite customer demand TSMC chose not to engage in price wars especially given the relatively small scale and limited profitability of GaN production" [X Link](https://x.com/semivision_tw/status/1940610620069658908) 2025-07-03T03:16Z [---] followers, [---] engagements "Co-Developing the Future of AI Infrastructure Modules with #NVIDIA Notably #MediaTeks collaboration with NVIDIA has expanded from in-vehicle cockpit platforms to data center modules. Together the two companies have co-developed the #GB10 #AI module featuring over [----] TOPS of AI computing power. Designed to support training for large language models with up to [---] billion parameters the GB10 serves as a prototype foundation for personal-scale AI supercomputers. The launch of this module marks a significant shift in MediaTeks rolefrom a terminal SoC supplier to a comprehensive AI solutions" [X Link](https://x.com/semivision_tw/status/1940619062431658184) 2025-07-03T03:50Z [---] followers, [---] engagements "The GB10 integrates a MediaTek-led xPU #AI processor utilizing multi-die modular packaging and supports MCP (Memory-Compute Proximity) as well as A2A (Agent-to-Agent) architectures. This enables the module to handle not only AI inference but also lightweight training and multi-agent collaborative computing positioning it as a critical compute node in the emerging Smart Edge ecosystem" [X Link](https://x.com/semivision_tw/status/1940800790605545824) 2025-07-03T15:52Z [---] followers, [---] engagements "According to public information #MediaTek is also working with NVIDIA to advance the NVLink Fusion architecture. Fusion represents a GPU-centric chip design philosophy allowing third-party #ASICs or SoCs to connect to #NVIDIA GPUs and CPUs via standardized high-speed interfaces. As one of the initial partners in NVLink Fusion MediaTek is not merely an IP integrator but also a co-architect of cross-die computing frameworks. This strategic alliance lays the groundwork for MediaTek to further participate in next-generation projectssuch as #LLM training clusters and potential #AI H100 successors" [X Link](https://x.com/semivision_tw/status/1940814349339144689) 2025-07-03T16:46Z [---] followers, [---] engagements "Strategic Deployment of #Edge Intelligence and #AI Agents Another key focus area for #MediaTek is the widespread adoption of edge AI platforms using its mobile device expertise as a bridge. Between [----] and [----] MediaTek plans to roll out a new generation of SoCs across Chromebooks IoT devices smart tablets TVs and wearables. These SoCs are built on advanced 3nm process technology and feature NPUs capable of delivering over [--] TOPS. They support multimodal tasks such as voice assistants image generation and behavioral reasoning while enabling low-power consumption localized learning and" [X Link](https://x.com/semivision_tw/status/1940950985343381870) 2025-07-04T01:49Z [---] followers, [---] engagements "🤝 HPE Completes Acquisition of Juniper Networks Hewlett Packard Enterprise has officially acquired Juniper Networks a leading AI-native networking solutions provider. This strategic move positions HPE to capitalize on the fast-growing AI and hybrid cloud markets by delivering a cloud-native AI-driven IT portfolio including a fully modernized networking stack. #HPE #JuniperNetworks #AINetworking #HybridCloud #AI #NetworkSolutions" [X Link](https://x.com/semivision_tw/status/1941007173007691789) 2025-07-04T05:32Z [----] followers, [---] engagements "Super Mario Bros teaches us an important psychological truth: Even if two things are physically identical they can feel completely different depending on context" [X Link](https://x.com/semivision_tw/status/1941013977485791477) 2025-07-04T05:59Z [---] followers, [---] engagements "🤩 Excited to see #RANOVUS Inc. featuring our SemiVision silicon photonics supply chain image in their presentation slide at the [----] OCP Canada Tech Day Its an honor for us Connecting the semiconductor supply chain has been the mission of SemiVision since day one and we aim to serve as a bridge linking Taiwan to the global community. #SemiVision #OCP #TechDay #Semiconductor #SiliconPhotonics #Taiwan" [X Link](https://x.com/semivision_tw/status/1941162651746517465) 2025-07-04T15:50Z [---] followers, [---] engagements "From Process-Driven to System-Driven: The Path Forward for CMOS Technology in the ngstrm Era As CMOS technology enters the #ngstrm era the traditional advantages of dimensional scaling are rapidly diminishing. In his keynote at #VLSI [----] Samsungs Vice President Keunhwi Cho presented a clear trajectory: the future of #CMOS will not be defined solely by smaller nodes but by multi-level system-driven innovations across materials architecture packaging and integration" [X Link](https://x.com/semivision_tw/status/1941314369612128564) 2025-07-05T01:53Z [---] followers, [---] engagements "Backside Power Delivery (#BSPDN): Overcoming Power Integrity Bottlenecks With increasing power densities and the rise of 3D stacked architectures conventional front-side power delivery networks (FSPDN) face serious limitations in IR drop and signal interference. Backside Power Delivery offers a transformative solution. By routing power through backside vias (#TSVs BCs or VBPR structures) BSPDN minimizes resistance and inductance improves power efficiency and decouples power and signal paths. Companies like TSMC and Samsung are co-optimizing BSPDN alongside #GAA to enhance voltage stability in" [X Link](https://x.com/semivision_tw/status/1941319697783279635) 2025-07-05T02:14Z [---] followers, [---] engagements "2. Heterogeneous Integration: Toward Modular Functionally Specialized Systems #Heterogeneous integration is becoming the cornerstone of post-Moore innovation. Instead of a monolithic SoC system architects are embracing #chiplets logic-memory fusion and sensor integrationeach fabricated on the most suitable node. Samsungs roadmap includes #GAA-based logic co-packaged with MRAM image sensors and HBM through 2.5D and 3D #packaging enabling modular SoC platforms with high bandwidth low latency and domain-specific performance tuning" [X Link](https://x.com/semivision_tw/status/1941336006835273951) 2025-07-05T03:19Z [---] followers, [---] engagements "🔋No other industry would be allowed this kind of behavior. Hitachi Energy Energy CEO Andreas Schierenbeck warns that AIs explosive power consumption must be regulated. In an interview with the Financial Times he cautions that the sudden electricity spikes from AI model training combined with volatile renewable supply are making it harder than ever to keep the lights on. As AI scales grid stability may become a national priority. #AI #EnergyCrisis #DataCenters #HitachiEnergy #PowerInfrastructure #NVIDIA" [X Link](https://x.com/semivision_tw/status/1941370516167852172) 2025-07-05T05:36Z [---] followers, [---] engagements "Beyond ScalingThe Era of System-Level Co-Optimization The ngstrm era demands more than transistor miniaturization. From backside power delivery and heterogeneous #chiplet design to #3D stacking and photonic interconnects the future of CMOS will be defined by system-level co-optimization. As Cho noted the real breakthroughs will come not from narrower gate lengths alone but from cross-domain collaborationspanning devices interconnects packaging and architecture. This is how #CMOS will continue to evolve beyond #Moores Law." [X Link](https://x.com/semivision_tw/status/1941676271856984232) 2025-07-06T01:51Z [---] followers, [---] engagements "Big typhoon is coming" [X Link](https://x.com/semivision_tw/status/1941811460331741456) 2025-07-06T10:48Z [---] followers, [---] engagements "Chinas aircraft carrier Shandong docked in Hong Kong" [X Link](https://x.com/semivision_tw/status/1942049337816858769) 2025-07-07T02:33Z [---] followers, [---] engagements "🚀 NVIDIA & Microsoft Are Marching Toward a $4 Trillion Valuation Fueled by the AI revolution NVIDIA and Microsoft are now approaching the $4 trillion market cap milestone currently valued at $3.89T and $3.71T respectively. While both tech giants are driving the AI boom their investment focus differs: 🟢#NVIDIA dominates in core #AI infrastructure and hardware. 🔴Microsoft leads in application ecosystems and long-term platform integration. These two companies are not just riding the AI wave theyre selling the picks and shovels in the gold rush. To develop AI companies cant avoid NVIDIA s" [X Link](https://x.com/semivision_tw/status/1942189635792441746) 2025-07-07T11:51Z [----] followers, [---] engagements "NVIDIA & TSMC Co-Lead the Silicon Photonics Frontier https://open.substack.com/pub/tspasemiconductor/p/nvidia-and-tsmc-co-lead-the-siliconr=4hpdhj&utm_campaign=post&utm_medium=web&showWelcomeOnShare=false https://open.substack.com/pub/tspasemiconductor/p/nvidia-and-tsmc-co-lead-the-siliconr=4hpdhj&utm_campaign=post&utm_medium=web&showWelcomeOnShare=false" [X Link](https://x.com/semivision_tw/status/1942249705674784773) 2025-07-07T15:49Z [---] followers, [---] engagements "President #Trump has announced new #tariffs on multiple countries set to take effect on August [--] [----]. Both Japan and South Korea confirmed 25% tariffs 😬 Should #Taiwan be bracing for impact too The pressure is" [X Link](https://x.com/semivision_tw/status/1942294089510293855) 2025-07-07T18:46Z [---] followers, [---] engagements "Japanese publicly listed SaaS company DATA SECTION announced that it has signed a procurement contract worth USD [---] million with its strategic partner in Taiwan Giga Computing Computing. Under the agreement Giga Computing will supply a total of [---] GPU servers equipped with #NVIDIA B200 chips. The goal is to build Japans most advanced and Asias largest SuperCluster in Osaka providing enterprise-grade AI computing services to companies across Japan and the Asia-Pacific region and positioning itself as the premier AI cloud service provider in Asia. #AI #GPU #CloudService" [X Link](https://x.com/semivision_tw/status/1942504850475942383) 2025-07-08T08:43Z [---] followers, [---] engagements "Siemens new Innovator3D IC solution suite empowers IC designers to efficiently develop simulate and manage heterogeneous 2.5D/3D-IC designs. Additionally the new Calibre 3DStress software leverages advanced thermo-mechanical analysis to identify stress-induced electrical effects at the transistor level. When used together these solutions significantly reduce the design risks associated with next-generation 2.5D/3D ICs while enhancing design quality yield and reliability. #Semiconductor #EDA #IC #Thermal #AdvancedPackaging #Siemens" [X Link](https://x.com/semivision_tw/status/1942519558075814027) 2025-07-08T09:42Z [---] followers, [---] engagements "Co-Packaged Optics (#CPO) is emerging as the next major breakthrough for interconnects within data centers and #AI supercomputers. CPO integrates optical engines directly with #ASICs (such as switches or #GPUs) eliminating multi-meter copper cable runs and significantly reducing signal loss and power consumption. https://open.substack.com/pub/tspasemiconductor/p/powering-the-next-data-race-how-800gr=4hpdhj&utm_medium=ios https://open.substack.com/pub/tspasemiconductor/p/powering-the-next-data-race-how-800gr=4hpdhj&utm_medium=ios" [X Link](https://x.com/semivision_tw/status/1942738652368699567) 2025-07-09T00:12Z [---] followers, [---] engagements "@BlueJay87476298 Taiwan" [X Link](https://x.com/semivision_tw/status/1942760698372841906) 2025-07-09T01:40Z [---] followers, [---] engagements "🕶Meta Invests in EssilorLuxottica to Strengthen AI Smart Glasses Collaboration According to Bloomberg (July 8) #Meta has acquired nearly a 3% stake in #EssilorLuxottica the worlds largest #eyewear manufacturer. This move deepens their strategic partnership in the AI-powered smart glasses space. The investment signals CEO Mark Zuckerbergs strong commitment to AI and highlights Metas ambition to build its own hardware ecosystemreducing reliance on competitors devices. From aggressive #AI hiring to strategic acquisitions Meta is moving fast and decisively in the AI race" [X Link](https://x.com/semivision_tw/status/1942763362762514869) 2025-07-09T01:50Z [---] followers, [---] engagements "#Marvell Leads AI Chip Infrastructure Innovation: A Full-Stack Transformation from Custom XPU to Optical Interconnects With the explosive growth of generative #AI large language models (#LLMs) and bandwidth-intensive inference workloads global data centers are undergoing a profound transformation driven by fundamental technology shifts. From processor architecture and memory access to interconnect interfaces and advanced packaging the boundaries of traditional chip design are being redefined. In this context Marvell positions itself at the core of this revolution with a full-stack custom" [X Link](https://x.com/semivision_tw/status/1942980375262748937) 2025-07-09T16:13Z [---] followers, [---] engagements "At the same time emerging players such as OpenAI and xAI (model-first) Tesla and Apple (application-first) and Sovereign #AI pioneers like Humain and Stargate are rapidly developing custom #ASICs and memory systems contributing to a diversified decentralized and co-optimized AI infrastructure ecosystem" [X Link](https://x.com/semivision_tw/status/1943155750756389308) 2025-07-10T03:50Z [---] followers, [---] engagements "-System Architecture: Assists customers in defining data flow and parallel compute models for optimized SoC architectures. -Design IP: Offers high-performance SerDes SRAM memory controllers and interconnect IPs. -Silicon Services: Supports cutting-edge process nodes (e.g. 2nm [--] 16) with advanced logic design capabilities. -Advanced Packaging: Integrates fan-out 2.5D CoWoS and CPO to increase system density and efficiency. -Manufacturing Logistics: Bridges wafer-level manufacturing and system-level SMT assembly for streamlined supply chains" [X Link](https://x.com/semivision_tw/status/1943511609030082721) 2025-07-11T03:24Z [---] followers, [---] engagements "Quantum Convergence: Bridging Academia and Industry between BC and Taiwan https://open.substack.com/pub/tspasemiconductor/p/quantum-convergence-bridging-academiar=4hpdhj&utm_campaign=post&utm_medium=web&showWelcomeOnShare=false https://open.substack.com/pub/tspasemiconductor/p/quantum-convergence-bridging-academiar=4hpdhj&utm_campaign=post&utm_medium=web&showWelcomeOnShare=false" [X Link](https://x.com/semivision_tw/status/1943690587456307475) 2025-07-11T15:15Z [---] followers, [---] engagements "Unlocking Quantum Opportunities British Columbia Taiwan: A New Chapter for Quantum Innovation and Collaboration Event Date & Time: July [--] [----] (Vancouver time) July [--] [----] (Taipei time) https://docs.google.com/forms/d/1yLhQK2o5h6y0Ni0EJUJRnAqGKgIBn0RwtI8ehQDJIYo/viewformedit_requested=true https://docs.google.com/forms/d/1yLhQK2o5h6y0Ni0EJUJRnAqGKgIBn0RwtI8ehQDJIYo/viewformedit_requested=true" [X Link](https://x.com/semivision_tw/status/1943690736592953462) 2025-07-11T15:15Z [---] followers, [--] engagements "🟠 LG Innotek Unveils Breakthrough Chip Packaging Technology LG Innotek recently introduced a new chip packaging innovation using copper post (CuP) technology replacing the traditional method of directly bonding chips to motherboards with solder balls alone. 🟧How it works: Tiny copper pillars are first formed on the substrate then topped with solder balls. 🟧Why it matters: Enables 20% tighter pitch between balls increasing packaging density Helps shrink overall motherboard size enhancing internal design flexibility Coppers high melting point ensures structural stability during high-temp" [X Link](https://x.com/semivision_tw/status/1943850356662055117) 2025-07-12T01:50Z [---] followers, [---] engagements "As AI and high-performance computing (HPC) continue to advance rapidly chip architectures are shifting toward 3D stacking chiplet disaggregation and heterogeneous integration. The realization of these technologies heavily depends on continuous breakthroughs and scalable mass production of bonding technologies. In this field one company has long held a critical positionBE Semiconductor Industries N.V. (Besi) based in the Netherlands" [X Link](https://x.com/semivision_tw/status/1943872741003677812) 2025-07-12T03:19Z [---] followers, [---] engagements "Besi: A Key Driver of the Transition from Planar to #3D Advanced Packaging Founded in [----] and headquartered in Duiven the Netherlands Besi operates manufacturing R&D and service facilities across Malaysia China Singapore and the U.S. The company specializes in designing and manufacturing high-precision assembly equipment for the back-end semiconductor process particularly targeting advanced logic chips memory sensors and photonic https://tspasemiconductor.substack.com/p/hybrid-bonding-at-scale-besis-vision https://tspasemiconductor.substack.com/p/hybrid-bonding-at-scale-besis-vision" [X Link](https://x.com/semivision_tw/status/1943897131862880360) 2025-07-12T04:56Z [---] followers, [---] engagements "🌟 Truly wise people focus on just four things in life: [--] Find a way to make money while you sleep because time is limited and income shouldnt rely solely on effort. 2Double down on your strengths doing what youre naturally good at leads to long-term success. 3Surround yourself with great people your circle determines your altitude. 4Keep reading books are the fuel that keep your mind evolving and your perspective expanding. 💡 There are no shortcuts in life. Only by consistently making the right choices can you build a high-leverage path thats truly your own" [X Link](https://x.com/semivision_tw/status/1944229335990513950) 2025-07-13T02:56Z [---] followers, [---] engagements "Financial Outlook and Strategic Significance At its [----] Investor Day Besi elevated hybrid bonding to a core business pillar raising long-term revenue targets to 1.51.9 billion with 4055% operating margins. Financial Times reported hybrid bonding revenues at 36M in [----] projected to surge to 476M by [----] potentially accounting for one-third of Besis total business. https://tspasemiconductor.substack.com/p/hybrid-bonding-at-scale-besis-vision https://tspasemiconductor.substack.com/p/hybrid-bonding-at-scale-besis-vision" [X Link](https://x.com/semivision_tw/status/1944243924404461762) 2025-07-13T03:54Z [----] followers, [---] engagements "The #semiconductor industry is currently standing at a critical inflection point of transformation and restructuring. As #AI computing demand grows exponentially traditional Moores Law scaling can no longer singlehandedly sustain breakthroughs in system-level performance. In this context advanced packaging technologies are rapidly evolving from a backend process into the core enabler of system integration and architectural innovation" [X Link](https://x.com/semivision_tw/status/1944602826623115277) 2025-07-14T03:40Z [---] followers, [---] engagements "Chinese media: Jensen Huang has arrived in Beijing and met with Lei Jun for a photo together. A media press conference is being held in Beijing. (Photo: Tencent Technology) #NVIDIA #MI" [X Link](https://x.com/semivision_tw/status/1944687167630147737) 2025-07-14T09:15Z [----] followers, [---] engagements "Who will win in the future #NVIDIA #AMD #Google #Microsoft #AWS #inte" [X Link](https://x.com/semivision_tw/status/1944803864273895782) 2025-07-14T16:59Z [---] followers, [---] engagements "As AI becomes a foundational infrastructure as computation extends beyond the cloud and as heterogeneous integration and photonic convergence become the new normal packaging technology is no longer just an engineering challengeits a strategic battleground. In the future the question wont just be Who can build the chip but rather Who can integrate everything together most effectively https://tspasemiconductor.substack.com/p/the-packaging-evolution-trilogy-hybrid https://tspasemiconductor.substack.com/p/the-packaging-evolution-trilogy-hybrid" [X Link](https://x.com/semivision_tw/status/1944968982189990384) 2025-07-15T03:55Z [---] followers, [---] engagements "Unlocking Quantum OpportunitiesBritish Columbia #Taiwan: A New Chapter for #Quantum Innovation and Collaboration Event Date & Time July [--] [----] (Vancouver time) July [--] [----] (Taipei time) Online: The meeting link will be provided upon successful registration. https://docs.google.com/forms/d/1yLhQK2o5h6y0Ni0EJUJRnAqGKgIBn0RwtI8ehQDJIYo/viewformedit_requested=true https://docs.google.com/forms/d/1yLhQK2o5h6y0Ni0EJUJRnAqGKgIBn0RwtI8ehQDJIYo/viewformedit_requested=true" [X Link](https://x.com/semivision_tw/status/1945052434201760226) 2025-07-15T09:26Z [---] followers, [---] engagements "Packaging as a System Platform Major foundries and IDMs are now positioning packaging as a system-level platform: #TSMC offers SoIC-X CoWoS-R and InFO-L for chiplet-based and memory-centric AI packaging. Intel is investing in EMIB Foveros Direct and glass substrates for ultra-large die integration and improved signal/power delivery. These platforms are designed to accommodate hybrid bonding optical interconnects and integrated power delivery networks effectively turning the package into a critical layer of the compute hierarchy" [X Link](https://x.com/semivision_tw/status/1945298123976233375) 2025-07-16T01:43Z [---] followers, [---] engagements "#Fluxless TCB on the other hand replaces flux with plasma activation reducing atmosphere heating and surface cleaning while utilizing highly controlled temperature and pressure to achieve Cu-to-Cu or Sn-based bonding. This technique significantly reduces residual contamination improves bond cleanliness and yield and enhances signal integrity and thermal performancemaking it particularly well-suited for high-integration high-bandwidth and high-power packaging structures" [X Link](https://x.com/semivision_tw/status/1945344179560706393) 2025-07-16T04:46Z [---] followers, [---] engagements "#Marvell has announced that its future flagship AI ASICs will adopt TSMCs sub-3nm processes potentially advancing to the 2nm node. For #TSMC this long-term agreement further secures high utilization of its advanced nodes and ensures stable demand for its CoWoS high-end packaging services. https://open.substack.com/pub/tspasemiconductor/p/from-custom-sram-to-optical-serdesr=4hpdhj https://open.substack.com/pub/tspasemiconductor/p/from-custom-sram-to-optical-serdesr=4hpdhj" [X Link](https://x.com/semivision_tw/status/1945693147549569486) 2025-07-17T03:52Z [---] followers, [---] engagements "In the rapidly evolving field of advanced packaging Taiwans semiconductor supply chain is undergoing a strategic shift driven by explosive demand from AI and high-performance computing (HPC) applications. While TSMC remains the dominant provider of advanced packaging capacityparticularly for AI chips relying on CoWoSother Taiwanese players such as #UMC and #ASE (including #SPIL) are emerging as critical alternative sources especially for edge AI and customized applications that require diverse packaging approaches." [X Link](https://x.com/semivision_tw/status/1945722574756889008) 2025-07-17T05:49Z [---] followers, [---] engagements "The global semiconductor industry is undergoing a profound transformationshifting from the relentless scaling of Moores Law to a new era driven by system-level innovation and advanced packaging integration. At the heart of this transition lies Heterogeneous Integration (#HI) a key enabling technology powering the next generation of applications in Artificial Intelligence (#AI) High-Performance Computing (#HPC) 5G/6G communications and energy-efficient edge devices. https://tspasemiconductor.substack.com/p/astraccelerating-r-and-d-in-heterogeneous" [X Link](https://x.com/semivision_tw/status/1946028457550340496) 2025-07-18T02:05Z [---] followers, [---] engagements "Everyones talking about humanoid #robots and yes the market could be massive. #TSMC CEO C.C. Wei said its still too early to expect significant impact this year or even next because the technology is highly complex. But he also shared a clients bold prediction: 🚗 EVs are just the beginning humanoid robots could be [--] times the market size of EVs once they take off. A space worth watching closely" [X Link](https://x.com/semivision_tw/status/1946132010495537625) 2025-07-18T08:56Z [---] followers, [---] engagements "🟨#Nikon unveils the DSP-100 Lithography System engineered for large square substrates up to [---] x [---] mm. This opens new possibilities for advanced packaging and panel-level integration. More info: #Semiconductor #AdvanedPackaging #FOPLP #CoPoS #Panel https://www.nikon.com/company/news/2025/0716_01.html https://www.nikon.com/company/news/2025/0716_01.html https://www.nikon.com/company/news/2025/0716_01.html https://www.nikon.com/company/news/2025/0716_01.html" [X Link](https://x.com/semivision_tw/status/1946163887037878593) 2025-07-18T11:03Z [----] followers, [---] engagements "The cool design which makes it cool ❄ Liquid cooling isnt just a feature its an architecture-driven thermal design. In the G383-R80 LAP1 every elementfrom the placement of 4x AMD Instinct MI300A APUs to the dedicated cold plate loops and optimized component layoutis engineered to maximize cooling efficiency within a compact 3U chassis. #GIGABYTE #UpgradeYourLife #GIGACOMPUTING #serversolutions #DirectLiquidCooling #AMD #MI300A #ThermalDesign #GPUserver #DataCenterInnovation #AIInfrastructure #CoolDesign" [X Link](https://x.com/semivision_tw/status/1946211802532204980) 2025-07-18T14:13Z [----] followers, [---] engagements "Why A*STAR and Heterogeneous Integration Deserve Attention ASTAR is Singapores lead government agency for research and innovation. Under its umbrella the Institute of Microelectronics (#IME) has long been a powerhouse in semiconductor process and packaging R&D. In recent years ASTAR has significantly strengthened its Heterogeneous Integration R&D Line establishing a vertically integrated platform that spans from individual components and packaging to complete system-level modules. According to recent public updates the platform includes the following core capabilities:" [X Link](https://x.com/semivision_tw/status/1946387817271087144) 2025-07-19T01:53Z [----] followers, [---] engagements "❇ #NVIDIA CEO Jensen Huang praised DeepSeek and other Chinese contributions to global AI research during his meeting with Wang Jian founder of #AlibabaCloud and director of Zhejiang Lab in Beijing. He remarked that open-source generative AI models from China are actively helping the world advance. 📌What followed in their conversation was even more moving: #AI is perhaps the greatest equalizer in human history it costs almost nothing to use and cutting-edge capabilities are increasingly open-sourced or made available at minimal cost. Unlike social media and short videos that prey on human" [X Link](https://x.com/semivision_tw/status/1946400692262072733) 2025-07-19T02:44Z [----] followers, [---] engagements "From Chip Definition to System Integration: #MediaTek at the Crossroads of Advanced Packaging In the era of AI-driven performance-per-watt optimization and heterogeneous integration the nature of chip design is shiftingfrom a singular focus on computational horsepower to a packaging-centric system-level co-design paradigm. https://tspasemiconductor.substack.com/p/decoding-node-strategy-mediateks https://tspasemiconductor.substack.com/p/decoding-node-strategy-mediateks" [X Link](https://x.com/semivision_tw/status/1946409450060824882) 2025-07-19T03:19Z [----] followers, [---] engagements "#Intels Next Frontier: Redefining Chiplet Integration Through Advanced Packaging https://open.substack.com/pub/tspasemiconductor/p/intels-next-frontier-redefining-chipletr=4hpdhj&utm_campaign=post&utm_medium=web&showWelcomeOnShare=false https://open.substack.com/pub/tspasemiconductor/p/intels-next-frontier-redefining-chipletr=4hpdhj&utm_campaign=post&utm_medium=web&showWelcomeOnShare=false" [X Link](https://x.com/semivision_tw/status/1946572489934643418) 2025-07-19T14:07Z [----] followers, [---] engagements "#Rapidus: The Locomotive of Japans Semiconductor Industry https://open.substack.com/pub/tspasemiconductor/p/rapidus-the-locomotive-of-japansr=4hpdhj&utm_campaign=post&utm_medium=web&showWelcomeOnShare=false https://open.substack.com/pub/tspasemiconductor/p/rapidus-the-locomotive-of-japansr=4hpdhj&utm_campaign=post&utm_medium=web&showWelcomeOnShare=false" [X Link](https://x.com/semivision_tw/status/1946574361080803542) 2025-07-19T14:14Z [----] followers, [---] engagements "As a global leader in IC design #MediaTek has evolved from its consumer electronics SoC roots to expand into Edge AI #ASICs and automotive markets. In doing so it has increasingly recognized advanced packaging not merely as a manufacturing consideration but as a strategic capability. This evolution touches not only how chips are architected and IPs are integrated but how system-level synergy across performance thermal design and power consumption can be fully optimized. https://tspasemiconductor.substack.com/p/decoding-node-strategy-mediateks" [X Link](https://x.com/semivision_tw/status/1946604517107118179) 2025-07-19T16:14Z [----] followers, [---] engagements "In the long run once applications mature TSMC Samsung and Intel will rely on EUV to fend off competitors. But for the entry and mid-tier nodes high-end DUVi remains key. China will keep buying DUV while local equipment makers gradually catch up assuming EUV sanctions stay" [X Link](https://x.com/semivision_tw/status/1946742713254367513) 2025-07-20T01:23Z [----] followers, [--] engagements "Summary: DUV still captures the majority of applications High NA / Hyper NA EUV will take time to ramp ASML still has money visibility in the short term but future surprises await Lets see if ASML can pull off something truly groundbreaking" [X Link](https://x.com/semivision_tw/status/1946742985397583975) 2025-07-20T01:24Z [----] followers, [---] engagements "#TSMCs SoW Renaissance: Defending the AI Frontier Where NVIDIA Sells Ecosystem Not Chips https://open.substack.com/pub/tspasemiconductor/p/tsmcs-sow-renaissance-defending-ther=4hpdhj&utm_campaign=post&utm_medium=web&showWelcomeOnShare=false https://open.substack.com/pub/tspasemiconductor/p/tsmcs-sow-renaissance-defending-ther=4hpdhj&utm_campaign=post&utm_medium=web&showWelcomeOnShare=false" [X Link](https://x.com/semivision_tw/status/1947114575457034715) 2025-07-21T02:01Z [----] followers, [---] engagements Limited data mode. Full metrics available with subscription: lunarcrush.com/pricing
@semivision_tw Semi Vision
Semi Vision posts on X about ai, taiwan, future, in the the most. They currently have [-----] followers and [----] posts still getting attention that total [-----] engagements in the last [--] hours.
Engagements: [-----] #
- [--] Week [-------] -33%
- [--] Month [-------] +52%
- [--] Months [---------] -88%
- [--] Year [----------] +164,110,800%
Mentions: [--] #
- [--] Month [---] +53%
- [--] Months [---] +205%
- [--] Year [-----] +62,750%
Followers: [-----] #
- [--] Week [-----] +4.50%
- [--] Month [-----] +37%
- [--] Months [-----] +413%
- [--] Year [-----] +20,618%
CreatorRank: [-------] #
Social Influence
Social category influence technology brands stocks countries finance currencies celebrities fashion brands travel destinations automotive brands products
Social topic influence ai, taiwan #695, future, in the, china, investment, core, chips, global, united states
Top accounts mentioned or mentioned by @elonmusk @grok @thehedgeberg @qingpinghe1 @serapeum1103 @semiconjpn @xai @nvidia @theaiinvestor @polymarket @ryanair @mrbeast @xingpt @caizhenghai @semivisiontw @chiefaioffice @treasureh8nter @r00041451 @fatfire74 @ai126f4
Top assets mentioned Alphabet Inc Class A (GOOGL) Microsoft Corp. (MSFT) Taiwan Semiconductor (TSM)
Top Social Posts
Top posts by engagements in the last [--] hours
"💻 #AI PCs are the future trend with AI-enabled #PCs expected to surpass 50% of global shipments by [----]. Equipped with dedicated NPUs these devices will enhance AI performance directly on the device. 🟠 What AI PC can do with #GenAI https://tspasemiconductor.substack.com/p/genai-revolutionizing-smartphones https://tspasemiconductor.substack.com/p/genai-revolutionizing-smartphones"
X Link 2025-03-06T02:04Z [--] followers, [--] engagements
"This Dune movie scene is a perfect metaphor for the current state of the #semiconductor industry in #Arizona USA. #TSMC #Intel #Amkor #Nvidia #apple"
X Link 2025-03-09T08:37Z [--] followers, [--] engagements
"SK Hynix Delivers #HBM4 12Hi Samples Ahead of Schedule Mass Production Expected in the Second Half of the Year #AI #HBM SK HynixHBM4 12Hi 🔹 SK HynixAI 12HBM4 🔹 [----] 🔹 SKAI https://t.co/bksdM2AWhb SK HynixHBM4 12Hi 🔹 SK HynixAI 12HBM4 🔹 [----] 🔹 SKAI https://t.co/bksdM2AWhb"
X Link 2025-03-20T06:15Z [---] followers, [---] engagements
"#SemiVision team is composed of experts with robust #semiconductor backgrounds and hands-on industry experience. Our collective expertise spans the entire value chain: from foundry operations semiconductor manufacturing processes advanced package"
X Link 2025-03-26T13:30Z [---] followers, [--] engagements
"Toward Self-Sufficiency: Chinas Equipment Development Strategy #semiconductor #Semicon #China #Sicarrier #Huawei #ASML #AMAT #TEL #TSMC https://open.substack.com/pub/tspasemiconductor/p/toward-self-sufficiency-chinas-equipmentr=4hpdhj&utm_campaign=post&utm_medium=web&showWelcomeOnShare=true https://open.substack.com/pub/tspasemiconductor/p/toward-self-sufficiency-chinas-equipmentr=4hpdhj&utm_campaign=post&utm_medium=web&showWelcomeOnShare=true"
X Link 2025-03-26T15:57Z [---] followers, [---] engagements
"According to the #China National Intellectual Property Administration (CNIPA) #Huawei Technologies Co. Ltd. filed a patent in September [----] titled Method for Manufacturing Semiconductor Device Using Self-Aligned Quadruple Patterning (Publication No. CN117751427A)"
X Link 2025-03-27T13:01Z [---] followers, [--] engagements
"Inventec: US+1"
X Link 2025-03-27T13:38Z [----] followers, [--] engagements
"#SK Hynix aims to lock in all [----] #HBM orders by mid-2025 Its CEO shrugs off concerns about the potential impact of low-cost Chinese #AI models on HBM demand https://www.kedglobal.com/korean-chipmakers/newsView/ked202503270004 https://www.kedglobal.com/korean-chipmakers/newsView/ked202503270004"
X Link 2025-03-28T05:52Z [---] followers, [--] engagements
"#SMIC is semiconductor Deepseek Interesting According to SemiVision DeepSeek is planning to manufacture chips using SMICs 5nm process. https://t.co/WgRYjoVjBq https://t.co/6G2ophWyLS Interesting According to SemiVision DeepSeek is planning to manufacture chips using SMICs 5nm process. https://t.co/WgRYjoVjBq https://t.co/6G2ophWyLS"
X Link 2025-03-30T05:03Z [---] followers, [---] engagements
"January: DeepSeek R1 launched IQ [---] February: o3-mini launched IQ [---] March: Geminie [---] launched IQ [---] At this rate we can expect to see AI models with IQs between [---] and [---] by the second half of the year at the latest.This will accelerate the speed of AIs self-reinforced learning. Whats most interesting is that the IQ of LLMs also follows a normal distribution just like humans XD"
X Link 2025-03-31T13:54Z [---] followers, [----] engagements
"🌏 Global #Semiconductor Equipment Spending Overview #China : Continues to lead with equipment investment reaching $38 billion in [----] but this marks a 24% decline from its peak in [----]. South #Korea: Driven by AI-induced memory demand investment is projected to grow by 29% in [----] and reach $27 billion in [----] potentially becoming the second-largest globally. #Taiwan: Continues to enhance its advanced technology and capacity layout maintaining its position as the third-largest in global semiconductor equipment spending. Investments are expected to reach $21 billion in [----] and $24.5 billion"
X Link 2025-04-01T09:14Z [---] followers, [--] engagements
"According to tech media TweakTown #NVIDIA has rebranded itself as NVID AI to strengthen its position in the AI field. Insiders from CEO Jensen Huangs inner circle revealed that NVIDIAs leadership wants #AI to become synonymous with the brand while still preserving its traditional identity and brand recognition"
X Link 2025-04-02T01:06Z [----] followers, [---] engagements
"Taiwan Semiconductor Local Supply https://www.ctee.com.tw/news/20250401700083-439901 https://www.ctee.com.tw/news/20250401700083-439901"
X Link 2025-04-02T11:16Z [---] followers, [--] engagements
"On the afternoon of April 2nd local time (4 a.m. on April 3rd Taiwan time) U.S. President Trump officially announced varying reciprocal tariffs for different countries in the White House Rose Garden effective immediately. Trump stated that most goods entering the United States would be subject to a minimum tariff of 10% while the reciprocal tariff for Taiwan is set at 32%"
X Link 2025-04-02T22:50Z [---] followers, [---] engagements
"#Trump announced the imposition of reciprocal tariffs on a range of countries stating that the United States will apply the following tariffs on imports: 34% on goods from China 20% on the European Union 26% on India 25% on South Korea 24% on Japan 32% on Taiwan 31% on Switzerland 46% on Vietnam and 10% on both the United Kingdom and Brazil"
X Link 2025-04-02T23:01Z [---] followers, [---] engagements
"The Pacific region is a majorly affected area under the tariff impact as shown on the map. Countries in East and Southeast Asia particularly China Vietnam Thailand and other ASEAN nations are shaded in darker blue indicating higher tariff rates. The region is notably impacted due to its extensive trade relations with the United States particularly in manufacturing and electronics exports. This concentration of high tariffs is likely due to strategic economic measures targeting these countries substantial export volumes and the perceived trade imbalances. Additionally the broader Asia-Pacific"
X Link 2025-04-03T01:55Z [---] followers, [---] engagements
"Spirited Away: A Tale of the #Semiconductor Industrys Transformation https://open.substack.com/pub/tspasemiconductor/p/spirited-away-a-tale-of-the-semiconductorr=4hpdhj&utm_campaign=post&utm_medium=web&showWelcomeOnShare=false https://open.substack.com/pub/tspasemiconductor/p/spirited-away-a-tale-of-the-semiconductorr=4hpdhj&utm_campaign=post&utm_medium=web&showWelcomeOnShare=false"
X Link 2025-04-06T17:03Z [---] followers, [---] engagements
"@WhiteHouse True"
X Link 2025-04-10T03:17Z [---] followers, [--] engagements
"SemiVision is an emerging research institute focused on the semiconductor industry. If youre interested in topics such as geopolitics semiconductors NVIDIA TSMC and silicon photonics we invite you to follow our free newsletter on Substack https://tspasemiconductor.substack.com/utm_source=global-search https://tspasemiconductor.substack.com/utm_source=global-search"
X Link 2025-04-10T05:51Z [---] followers, [---] engagements
"This Gartner chart compares GenAI use cases for IT organizations by value and feasibility. Use cases in the Likely wins quadrantlike code generation job analysis and data quality managementoffer high feasibility and value. Calculated risks offer high value but may be harder to implement"
X Link 2025-04-15T03:42Z [---] followers, [---] engagements
"TSMCs Q1 revenue rose 35% year-over-year to $25.53 billion with gross margin slightly declining to 58.8%. Net income surged 60% to $10.9 billion with earnings per share (EPS) of $2.12. Strong AI demand drove HPC revenue to grow over 70% YoY now accounting for nearly 60% of total revenue"
X Link 2025-04-17T06:40Z [---] followers, [--] engagements
"U.S. semiconductor design software giant Synopsys has announced its acquisition of simulation software provider Ansys a deal that has drawn significant international attention. Both Synopsys and Ansys offer products in the fields of Electronic Design Automation (EDA) software optical software and photonics software and they compete horizontally in these markets. To address concerns over potential anti-competitive effects due to overlapping businesses Synopsys will divest its optical and photonics software divisions as well as Ansyss PowerArtist (RTL) software business to Keysight Technologies"
X Link 2025-04-20T05:17Z [---] followers, [---] engagements
"💵 Semiconductor Equipment Market Revenue China North America Taiwan Europe Source: semi"
X Link 2025-04-21T13:35Z [---] followers, [---] engagements
"According to industry sources cited by South Korean media outlet ChosunBiz construction of #Samsung 's plant in Taylor #Texas has reached 99.6% completion nearing the final stages. At this point equipment installation would typically begin; however reports suggest that Samsung is facing hesitation and has yet to place orders for the equipment indicating a state of indecision"
X Link 2025-04-23T05:46Z [---] followers, [---] engagements
"🌈SemiVision OFC50 How Do Co-Packaged Optics (CPO) Become Manufacturable As the data center ecosystem rapidly transitions toward Co-Packaged Optics (CPO) and Optical I/O (OIO) to meet the unprecedented demands of AI-driven bandwidth several key technical and manufacturing challenges stand in the way of commercialization. These challenges are not merely theoretical; they are deeply intertwined with cost energy efficiency physical form factor and silicon photonics manufacturing scalability 👉Read more: https://lnkd.in/gXzP5qid https://lnkd.in/gXzP5qid"
X Link 2025-04-26T11:06Z [---] followers, [---] engagements
"According to the latest forecasts the global semiconductor market is expected to achieve approximately 10% annual growth in [----] maintaining a steady and healthy expansion trend. This growth is driven by the simultaneous advancement across multiple sectors including high-performance computing (HPC) smartphones automotive electronics IoT and emerging applications creating a diversified and resilient market structure"
X Link 2025-04-29T07:11Z [---] followers, [--] engagements
"🔵Advanced Packaging Intel EMIB Tsmc CoWoS Read more: Captain Intel: Reassembling the Semiconductor Avengers [----] TSMC NorthAmerica Technology Symposium - Review https://lnkd.in/gTEcz6qr https://lnkd.in/gQ25iQSk https://lnkd.in/gTEcz6qr https://lnkd.in/gQ25iQSk"
X Link 2025-04-30T00:28Z [---] followers, [---] engagements
"Nvidia CEO Jensen Huang warns China is not behind in AI"
X Link 2025-05-01T03:31Z [---] followers, [---] engagements
"#Synopsys has announced EDA and IP collaborations with #Intel Foundry. The agreements include making available its certified AI-driven digital and analogue design flows for Intels 18A process node and production-ready EDA flows for the 18A-P process node with RibbonFET Gate-all-around transistor architecture and the industry's first commercial foundry implementation of PowerVia backside power delivery"
X Link 2025-05-01T11:14Z [---] followers, [---] engagements
"From Manufacturer to Ecosystem Enabler: Rather than competing with system companies TSMC positions itself as a collaborative non-competing partner to system-level players such as NVIDIA Broadcom and Marvell"
X Link 2025-05-03T10:45Z [---] followers, [--] engagements
"Chip War: The Strategic Battle Behind Semiconductors The U.S.China chip war has entered a critical phase. With the U.S. investing $52B through the CHIPS Act and offering tax incentives to revitalize domestic semiconductor manufacturing China is responding with strategic export controls on critical metals like germanium materials vital to chipmaking. This geopolitical tech race impacts not only chipmakers but also downstream industries like aviation automotive defense and consumer electronics. As the semiconductor supply chain becomes a national security issue the global tech ecosystem must"
X Link 2025-05-04T03:17Z [---] followers, [--] engagements
"SemiVision is a semiconductor industry research institution committed to transforming analysis into vision through comprehensive insights into the semiconductor ecosystem"
X Link 2025-05-04T15:06Z [---] followers, [--] engagements
"Aside from semiconductor and IC design giants like TSMC and MediaTek most Taiwanese companies still struggle with razor-thin profit margins of just 3% to 4%. In March the New Taiwan dollar weakened along with the stock market briefly falling below the NT$33 marksome even found relief in minor foreign exchange gains. But in less than two months the situation has reversed sharply. Now profit margins have suddenly turned negative overnight pushing many firms to the brink of survival"
X Link 2025-05-05T05:14Z [---] followers, [---] engagements
"As the world progresses semiconductors are becoming a foundational industry that touches every aspect of modern life making it essential for all to grasp its significance. Rooted in Taiwana global hub of semiconductor excellencewe maintain a worldwide perspective bridging local expertise with international trends"
X Link 2025-05-06T01:15Z [---] followers, [--] engagements
"N2 (Mass production in 2025) -TSMCs first-generation Gate-All-Around (GAA) process offering a 15% performance improvement over N3E and enabling support for up to 12-layer HBM4 integrationideal for AI and HPC memory bandwidth demands. -N12 N5 and N3 logic base die for HBM4 -N2P (Mass production in 2026) An optimized GAA variant N2P enhances 3D-IC interconnect density to [--] million/mm tailored for chiplet-based architectures and multi-die packaging platforms"
X Link 2025-05-06T07:12Z [---] followers, [---] engagements
"#Keysight Technologies announced its collaboration with Intel Foundry to support Embedded Multi-die Interconnect Bridge #EMIB-T technology. This cutting-edge innovation is designed to enhance high-performance packaging solutions for the AI and data center markets and will support #Intels 18A process node"
X Link 2025-05-06T07:40Z [----] followers, [---] engagements
"As illustrated in the first diagram TSMC forecasts that by [----] HPC/AI will account for 45% of the global semiconductor market becoming the dominant application platform. This is followed by smartphones at 25% automotive electronics at 15% IoT at 10% and other segments at 5%. Such a shift in market structure indicates a pivotal transition away from mobile-centric demand toward innovation centered around AI and high-throughput compute workloads"
X Link 2025-05-07T04:46Z [---] followers, [--] engagements
"Nvidias new processor features a MediaTek-designed CPU based on the Arm architecture integrated with Nvidias Blackwell-architecture GPU to form a new processor series. Nvidia aims to collaborate closely with MediaTek to deliver performance that surpasses AMDs Radeon graphics cards and Qualcomms Adreno GPUs targeting the gaming market and related business opportunities"
X Link 2025-05-07T08:44Z [---] followers, [---] engagements
"Synopsys and TSMC are jointly enabling the next era of angstrom-scale design innovation through certified EDA flows on TSMCs A16 and N2P processes. These flows driven by Synopsys. ai deliver optimized digital and analog performance rapid migration paths and unmatched productivity for leading-edge designs. The collaboration spans across multiple generations including early engagement on the A14 node reflecting a shared commitment to delivering high-quality tools and flows for high-performance semiconductor development"
X Link 2025-05-09T10:45Z [---] followers, [---] engagements
"Humanoid Robots Will Define the Future of Chip Demand and Integration Technology Humanoid robots represent one of the most complex and silicon-intensive systems envisioned in the coming decade. These machines are expected to combine a wide array of advanced semiconductor components each serving highly specialized functionsfrom perception and spatial awareness to decision-making and actuation. As such humanoid robots will set new benchmarks for chip performance integration density and packaging innovation"
X Link 2025-05-10T05:39Z [---] followers, [---] engagements
"Synopsys also provides full 3Dblox support and CoWoS enablement for 5.5x reticle-size integrations accelerating multi-die 3D stacking and chiplet-based system design for next-generation AI chips. Furthermore its broad IP portfolioone of the industrys most completehas been validated for use on both N2 and N2P processes ensuring access to best-in-class IP blocks for advanced SoC design. This partnership underscores the central role of co-optimized EDA IP and advanced process technologies in enabling the performance power and area (PPA) breakthroughs required for the future of AI HPC and beyond"
X Link 2025-05-11T01:51Z [---] followers, [--] engagements
"Powered by Cadences industry-leading solvers andNVIDIA Blackwellsystems its optimized for electronic design automation (EDA) system design automation (SDA) and life sciences workloads delivering unmatched scale speed and insights. From semiconductor design and autonomous machines to breakthroughs in drug discovery the Millennium M2000 Supercomputer transforms possibilities into reality"
X Link 2025-05-11T01:52Z [---] followers, [--] engagements
"Im really looking forward to the release of this film it will help more people understand the development of Taiwans semiconductor industry. https://youtu.be/TzI-kTINIB8si=WIiiGZJLq7_nlPa1 https://youtu.be/TzI-kTINIB8si=WIiiGZJLq7_nlPa1"
X Link 2025-05-11T06:19Z [---] followers, [---] engagements
"TSMC and Nvidia Fuel the Rise of U.S. AI Chips How the Trump Administration Helped Kickstart Americas Semiconductor Revival https://open.substack.com/pub/tspasemiconductor/p/tsmc-and-nvidia-fuel-the-rise-ofr=4hpdhj&utm_campaign=post&utm_medium=web&showWelcomeOnShare=false https://open.substack.com/pub/tspasemiconductor/p/tsmc-and-nvidia-fuel-the-rise-ofr=4hpdhj&utm_campaign=post&utm_medium=web&showWelcomeOnShare=false"
X Link 2025-05-12T05:09Z [---] followers, [--] engagements
"🔴 TSMC's U.S. President Rose Castanares recently stated in an interview with Axios that the company has committed a total investment of $165 billion USD to build semiconductor facilities in the United States. Once all fabs are completed and fully operational the investment is expected to create [-----] direct jobs across the country"
X Link 2025-05-12T05:10Z [---] followers, [--] engagements
"2025 VLSI Technology Forum - Advanced Substrate for High Performance Heterogeneous Integration https://open.substack.com/pub/tspasemiconductor/p/2025-vlsi-technology-forum-advancedr=4hpdhj&utm_campaign=post&utm_medium=web&showWelcomeOnShare=false https://open.substack.com/pub/tspasemiconductor/p/2025-vlsi-technology-forum-advancedr=4hpdhj&utm_campaign=post&utm_medium=web&showWelcomeOnShare=false"
X Link 2025-05-12T13:07Z [---] followers, [---] engagements
"Taiwans fertility rate has fallen below Japans a stunning demographic shift with serious implications. In the semiconductor industry alone every advanced foundry requires thousands of skilled workers to operate and maintain production. From cleanroom engineers to process control specialists human capital is the backbone of chipmaking. But as Taiwans birth rate continues to plunge a severe labor shortage is looming"
X Link 2025-05-13T01:12Z [---] followers, [--] engagements
"Without strategic action talent cultivation automation and international recruitment the future of Taiwans high-tech dominance could be at risk. #Semiconductor #Taiwan #FertilityRate #LaborShortage #TechIndustry #Foundry"
X Link 2025-05-13T01:12Z [---] followers, [--] engagements
"In particular the surging demand for high-density high-performance and low-power chips in areas such as AI accelerators data center servers and premium mobile devices will continue to drive aggressive innovation and scaling in semiconductor process technologies"
X Link 2025-05-13T02:53Z [---] followers, [--] engagements
"According to research by IDC driven by strong demand from high-performance computing customers such as NVIDIA AMD AWS Broadcom and cloud service providers TSMCs CoWoS capacity continues to expand rapidly. The company aims to double its output from [------] wafers in [----] to [------] wafers this year representing a 100% year-over-year growth. The primary growth driver is the CoWoS-L product line which is expected to surge by 470% annually. Additionally capacity expansion is also underway at ASE and Amkor in the United States."
X Link 2025-05-13T08:53Z [---] followers, [---] engagements
"President Trump Announces $600B Investment in Saudi Arabia AI as a New Tool of Diplomacy The goal To use AI as a diplomatic instrumenta signal that artificial intelligence is no longer just about innovation but about national power. In the future AI = National Strength and it will redefine how nations compete on the global stage"
X Link 2025-05-14T04:38Z [---] followers, [--] engagements
"❇NVIDIA CEO Jensen Huang Speaks at the Saudi-U.S. Investment Forum in Riyadh Jensen Huang announced a new agreement with Saudi Arabias newly established AI company Humain to supply chips for a 500MW AI data center project. Backed by the Public Investment Fund (PIF) Humain plans to scale data center capacity to 1.9GW by [----] as Saudi Arabia doubles down on AI and localized data infrastructure. In the AI era power will be the ceiling for compute. P.S. Jensen looks extra sharp in that leather jacket"
X Link 2025-05-14T05:44Z [---] followers, [---] engagements
"SemiVision: While Moores Law historically delivered exponential scaling by shrinking transistor dimensions the semiconductor industry now recognizes that transistor scaling alone is no longer sufficient to meet the demands of AI cloud computing and data-centric workloads. The More-than-Moore paradigm has emerged as a new scaling frontier emphasizing heterogeneous integration system-level co-design and materials innovation as critical enablers of future performance and functionality"
X Link 2025-05-15T02:41Z [---] followers, [---] engagements
"Fast forward to [----] and the conversation has evolved. At OFC50 the question is no longer why CPO but how do we make CPO manufacturable As discussed in this article companies such as NVIDIA Broadcom and Marvellhave shared practical insights into testability reliability and scalable integration strategies reflecting the industrys maturity and urgency to overcome real-world deployment barriers"
X Link 2025-05-15T16:46Z [---] followers, [---] engagements
"TSMC's VP of advanced technology and mask engineering explained about the roadmap for the incoming nine factories. Stated the demand for CoWoS is "insane". -CoWoS capacity: +80% CAGR (20222025) -3nm chips: +60% shipments in [----] vs [----] -AI chips: [--] more in [----] vs [----] -Global semiconductor market: +10% yearly to reach $1T by 2030"
X Link 2025-05-16T01:29Z [---] followers, [---] engagements
"In the next section we explore and compare the silicon photonics concepts and system-level approaches of Intel Ayar Labs and Avicena as part of a broader technical series. This will be followed by a comprehensive cross-company analysis including NVIDIA Broadcom and Marvell enabling a holistic understanding of how the industry is convergingor divergingon the path toward scalable Co-Packaged Optics"
X Link 2025-05-16T02:05Z [----] followers, [---] engagements
"El Capitan Organization: Lawrence Livermore National Laboratory (LLNL) Country: United States Technology Providers: HPE (Cray) AMD Frontier Organization: Oak Ridge National Laboratory (ORNL) Country: United States Technology Providers: HPE (Cray) AMD"
X Link 2025-05-17T16:14Z [---] followers, [--] engagements
"Aurora Organization: Argonne National Laboratory (ANL) Country: United States Technology Providers: HPE (Cray) Intel HPC5 Organization: Eni (Italian National Oil Company) Country: Italy Technology Providers: Dell Technologies"
X Link 2025-05-18T01:51Z [---] followers, [---] engagements
"Automotive Supply Chain"
X Link 2025-05-18T10:27Z [---] followers, [---] engagements
"🔴#SemiVision : Perspective on Semiconductor Industry Development Driven by #AI Application 📌Expert Talk on #NOMURA forum"
X Link 2025-05-19T02:51Z [---] followers, [---] engagements
"✳Big news for Taiwans AI future. NVIDIA announces a strategic partnership with Foxconn TSMC and NSTC to build AI infrastructure in Taiwan. From chips to compute Taiwan is shaping up to be a global AI powerhouse. This collaboration represents not just technologybut national-scale ambition. #NVIDIA #TSMC #Foxconn #NSTC #AIInfrastructure #TaiwanAI #DataCenter"
X Link 2025-05-19T04:12Z [---] followers, [---] engagements
"The adoption of photonic technology in future supercomputing systems is expected to advance gradually alongside ASIC design evolution. Today ASICs supporting [---] Gbps/lane and [---] Gbps/lane have already been developed. These designs leverage SerDes technology to support electrical connections within server cabinets and the proportion of active links in actual deployments continues to grow. However ASICs targeting [---] Gbps/lane are still under development and face significant challenges including very short electrical reach and rising SerDes power consumption"
X Link 2025-05-20T02:53Z [---] followers, [---] engagements
"In the future switch ports may feature different personalities including standard Ethernet interfaces (such as those defined by the Ultra Ethernet Consortium UEC) proprietary fabric interconnects and high-performance optical interfaces based on CPO or CPC technologies. This flexible heterogeneous design enables switches to meet the diverse connectivity demands of different applications. By adopting this modular multi-technology integration future switches are expected to achieve ultra-high bandwidth low latency and manufacturabilitybalancing performance with practical deployment considerations"
X Link 2025-05-20T04:53Z [---] followers, [---] engagements
"While photonic technologies show great potential in performance and energy efficiency their widespread deployment in mass production systems still faces significant manufacturing integration challenges. Today the most advanced switch ASICs are manufactured using TSMCs N3 or N2P process nodes meaning that any photonic solution must be compatible with these manufacturing flows and supply chains. This reality forces system designers to rely heavily on co-packaged optics (CPO) solutions provided by their existing silicon service providers significantly limiting technology choice and innovation"
X Link 2025-05-21T03:13Z [---] followers, [---] engagements
"2025/05/21🌱⚡ TSMC Issues NT$14.1 Billion in Green Corporate Bonds to Support Sustainability Initiatives TSMC announced today the issuance of NT$14.1 billion (approx. US$440 million) in unsecured corporate bonds designated as green bonds. The funds will be allocated toward green buildings renewable energy usage and other environmentally friendly initiatives. The bond issuance consists of: ♻ NT$12.5 billion for a 5-year tranche (Type A) with a fixed annual interest rate of 1.92% ♻NT$1.6 billion for a 10-year tranche (Type B) with a fixed annual interest rate of 2.05% Hua Nan Securities will"
X Link 2025-05-21T13:48Z [---] followers, [---] engagements
"The next generation of switch designs is trending toward multi-die packaging combined with direct liquid cooling while also integrating passive optical connections to the card edge. However this highly complex and costly architecture presents several critical challenges including: Yield Concerns: Can such designs be manufactured at acceptable production yields Supply Chain Readiness: Is the supply chain capable of supporting the high complexity of these packaging methods Serviceability: Can these designs offer practical maintenance over the systems operational lifecycle"
X Link 2025-05-22T13:48Z [---] followers, [--] engagements
"#MediaTek at Computex We believe MediaTek will continue to gain market share in the smartphone segment. Notably we observed an accelerated adoption timeline for 2nm reflecting the companys strong confidence in its flagship products. In the Cloud AI space beyond MediaTeks ongoing #ASIC collaborations with CSPs we are optimistic about its partnership with Nvidia on NVLink Fusion and the potential opportunities in #AI ASIC"
X Link 2025-05-23T03:29Z [---] followers, [---] engagements
"1.MediaTeks keynote centered on AI emphasizing the companys long-standing strengths in edge devices (smartphones Chromebooks IoT automotive) and its strategy to scale those capabilities into the cloud AI domain (supercomputers AI ASICs)"
X Link 2025-05-23T03:30Z [---] followers, [--] engagements
"2. MediaTeks advantage lies in boosting performance while reducing power consumption. In the keynote the company announced that its 2nm chip will tape out in September this year offering a 15% performance increase and 25% power savings compared to N3"
X Link 2025-05-23T03:30Z [---] followers, [--] engagements
"3. Through #NVLink IP and a chiplet architecture MediaTek and Nvidia are co-developing custom AI ASICs (NVLink Fusion) to deliver solutions with lower total cost of ownership (TCO) greater design flexibility and faster time-to-market for clients. The core NVLink technology enables both horizontal and vertical interconnects supporting scalable AI performance across domains"
X Link 2025-05-23T03:31Z [---] followers, [--] engagements
"Beyond Computex: Qualcomms Expanding Role in AI Edge and Data Center Ecosystems https://open.substack.com/pub/tspasemiconductor/p/beyond-computex-qualcomms-expandingr=4hpdhj&utm_campaign=post&utm_medium=web&showWelcomeOnShare=false https://open.substack.com/pub/tspasemiconductor/p/beyond-computex-qualcomms-expandingr=4hpdhj&utm_campaign=post&utm_medium=web&showWelcomeOnShare=false"
X Link 2025-05-25T15:45Z [---] followers, [--] engagements
"TSMC Arizona Base: A Strategic Manufacturing Hub Amid the U.S.-China Tech War As of April [----] TSMCs wafer fabrication complex in Phoenix Arizona has emerged as a focal point of the global semiconductor industry. With a total investment of $165 billion this expansion represents one of the largest foreign direct investments in U.S. history symbolizing TSMCs strategic shift in response to geopolitics technological sovereignty and supply chain restructuring"
X Link 2025-05-26T04:30Z [---] followers, [---] engagements
"At Computex [----] Qualcomm showcased how its latest generation of products are enabling Edge AI applications while also revealing its strategic move into the data center markethighlighted by its vision to deliver CPU + AI: Building the Core of the Next-Gen Data Center Platform. This article will go beyond just reviewing Qualcomms Computex announcements. It will explore several broader questions surrounding Qualcomms roadmap and industry positioning"
X Link 2025-05-27T04:53Z [---] followers, [---] engagements
"We begin with an overview of Qualcomms AI development journey focusing on how its Hexagon NPU (Neural Processing Unit) has evolved to support high-performance low-power AI inference at the edge. Well then turn to Xiaomis latest breakthroughthe launch of its first in-house flagship chip Xring O1and examine the dynamics of Qualcomm and Xiaomis strategic co-opetition where both collaboration and competition coexist"
X Link 2025-05-28T01:43Z [---] followers, [---] engagements
"In addition well compare the current status of chip development across five major players: Qualcomm MediaTek Huawei Apple and Xiaomihighlighting their progress in process nodes chip portfolios and market focus. Finally well analyze Qualcomms forward-looking strategy for AI data centers and its motivation behind joining NVIDIAs NVLink Fusion initiative including the technological and ecosystem implications of this move"
X Link 2025-05-28T02:45Z [---] followers, [---] engagements
"SemiVision believes that over the past decade both Qualcomm and Xiaomi have venturedsometimes boldly sometimes cautiouslyinto the path of chip self-design and platform integration. Now both companies stand once again at a pivotal turning point in their strategic evolution"
X Link 2025-05-28T03:13Z [---] followers, [---] engagements
"Qualcomm for instance made an early attempt to enter the data center market around [----] forming a dedicated server CPU design team and launching its ARM-based Centriq processor lineup aiming to challenge Intels dominance. However due to market immaturity internal resource shifts and strategic recalibrations the project was eventually sold in [----] to Chinese venture HXT (Huaxintong Semiconductor)"
X Link 2025-05-28T04:46Z [---] followers, [---] engagements
"This episode reminds us that Qualcomm never truly abandoned its data center ambitionsit was merely waiting for the right conditions to re-emerge. Now with official access to NVIDIAs NVLink Fusion technology Qualcomm is rebuilding its platform capabilities integrating CPUs and AI accelerators to re-enter the AI-centric data center market with renewed force and vision"
X Link 2025-05-28T15:41Z [---] followers, [---] engagements
"Today MediaTek celebrates [--] years of innovation and growth. 🎉 For [--] years we've been powering over [--] billion devices annually and making technology accessible to all. This year's anniversary theme "Our Continuous Journey Together" honors the efforts of every MediaTeker and the milestones we've achieved as a team. The journey continues with sustainability at the core. Through initiatives like our Global Go Green in Action campaigns we're turning everyday actions into powerful change"
X Link 2025-05-28T15:43Z [---] followers, [---] engagements
"MediaTek (MTK) founded in [----] began as a provider of optical disk drive controller chips. It later gained prominence through its wireless connectivity solutions and mobile system-on-chip (SoC) products. As the smartphone market matured MediaTek actively sought to diversify into new verticalssuch as automotive electronics the Internet of Things (IoT) and edge AIin an effort to reposition itself for the AI era. The following sections outline five key dimensions through which MediaTek has evolved from its original Wi-Fi and mobile SoC-centered business model into a company strategically aligned"
X Link 2025-05-28T16:14Z [---] followers, [---] engagements
"Meanwhile Xiaomi is undergoing a profound transformationfrom a consumer electronics assembler to a hardcore tech company. Originally known for its MIUI operating system and fan-driven community ecosystem Xiaomi began with software gradually mastering hardware integration. Today with its smartphone leadership software maturity and robust IoT ecosystem in place CEO Lei Jun is steering the company toward the foundational capabilities of custom chip design and system-level architecture"
X Link 2025-05-29T02:41Z [---] followers, [---] engagements
"🟩To gain a competitive edge against #NVIDIA #AMD has announced the acquisition of Enosemi a startup specializing in silicon photonics and the development of photonic integrated circuits (PICs) further strengthening its capabilities in co-packaged optics (CPO). AMD stated that the acquisition reinforces its position as a comprehensive AI solutions provider integrating its leading CPUs GPUs and programmable SoCs while also enhancing its expertise in networking software and system integration. Silicon photonics is regarded as a critical next step in computing technology and over the past year"
X Link 2025-05-29T14:20Z [---] followers, [---] engagements
"In its early years #MediaTek s core business revolved around wireless connectivity chipssuch as Wi-Fiand mobile application processors. The company significantly strengthened its position in wireless technology through strategic moves like the acquisition of Ralink in [----]. In recent years it even secured Wi-Fi chip orders for #Apple TV underscoring its competitiveness in the connectivity space"
X Link 2025-05-29T16:46Z [---] followers, [---] engagements
"On the mobile front MediaTeks Helio and #Dimensity #SoC series provided cost-effective and high-performance solutions for a wide range of smartphones earning the company a reputation as the King of Chinas Shanzhai phones during the early smartphone boom. However as growth in the mobile device market began to plateau MediaTek began redirecting its R&D efforts toward emerging sectors to sustain long-term momentum"
X Link 2025-05-30T01:49Z [---] followers, [---] engagements
"IoT and Edge #AI: Building an Intelligent Connected Ecosystem As the Internet of Things (IoT) and smart devices gained traction MediaTek committed itself to developing AIoT platforms that integrate artificial intelligence into connected environments. In [----] the company launched its NeuroPilot AI platform which incorporates a dedicated AI Processing Unit (APU) and a complete software development kit within its smartphone SoCs. This platform was designed to enable on-device AI processing across a wide range of endpointsincluding #smartphones smart homes and even #autonomous vehicles"
X Link 2025-05-30T02:05Z [---] followers, [---] engagements
"SemiVisions Recommendation As a long-term observer of semiconductor packaging photonic-electronic integration AI compute architectures and next-generation interconnect technologies SemiVision strongly recommends all readers researchers and industry professionals who are passionate about technology innovation to actively participate in the [----] ECTC"
X Link 2025-06-01T02:50Z [---] followers, [---] engagements
"Welcome to join the [----] Advanced Packaging and Integration Technology Forum a premier gathering where the frontiers of semiconductor packaging photonics integration heterogeneous computing reliability engineering and thermal-mechanical design converge"
X Link 2025-06-01T03:13Z [---] followers, [---] engagements
"ASE Semiconductor has announced the launch of its fan-out chip-on-substrate bridge technology with through-silicon vias (TSV) known as FOCoS-Bridge to drive the advancement of artificial intelligence (AI) and accelerate its profound impact on global life. The ASE FOCoS-Bridge leverages TSVs to enable shorter signal paths achieving higher I/O density and improved thermal performance to meet the growing demand for bandwidth. The integration of TSV technology further enhances the capabilities of ASEs VIPack FOCoS-Bridge platform providing critical energy efficiency at a time when demand for AI"
X Link 2025-06-01T11:22Z [---] followers, [----] engagements
"We invite you to engage deeply with the thought leaders and innovators shaping the semiconductor industrys next decade where materials design process and system engineering unite to unlock performance scalability and sustainability in the era of data-centric computing"
X Link 2025-06-03T02:00Z [---] followers, [---] engagements
"#SemiVision : Attended the [----] UK Semiconductor and Optoelectronics Technology Conference & Matchmaking today Had the chance to connect with several innovative #UK startups and gain insights into the UKs strong momentum in #semiconductor and #optoelectronic technology development. Impressed by the cutting-edge solutions and the collaborative spirit driving UKTaiwan partnerships forward UK in Taiwan"
X Link 2025-06-04T11:22Z [---] followers, [---] engagements
"📊 #Semiconductor Fab Capacity Boom: The U.S. Leads the Charge According to SIA and BCG the U.S. is forecast to achieve the highest global growth in semiconductor fab capacity from [----] to [----] a staggering 203% increase. This marks a dramatic shift from the modest 11% growth seen from [----] to [----]. Notably China experienced explosive growth (365%) from [----] to [----] but is expected to normalize in the next decade. In contrast the U.S. is now accelerating backed by strategic policy moves like the CHIPS Act and reshoring incentives. ⛳The semiconductor race is no longer just about technology its"
X Link 2025-06-05T04:11Z [---] followers, [----] engagements
"Where Systems Meet Devices: #VLSI & #DRC [----] The Complete Semiconductor Experience https://open.substack.com/pub/tspasemiconductor/p/where-systems-meet-devices-vlsi-andr=4hpdhj&utm_campaign=post&utm_medium=web&showWelcomeOnShare=false https://open.substack.com/pub/tspasemiconductor/p/where-systems-meet-devices-vlsi-andr=4hpdhj&utm_campaign=post&utm_medium=web&showWelcomeOnShare=false"
X Link 2025-06-06T03:21Z [---] followers, [---] engagements
"What distinguishes #VLSI Symposium [----] is its unique blend of industry-driven content and collaborative learning. With world-class contributions from #IBM #AMD #TSMC SK hynix #NVIDIA #MediaTek #Samsung #Sony Lam Research #KIOXIA and many more the Symposium goes beyond technical exchangeit becomes a living garden of innovation where theory meets application and seeds of research mature into real-world impact"
X Link 2025-06-07T03:19Z [----] followers, [---] engagements
"#SemiVision: While copper interconnects have driven decades of progress in semiconductor scaling their limitations are becoming increasingly pronounced: at advanced nodes. To maintain chip performance and reliability in the face of these constraints the industry must continue to innovate in materials science and process integrationideally without overhauling the entire BEOL infrastructure. These efforts are critical to enabling logic scaling beyond the 2nm node preserving the trajectory of Moores Law. ✅ Next-Generation Low-k Material: ALK (Advanced low k material)"
X Link 2025-06-07T09:04Z [---] followers, [---] engagements
"✳ Acer Chairman and CEO Jason Chen Addresses Graduates at NYCU: Optimism Is a Competitive Advantage On the morning of June [--] Acer Chairman and CEO Jason Chen (Chen Jun-Sheng) was invited to deliver a commencement speech at National Yang Ming Chiao Tung University (NYCU). He shared that years ago TSMC founder Morris Chang wrote him a five-word piece of advice: Optimism is a competitive advantage. Chen passed on the same message to the graduates adding: When you face the sun the shadows fall behind you. But if you keep staring at the problems the shadows only grow longer. Keep facing the"
X Link 2025-06-07T13:00Z [----] followers, [---] engagements
"The emergence of Silicon Photonics is reshaping AI chip architectures. One of the most discussed topics is how to integrate Silicon Photonics into Optical I/O (OIO) systems particularly by embedding optical engines directly onto the interposer. We have already seen TSMC outline a roadmap in this direction mainly driven by considerations for NVIDIAs future needs"
X Link 2025-06-08T01:51Z [---] followers, [---] engagements
"📊 SEMIs latest data shows global semiconductor equipment billings rose 21% YoY in Q1 [----]. China leads by a wide margin followed by Korea Taiwan and North America. Meanwhile Europe still lags significantly behind. 🌍 The message is clear: the world doesnt wait. If the EU aims to hit its [----] chip market share goals investment in equipment must come first"
X Link 2025-06-08T10:58Z [---] followers, [---] engagements
"Intels development of silicon photonics represents over two decades of dedicated innovation and progress gradually paving the way for a new era of electro-optical convergence in high-performance computing and data centers. Since [----] Intel has been investing in silicon photonics research tackling the inherent challenge that silicon cannot emit light on its own. By leveraging heterogeneous integration technologies Intel successfully incorporated high-performance III-V materials (such as InP) into silicon chips enabling the creation of hybrid silicon lasers. In [----] the company demonstrated"
X Link 2025-06-08T20:18Z [---] followers, [---] engagements
"🌈SemiVision : At #ECTC [----] Sumitomo Electric presented a groundbreaking paper titled Flip-Chip Photonic-Electronic Integration Platform for Co-Packaged Optics using a #Glass Substrate with Vertically-Coupled Beam Expanding Lens. This work introduces an innovative #CPO (Co-Packaged Optics) integration platform that combines a glass substrate with 3D-printed Vertically-Coupled Beam Expanding Lenses (#VCBELs)offering a novel solution to the long-standing alignment and packaging challenges in photonic-electronic co-integration. 📙Read more: https://lnkd.in/g_2UfkHj https://lnkd.in/g_2UfkHj"
X Link 2025-06-10T01:27Z [---] followers, [---] engagements
"#Qualcomm Doubles Down on AI with $2.4B #Alphawave Semi Acquisition Key Point 1: Qualcomm is acquiring UK-based IP company Alphawave for $2.4 billion in cash aiming to strengthen its foothold in AI and data centers while reducing reliance on the smartphone market. Key Point 2: The deal includes a 96% premium signaling Qualcomms strong commitment to AI. Alphawaves board has unanimously recommended the offer with support from around half of its shareholders. Key Point 3: Despite recent operational challenges Alphawave has seen growing demand for its high-speed connectivity IP among North"
X Link 2025-06-11T02:01Z [---] followers, [---] engagements
"🌈SemiVision : Intel Corporation - Breakthrough Heterogeneous Integration: EMIB + Modular Optical I/O Chiplets #EMIB enables short-reach high-density electro-optical signaling by embedding silicon bridges into the package substrate. This architecture supports: Central XPU dies co-packaged with multiple edge-hanging Optical I/O (#OIO) dies in 2/4/6-die scalable configurations Precise coupling of optical fiber array units (#FAU) using V-groove alignment allowing flexible modular bandwidth provisioning 📙Read more:"
X Link 2025-06-11T05:51Z [----] followers, [---] engagements
"Kumamoto Rising: Taiwan-Japan Synergy in the Next #Semiconductor Frontier https://open.substack.com/pub/tspasemiconductor/p/kumamoto-rising-taiwan-japan-synergyr=4hpdhj&utm_campaign=post&utm_medium=web&showWelcomeOnShare=false https://open.substack.com/pub/tspasemiconductor/p/kumamoto-rising-taiwan-japan-synergyr=4hpdhj&utm_campaign=post&utm_medium=web&showWelcomeOnShare=false"
X Link 2025-06-11T13:53Z [---] followers, [---] engagements
"🌈 #SemiVision: Broadcoms Co-Packaged Optics (#CPO) platform leverages advanced silicon #photonics to meet the massive bandwidth and power efficiency demands of #AI infrastructure. Designed for scalability it delivers unmatched performance and cost-per-bit and is available across Broadcoms Ethernet switches and XPUs"
X Link 2025-06-12T03:47Z [---] followers, [---] engagements
"🔴 SemiVision: On June [--] TSMC and the The University of Tokyo announced the launch of the TSMC-UTokyo Lab a joint initiative to advance research education and talent development in cutting-edge semiconductor technologies. As TSMCs first collaborative laboratory with an overseas university the lab will draw upon the world-leading expertise experience and creativity of both institutions. Through this partnership the University of Tokyo will not only deepen its research capabilities but also provide a comprehensive infrastructure for advanced semiconductor design education and applied"
X Link 2025-06-12T05:28Z [---] followers, [---] engagements
"Nikon and Canon primarily focus on the mid- to low-end segments of the market. Although both are long-established players in the industry with early-mover advantages ASML eventually surpassed them by capitalizing on the opportunity presented by immersion lithography. When the industry faced the challenge of breaking through the limitations of the [---] nm wavelength both the scientific and industrial communities were seeking new solutions. It was through close collaboration with #TSMC that ASML first developed a [---] nm immersion lithography machinethree years ahead of Nikon. This breakthrough"
X Link 2025-06-13T04:00Z [---] followers, [---] engagements
"🟢NVLink vs. Avicena LightBundle: From High-Speed Electrical to the Future of #Optical Interconnects SemiVision : NVLink is #NVIDIA s proprietary high-speed electrical interconnect designed to meet the bandwidth and latency requirements of GPU-to-GPU communication. Since Pascal and through to Hopper #NVLink has evolved to enhance data sharing and cooperative computing among GPUs. #Avicena Tech s LightBundle by contrast is a parallel optical interconnect platform engineered specifically for chiplet-to-chiplet communication. It addresses fundamental bottlenecks including I/O stagnation high"
X Link 2025-06-15T03:49Z [---] followers, [---] engagements
"📚 #SemiVision: The #semiconductor industry today stands at the brink of a technological explosion from #AI chips and #photonic integration to advanced packaging and atomic-level processes every innovation is reshaping the competitive landscape of the global supply chain. This is an extremely highly integrated industry where no single company can independently cover the entire spectrum from materials design manufacturing and packaging to testing. Only through continuous learning and active participation in global technical dialogues can we find our place in an increasingly turbulent future."
X Link 2025-06-16T07:40Z [---] followers, [---] engagements
"Blog: "Addressing Stress In Heterogeneous 3D-IC Designs" By Shetha Nolke #Siemens The benefits of 3D #IC architectures are well-documented smaller footprints lower power and increased performance. However the move to heterogeneous #3D designs also introduces a host of new challenges that must be carefully navigated"
X Link 2025-06-17T12:52Z [---] followers, [----] engagements
"🌈#SemiVision team will be attending Laser World of #Photonics If you have a booth at the event feel free to drop a comment below or message us wed love to stop by and connect. 🔍If youre working on a unique or cutting-edge #technology were especially excited to hear your story and explore potential coverage or collaboration. Lets meet"
X Link 2025-06-17T14:51Z [---] followers, [---] engagements
"🏗Fiercer #HBM3E Competition: #Micron Technology Secures Major Orders from #AMD and #NVIDIA Emerging as a Key Rival to #SKhynix SemiVision : The battle for high-bandwidth memory (#HBM) in #AI servers has entered the HBM3E era and the competition is intensifying. The dominance once held solely by SK Hynix is now being challengednot by #Samsung but by Micron. Following its win with Nvidia Micron has now announced that its 12-high 36GB HBM3E has been selected for AMDs MI350 series. This marks a significant milestone in Microns HBM strategy and signals its emergence as a formidable player in the"
X Link 2025-06-18T00:18Z [---] followers, [---] engagements
"As generative #AI pushes the boundaries of data scale and model complexity next-generation system architectures must address unprecedented demands for bandwidth energy efficiency and interconnect scalability. Industry leaders like #NVIDIA are actively re-architecting AI superchip systems with the Feynman architecture serving as a prime example of this evolutiondesigned to support ultra-high-density low-power interconnects for XPU-to-XPU and Switch-to-XPU communication. In this context #TSMCs #COUPE (Compact Universal Photonic Engine) platform emerges as a foundational technology enabling"
X Link 2025-06-18T02:45Z [---] followers, [---] engagements
"#TSMC #Avicena: A Strategic Alliance Shaping the Future of #Optical Interconnects Beyond Display As generative #AI and high-performance computing (#HPC) drive exponential demand for bandwidth and energy efficiency in chip-to-chip communication traditional copper interconnects are approaching their physical limits. These legacy interconnects can no longer meet the growing needs for low latency high density and ultra-low power in next-generation system architectures"
X Link 2025-06-18T03:13Z [---] followers, [---] engagements
"Great to attend John Laus lecture on co-packaged optics and 3D heterogeneous integration. Learned a lot from his insights and deep industry experience 👏 #Photonics #3DIntegration #CoPackagedOptics #Semiconductor #SemiVision"
X Link 2025-06-18T04:11Z [---] followers, [---] engagements
"Taiwans Momentum in C2C Optical Interconnects: Industry and Academia Unite Taiwan is rapidly emerging as a critical hub in the evolution of chip-to-chip (#C2C) optical interconnects driven by dynamic collaborations between academia and industry: #Foxconn Research Institute () has partnered with National Taiwan University and King Abdullah University of Science and Technology (KAUST) to present breakthrough multi-wavelength# LED technology at #CLEO [----]. This achievement enabling high-speed visible-light chip-to-chip communication marks a significant advance toward commercial optical"
X Link 2025-06-18T16:13Z [---] followers, [---] engagements
"Leading academic groups including Prof. Ho-Chung Kuo (#) from National Yang Ming Chiao Tung University have published extensively on #GaN #LEDs and their integration with silicon photonicshighlighting Taiwans deep bench in fundamental and applied R&D"
X Link 2025-06-19T02:41Z [----] followers, [---] engagements
"In the rapidly evolving landscape of Taiwans semiconductor and optoelectronic industries Professor Jui-Hwa Hung stands as a pivotal figure. Currently serving as a Chair Professor at the Institute of Electronics National Yang Ming Chiao Tung University (#NYCU) Professor Hung has long dedicated her research to epitaxial thin-film transfer wide bandgap #semiconductor device engineering and micro-scale optoelectronic integration. Her contributions have helped lay the foundation for #Taiwans advancement in high-frequency high-temperature and high-efficiency device technologies"
X Link 2025-06-19T03:50Z [----] followers, [---] engagements
"🟢#SemiVision : Were attending the Taiwan Semiconductor Development Forum Amid Global Shifts today at National Yang Ming Chiao Tung University. Topics include AI innovation silicon photonics and compound semiconductors all key to the future of the industry. #Semiconductor #AI #Photonics #Taiwan #NYCU #IndustryForum"
X Link 2025-06-19T06:24Z [----] followers, [---] engagements
"🔹2000s: Pluggable Transceivers Optical modules were placed at the edge of the PCB requiring signals to travel over long copper traces between the switch ASIC and the optics. This resulted in high power consumption and significant latency making it increasingly unsustainable for next-generation data center demands"
X Link 2025-06-19T10:20Z [----] followers, [---] engagements
"🔹2020: Near-Package Optics (#NPO) NPO brought optical engines even closer to the switch ASIC often connecting them via an interposer. While this approach offered shorter signal paths and better performance it also introduced higher cost and increased integration complexity limiting large-scale adoption"
X Link 2025-06-19T10:21Z [----] followers, [--] engagements
"Innovation in Wide Bandgap #Semiconductor Research Amid the global transition from Si and GaN to ultra-wide bandgap materials like -GaO Professor Hung has been at the forefront of this movement in Taiwan. Her research team has achieved significant breakthroughs in integrating -GaO on silicon and sapphire substrates addressing key challenges in heteroepitaxy and high-voltage device architecture. Her work has been recognized with prestigious awards including the Ministry of Science and Technologys Outstanding Research Award"
X Link 2025-06-19T16:46Z [---] followers, [---] engagements
"Austin is quickly becoming a real-world AV sandbox where legacy automakers tech startups and AI pioneers converge to test the future of urban mobility. Current AV operators in Austin. https://t.co/xj8fuoujK7 Current AV operators in Austin. https://t.co/xj8fuoujK7"
X Link 2025-06-20T00:47Z [---] followers, [---] engagements
"Central to #ASEs next chapter of innovation is photonic integration. As #AI workloads data centers and high-performance computing demand ever-increasing bandwidth and lower latency the limitations of traditional electrical interconnects become apparent. ASE recognizes that photonics is not just a complementary technology but a critical enabler of next-generation HI systems. With investments in silicon photonics packaging optical engine co-packaging and wafer-level photonic assembly technologies ASE is laying the groundwork for an era where #lightnot just copperdrives performance"
X Link 2025-06-21T16:14Z [---] followers, [---] engagements
"#ASE a global leader in semiconductor packaging is actively steering the industry into a new era of heterogeneous integration (HI)a paradigm where logic memory RF and now photonics converge within advanced packaging ecosystems. In this transformation photonic integration is no longer a niche or experimental fieldit is becoming a foundational technology for achieving the ultra-high bandwidth low latency and energy efficiency required by next-generation #AI and #HPC workloads"
X Link 2025-06-22T03:54Z [---] followers, [---] engagements
"🔮SoftBanks Masayoshi Son proposes Project Crystal Land a $1 Trillion AI Robotics Hub in the U.S. SemiVision : SoftBank is reportedly planning an industrial mega-project in Arizona aiming to create an American version of Shenzhen. The initiative codenamed Project Crystal Land would focus on building AI-powered industrial robots and advanced tech infrastructure. Key highlights: 🔺Estimated cost: $1 trillion 🔺Location: Arizona 🔺Focus: AI robotics smart manufacturing 🔺Seeking partners: #TSMC #Samsung Semiconductor 🔺Engaged in early talks with Trump-aligned officials for tax incentives This"
X Link 2025-06-22T06:08Z [---] followers, [---] engagements
"Having chaired the #SEMICON Taiwan PKG & TEST Committee since [----] and co-chaired since [----] Dr. Hung has been instrumental in aligning ASEs roadmap with international packaging trends. His panel discussion reflects ASEs strategic commitment to not only keep pace with the industrys demandsbut to shape them through innovation and collaborative leadership"
X Link 2025-06-23T00:51Z [---] followers, [---] engagements
"✅Advanced #Semiconductor Packaging 2025-2035: Forecasts Technologies Applications Source: IDTechEx"
X Link 2025-06-23T06:23Z [---] followers, [---] engagements
"🟢JX Advanced Metals Corporation together with its subsidiary Toho Titanium Co. Ltd. has brought its newly installed capacity for next-generation #semiconductor CVD/ALD materials online and is now running at full scale"
X Link 2025-06-23T13:25Z [---] followers, [---] engagements
"🔴Counterpoint Research Teardown: Xiaomi 15S Pro and the XRING O1 SoC Recent analysis by Counterpoint Research reveals the impressive chip-level architecture behind the #Xiaomi 15S Pro powered by Xiaomis self-developed XRING O1 flagship SoC. Featuring a multi-rail power design and built on a 3rd-gen 3nm process the XRING O1 integrates a 10-core CPU (dual Cortex-X925 @ 3.9GHz) a 16-core Immortalis-G925 GPU and a 6-core NPUpacking [--] billion transistors and scoring over [--] million points on AnTuTu placing it firmly in the top performance tier. Key Hardware Highlights: Memory: #SKhynix LPDDR5T"
X Link 2025-06-25T06:14Z [---] followers, [---] engagements
"🌈Ultra-High-Speed Low-Power VCSEL Breakthrough from NCU Powering the AI Revolution SemiVision : As #AI technology rapidly advances achieving low power consumption in high-speed data transmission has become a critical challenge. Now a research team led by Prof. Hsu Tzu-Chieh at National Central University (#NCU) with support from Taiwans NSTC has developed a next-generation single-mode ultra-fast low-power #VCSEL light source By combining single-mode VCSELs with single-mode optical fiberswithout the need for complex signal processingthe team has overcome the performance bottlenecks of"
X Link 2025-06-25T09:52Z [---] followers, [---] engagements
"🚀Dell Technologies Accelerates AI Server Momentum Toward $15B Goal SemiVision : Dell Technologies is rapidly scaling its #AI server business from nearly $0 in 1H24 to a projected $15B+ in shipments by FY26E reflecting a YoY growth rate exceeding 50%. In Q2 alone #Dell secured $1.21B in new AI server orders bringing its cumulative bookings to $14.4B. The demand remains strong across AI infrastructure especially from Tier [--] CSPs enterprises and Neocloud providers. The AI server pipeline continues to expand in both size and diversity now estimated at 5x the booking volume with broad coverage"
X Link 2025-06-25T14:24Z [---] followers, [----] engagements
"📚 From Packaging to Platform: #ECTC and #IEDM Lead the Era of System-Level Integration #SemiVision: As the global electronics industry moves into a new wave driven by #AI and high-performance computing (#HPC) advanced packaging technologies are quietly becoming the foundational pillars that support the compute infrastructure of the future. From accelerating inference of large language models (#LLMs) to meeting the data centers growing demand for low-power high-speed transmission this transformation is no longer about isolated innovationit is a full-scalesystem-level integration race. 📙 Read"
X Link 2025-06-26T15:38Z [---] followers, [---] engagements
"🟧#SemiVision : At the [----] #IEEE #VLSI Symposium a pivotal panel presentation led by MediaTek clearly outlined the companys comprehensive strategy across four key axes: #AI #ASIC design intelligent edge automotive platforms and #CPO (co-packaged optics) interconnects. This presentation was more than just a roadmap of how a company expands beyond a single application domain to become a leader in custom AI chipsit also reflects the broader redefinition of East Asias IC design ecosystem within the global restructuring of AI computing infrastructure."
X Link 2025-06-28T07:49Z [---] followers, [---] engagements
"📊 SEMI 300mm Fab Outlook: Advanced Nodes Driving Capacity Growth According to #SEMI s latest 300mm Fab Outlook report (2Q [----] update) global semiconductor manufacturing capacity is set to maintain strong growth momentum through [----]. Monthly capacity for 7nm nodes is projected to grow from [------] wafers in [----] to [---] million wafers by [----] representing a 14% CAGRtwice the industry average. The chart shows a significant divergence in growth trajectories: 🔴 Advanced nodes (7nm) outpacing 🟢 Mature nodes (7nm) which grow modestly at 68% annually. As #AI #HPC and next-gen mobile applications"
X Link 2025-06-28T12:33Z [---] followers, [---] engagements
"#MediaTek is aggressively expanding into the automotive chip market and deepening its collaboration with #NVIDIA. Ephrem Chemaly General Manager and Vice President of MediaTeks Automotive Business Unit is optimistic about the potential of the automotive AI market predicting that cars will evolve from mere transportation tools into digital living rooms. Industry sources point out that the Dimensity Auto Cockpit platform is expected to enter mass production in [----]. The AI acoustic front-end technology developed by #Intelligo has already been integrated into MediaTeks smart cockpit platform"
X Link 2025-06-28T12:46Z [---] followers, [---] engagements
"📊 When Trumps signature looks exactly like the VIX chart Is it a coincidence or is market chaos just his vibe Volatility spikes signatures spike [----] might be in for a wild ride. Stay hedged 😅"
X Link 2025-06-28T12:55Z [---] followers, [---] engagements
"🌍 Global Power Demand is Shifting Fast Are We Ready According to the International Energy Agency (IEA) electricity demand worldwide is projected to surge by [----] with data centers and air conditioning driving a major portion of that growth. As this chart shows: 🟥 Data centers and 🟩 cooling systems will account for some of the fastest-growing segments of energy consumption.🟧 Electric vehicles 🟦 desalination and other emerging sectors are also rising fast. Traditional sectors like ⚫ heavy industry still dominate but the balance is clearly shifting. This underscores a key challenge: AI"
X Link 2025-06-29T05:20Z [---] followers, [---] engagements
"🟩SemiVision : As artificial intelligence (AI) and high-performance computing (HPC) advance at breakneck speed chip packaging is evolving toward unprecedented scale and complexity. Packaging modules have expanded rapidly from the 75mm class to over 120mm with layer counts exceeding [--]. This not only signifies greater computational density but also brings more severe manufacturing challenges and yield pressures. In this wave of packaging evolution the role of build-up substrates has become increasingly criticalespecially within 2.5D heterogeneous integration platforms like TSMC s CoWoS. As the"
X Link 2025-06-29T17:48Z [---] followers, [---] engagements
"From #CPO to #CIO Building on CPO #NVIDIA is advancing to a Co-Integrated Optics (CIO) architecture in which optical modules are co-packaged directly with the logic die via the interposeralso referred to as Optical I/O (OIO) in a 2.5D integration context. Using TSMCs COUPE platform and 3D-stacked EIC/PIC integration this architecture delivers over [--] Tbps/mm bandwidth density with scalability up to [--] Tbps/mm in future iterations. https://open.substack.com/pub/tspasemiconductor/p/nvidia-integrating-photonic-in-hpcr=4hpdhj&utm_medium=ios"
X Link 2025-06-30T04:36Z [---] followers, [---] engagements
"In an interview aired on June [--] on Fox News Sunday Morning Futures former President #Trump stated that the 90-day grace period for reciprocal tariffs will expire on July [--] and for the vast majority of countries it will not be extended. Trump said that once the deadline is reached the tariff negotiations will conclude and the U.S. government will inform other nations of the trade penalties that will be imposedunless they have already reached an agreement with the United States"
X Link 2025-06-30T11:08Z [---] followers, [---] engagements
"As the wave of generative #AI sweeps across the globe the demand it brings is no longer just about stacking #GPUs in the cloud. Rather it signifies a structural reshaping of the computing architecturefrom a traditional "#SoC mindset" to one centered on "system integration and heterogeneous collaboration." Once known primarily for its focus on mobile communications and mid-tier SoCs MediaTek is now undergoing a platform-level transformation across chip design heterogeneous packaging photonic interconnects and edge AI in the era of #AI innovation"
X Link 2025-07-02T01:43Z [---] followers, [---] engagements
"Through a comprehensive RTL-in to GDSII-in design service flow #MediaTek has successfully transformed into an ASIC company equipped with four key integrated capabilities: high-efficiency design flexible process support diverse packaging and high-speed interconnects"
X Link 2025-07-02T04:46Z [---] followers, [---] engagements
"Japans government-backed chip foundry Rapidus is pushing ahead with its ambitious goal to mass-produce 2nm chips by [----]. To fund this next phase Rapidus has reportedly asked Fujifilm a key player in semiconductor materials to invest in the company. According to Kyodo News #Rapidus is calling on semiconductor-related firms including #Fujifilm to become shareholders aiming to build an industry-wide support system for mass production. The company is also expected to brief its partners on the 2nm pilot production progress on July 18"
X Link 2025-07-02T09:48Z [---] followers, [---] engagements
"During its presentation at #VLSI [----] MediaTek revealedfor the first timeits full-scale strategy for custom AI chip development. By leveraging its in-house development of advanced #SerDes (112G / 224G) #SoC design optimized for STCO/DTCO leading-edge process technologies (such as 3nm and #TSMC N2) and advanced packaging approaches (like CPO and CPC) MediaTek is enhancing its #PPA (Performance Power Area) advantages. These capabilities not only serve its mobile platform customers but also directly support hyperscalers in developing next-generation #AI superchips"
X Link 2025-07-02T16:13Z [----] followers, [---] engagements
"📢 #Siemens Resumes Software Supply to China After U.S. Lifts Export Restrictions Siemens AG announced that it has received official notification from the U.S. government lifting export controls on semiconductor design software to mainland China. In a press release Siemens confirmed that it has resumed full software and technology deliveries to its Chinese clients. This follows a temporary restriction earlier this year when the U.S. Commerce Departments Bureau of Industry and Security (#BIS) instructed major #EDA vendors in May to halt shipments to Chinese customers. #Semiconductor #ChipAct"
X Link 2025-07-03T02:26Z [----] followers, [---] engagements
"MediaTek stated that its #AI ASIC designs have already secured multiple design wins with plans to contribute substantial revenue starting in [----] targeting over USD $1 billion in annual revenue. Some of these customers are rumored to include U.S. tech giants such as Google (potentially related to TPU projects) while others are believed to be connected to #NVIDIAs #NVLink integration effortsa clear indication that #MediaTek is carving out a new strategic position in the cloud AI domain"
X Link 2025-07-03T02:41Z [---] followers, [---] engagements
"Industry observers note that TSMCs strategic exit reflects intense pricing pressure from Chinese competitors in the compound semiconductor space. Despite customer demand TSMC chose not to engage in price wars especially given the relatively small scale and limited profitability of GaN production"
X Link 2025-07-03T03:16Z [---] followers, [---] engagements
"Co-Developing the Future of AI Infrastructure Modules with #NVIDIA Notably #MediaTeks collaboration with NVIDIA has expanded from in-vehicle cockpit platforms to data center modules. Together the two companies have co-developed the #GB10 #AI module featuring over [----] TOPS of AI computing power. Designed to support training for large language models with up to [---] billion parameters the GB10 serves as a prototype foundation for personal-scale AI supercomputers. The launch of this module marks a significant shift in MediaTeks rolefrom a terminal SoC supplier to a comprehensive AI solutions"
X Link 2025-07-03T03:50Z [---] followers, [---] engagements
"The GB10 integrates a MediaTek-led xPU #AI processor utilizing multi-die modular packaging and supports MCP (Memory-Compute Proximity) as well as A2A (Agent-to-Agent) architectures. This enables the module to handle not only AI inference but also lightweight training and multi-agent collaborative computing positioning it as a critical compute node in the emerging Smart Edge ecosystem"
X Link 2025-07-03T15:52Z [---] followers, [---] engagements
"According to public information #MediaTek is also working with NVIDIA to advance the NVLink Fusion architecture. Fusion represents a GPU-centric chip design philosophy allowing third-party #ASICs or SoCs to connect to #NVIDIA GPUs and CPUs via standardized high-speed interfaces. As one of the initial partners in NVLink Fusion MediaTek is not merely an IP integrator but also a co-architect of cross-die computing frameworks. This strategic alliance lays the groundwork for MediaTek to further participate in next-generation projectssuch as #LLM training clusters and potential #AI H100 successors"
X Link 2025-07-03T16:46Z [---] followers, [---] engagements
"Strategic Deployment of #Edge Intelligence and #AI Agents Another key focus area for #MediaTek is the widespread adoption of edge AI platforms using its mobile device expertise as a bridge. Between [----] and [----] MediaTek plans to roll out a new generation of SoCs across Chromebooks IoT devices smart tablets TVs and wearables. These SoCs are built on advanced 3nm process technology and feature NPUs capable of delivering over [--] TOPS. They support multimodal tasks such as voice assistants image generation and behavioral reasoning while enabling low-power consumption localized learning and"
X Link 2025-07-04T01:49Z [---] followers, [---] engagements
"🤝 HPE Completes Acquisition of Juniper Networks Hewlett Packard Enterprise has officially acquired Juniper Networks a leading AI-native networking solutions provider. This strategic move positions HPE to capitalize on the fast-growing AI and hybrid cloud markets by delivering a cloud-native AI-driven IT portfolio including a fully modernized networking stack. #HPE #JuniperNetworks #AINetworking #HybridCloud #AI #NetworkSolutions"
X Link 2025-07-04T05:32Z [----] followers, [---] engagements
"Super Mario Bros teaches us an important psychological truth: Even if two things are physically identical they can feel completely different depending on context"
X Link 2025-07-04T05:59Z [---] followers, [---] engagements
"🤩 Excited to see #RANOVUS Inc. featuring our SemiVision silicon photonics supply chain image in their presentation slide at the [----] OCP Canada Tech Day Its an honor for us Connecting the semiconductor supply chain has been the mission of SemiVision since day one and we aim to serve as a bridge linking Taiwan to the global community. #SemiVision #OCP #TechDay #Semiconductor #SiliconPhotonics #Taiwan"
X Link 2025-07-04T15:50Z [---] followers, [---] engagements
"From Process-Driven to System-Driven: The Path Forward for CMOS Technology in the ngstrm Era As CMOS technology enters the #ngstrm era the traditional advantages of dimensional scaling are rapidly diminishing. In his keynote at #VLSI [----] Samsungs Vice President Keunhwi Cho presented a clear trajectory: the future of #CMOS will not be defined solely by smaller nodes but by multi-level system-driven innovations across materials architecture packaging and integration"
X Link 2025-07-05T01:53Z [---] followers, [---] engagements
"Backside Power Delivery (#BSPDN): Overcoming Power Integrity Bottlenecks With increasing power densities and the rise of 3D stacked architectures conventional front-side power delivery networks (FSPDN) face serious limitations in IR drop and signal interference. Backside Power Delivery offers a transformative solution. By routing power through backside vias (#TSVs BCs or VBPR structures) BSPDN minimizes resistance and inductance improves power efficiency and decouples power and signal paths. Companies like TSMC and Samsung are co-optimizing BSPDN alongside #GAA to enhance voltage stability in"
X Link 2025-07-05T02:14Z [---] followers, [---] engagements
"2. Heterogeneous Integration: Toward Modular Functionally Specialized Systems #Heterogeneous integration is becoming the cornerstone of post-Moore innovation. Instead of a monolithic SoC system architects are embracing #chiplets logic-memory fusion and sensor integrationeach fabricated on the most suitable node. Samsungs roadmap includes #GAA-based logic co-packaged with MRAM image sensors and HBM through 2.5D and 3D #packaging enabling modular SoC platforms with high bandwidth low latency and domain-specific performance tuning"
X Link 2025-07-05T03:19Z [---] followers, [---] engagements
"🔋No other industry would be allowed this kind of behavior. Hitachi Energy Energy CEO Andreas Schierenbeck warns that AIs explosive power consumption must be regulated. In an interview with the Financial Times he cautions that the sudden electricity spikes from AI model training combined with volatile renewable supply are making it harder than ever to keep the lights on. As AI scales grid stability may become a national priority. #AI #EnergyCrisis #DataCenters #HitachiEnergy #PowerInfrastructure #NVIDIA"
X Link 2025-07-05T05:36Z [---] followers, [---] engagements
"Beyond ScalingThe Era of System-Level Co-Optimization The ngstrm era demands more than transistor miniaturization. From backside power delivery and heterogeneous #chiplet design to #3D stacking and photonic interconnects the future of CMOS will be defined by system-level co-optimization. As Cho noted the real breakthroughs will come not from narrower gate lengths alone but from cross-domain collaborationspanning devices interconnects packaging and architecture. This is how #CMOS will continue to evolve beyond #Moores Law."
X Link 2025-07-06T01:51Z [---] followers, [---] engagements
"Big typhoon is coming"
X Link 2025-07-06T10:48Z [---] followers, [---] engagements
"Chinas aircraft carrier Shandong docked in Hong Kong"
X Link 2025-07-07T02:33Z [---] followers, [---] engagements
"🚀 NVIDIA & Microsoft Are Marching Toward a $4 Trillion Valuation Fueled by the AI revolution NVIDIA and Microsoft are now approaching the $4 trillion market cap milestone currently valued at $3.89T and $3.71T respectively. While both tech giants are driving the AI boom their investment focus differs: 🟢#NVIDIA dominates in core #AI infrastructure and hardware. 🔴Microsoft leads in application ecosystems and long-term platform integration. These two companies are not just riding the AI wave theyre selling the picks and shovels in the gold rush. To develop AI companies cant avoid NVIDIA s"
X Link 2025-07-07T11:51Z [----] followers, [---] engagements
"NVIDIA & TSMC Co-Lead the Silicon Photonics Frontier https://open.substack.com/pub/tspasemiconductor/p/nvidia-and-tsmc-co-lead-the-siliconr=4hpdhj&utm_campaign=post&utm_medium=web&showWelcomeOnShare=false https://open.substack.com/pub/tspasemiconductor/p/nvidia-and-tsmc-co-lead-the-siliconr=4hpdhj&utm_campaign=post&utm_medium=web&showWelcomeOnShare=false"
X Link 2025-07-07T15:49Z [---] followers, [---] engagements
"President #Trump has announced new #tariffs on multiple countries set to take effect on August [--] [----]. Both Japan and South Korea confirmed 25% tariffs 😬 Should #Taiwan be bracing for impact too The pressure is"
X Link 2025-07-07T18:46Z [---] followers, [---] engagements
"Japanese publicly listed SaaS company DATA SECTION announced that it has signed a procurement contract worth USD [---] million with its strategic partner in Taiwan Giga Computing Computing. Under the agreement Giga Computing will supply a total of [---] GPU servers equipped with #NVIDIA B200 chips. The goal is to build Japans most advanced and Asias largest SuperCluster in Osaka providing enterprise-grade AI computing services to companies across Japan and the Asia-Pacific region and positioning itself as the premier AI cloud service provider in Asia. #AI #GPU #CloudService"
X Link 2025-07-08T08:43Z [---] followers, [---] engagements
"Siemens new Innovator3D IC solution suite empowers IC designers to efficiently develop simulate and manage heterogeneous 2.5D/3D-IC designs. Additionally the new Calibre 3DStress software leverages advanced thermo-mechanical analysis to identify stress-induced electrical effects at the transistor level. When used together these solutions significantly reduce the design risks associated with next-generation 2.5D/3D ICs while enhancing design quality yield and reliability. #Semiconductor #EDA #IC #Thermal #AdvancedPackaging #Siemens"
X Link 2025-07-08T09:42Z [---] followers, [---] engagements
"Co-Packaged Optics (#CPO) is emerging as the next major breakthrough for interconnects within data centers and #AI supercomputers. CPO integrates optical engines directly with #ASICs (such as switches or #GPUs) eliminating multi-meter copper cable runs and significantly reducing signal loss and power consumption. https://open.substack.com/pub/tspasemiconductor/p/powering-the-next-data-race-how-800gr=4hpdhj&utm_medium=ios https://open.substack.com/pub/tspasemiconductor/p/powering-the-next-data-race-how-800gr=4hpdhj&utm_medium=ios"
X Link 2025-07-09T00:12Z [---] followers, [---] engagements
"@BlueJay87476298 Taiwan"
X Link 2025-07-09T01:40Z [---] followers, [---] engagements
"🕶Meta Invests in EssilorLuxottica to Strengthen AI Smart Glasses Collaboration According to Bloomberg (July 8) #Meta has acquired nearly a 3% stake in #EssilorLuxottica the worlds largest #eyewear manufacturer. This move deepens their strategic partnership in the AI-powered smart glasses space. The investment signals CEO Mark Zuckerbergs strong commitment to AI and highlights Metas ambition to build its own hardware ecosystemreducing reliance on competitors devices. From aggressive #AI hiring to strategic acquisitions Meta is moving fast and decisively in the AI race"
X Link 2025-07-09T01:50Z [---] followers, [---] engagements
"#Marvell Leads AI Chip Infrastructure Innovation: A Full-Stack Transformation from Custom XPU to Optical Interconnects With the explosive growth of generative #AI large language models (#LLMs) and bandwidth-intensive inference workloads global data centers are undergoing a profound transformation driven by fundamental technology shifts. From processor architecture and memory access to interconnect interfaces and advanced packaging the boundaries of traditional chip design are being redefined. In this context Marvell positions itself at the core of this revolution with a full-stack custom"
X Link 2025-07-09T16:13Z [---] followers, [---] engagements
"At the same time emerging players such as OpenAI and xAI (model-first) Tesla and Apple (application-first) and Sovereign #AI pioneers like Humain and Stargate are rapidly developing custom #ASICs and memory systems contributing to a diversified decentralized and co-optimized AI infrastructure ecosystem"
X Link 2025-07-10T03:50Z [---] followers, [---] engagements
"-System Architecture: Assists customers in defining data flow and parallel compute models for optimized SoC architectures. -Design IP: Offers high-performance SerDes SRAM memory controllers and interconnect IPs. -Silicon Services: Supports cutting-edge process nodes (e.g. 2nm [--] 16) with advanced logic design capabilities. -Advanced Packaging: Integrates fan-out 2.5D CoWoS and CPO to increase system density and efficiency. -Manufacturing Logistics: Bridges wafer-level manufacturing and system-level SMT assembly for streamlined supply chains"
X Link 2025-07-11T03:24Z [---] followers, [---] engagements
"Quantum Convergence: Bridging Academia and Industry between BC and Taiwan https://open.substack.com/pub/tspasemiconductor/p/quantum-convergence-bridging-academiar=4hpdhj&utm_campaign=post&utm_medium=web&showWelcomeOnShare=false https://open.substack.com/pub/tspasemiconductor/p/quantum-convergence-bridging-academiar=4hpdhj&utm_campaign=post&utm_medium=web&showWelcomeOnShare=false"
X Link 2025-07-11T15:15Z [---] followers, [---] engagements
"Unlocking Quantum Opportunities British Columbia Taiwan: A New Chapter for Quantum Innovation and Collaboration Event Date & Time: July [--] [----] (Vancouver time) July [--] [----] (Taipei time) https://docs.google.com/forms/d/1yLhQK2o5h6y0Ni0EJUJRnAqGKgIBn0RwtI8ehQDJIYo/viewformedit_requested=true https://docs.google.com/forms/d/1yLhQK2o5h6y0Ni0EJUJRnAqGKgIBn0RwtI8ehQDJIYo/viewformedit_requested=true"
X Link 2025-07-11T15:15Z [---] followers, [--] engagements
"🟠 LG Innotek Unveils Breakthrough Chip Packaging Technology LG Innotek recently introduced a new chip packaging innovation using copper post (CuP) technology replacing the traditional method of directly bonding chips to motherboards with solder balls alone. 🟧How it works: Tiny copper pillars are first formed on the substrate then topped with solder balls. 🟧Why it matters: Enables 20% tighter pitch between balls increasing packaging density Helps shrink overall motherboard size enhancing internal design flexibility Coppers high melting point ensures structural stability during high-temp"
X Link 2025-07-12T01:50Z [---] followers, [---] engagements
"As AI and high-performance computing (HPC) continue to advance rapidly chip architectures are shifting toward 3D stacking chiplet disaggregation and heterogeneous integration. The realization of these technologies heavily depends on continuous breakthroughs and scalable mass production of bonding technologies. In this field one company has long held a critical positionBE Semiconductor Industries N.V. (Besi) based in the Netherlands"
X Link 2025-07-12T03:19Z [---] followers, [---] engagements
"Besi: A Key Driver of the Transition from Planar to #3D Advanced Packaging Founded in [----] and headquartered in Duiven the Netherlands Besi operates manufacturing R&D and service facilities across Malaysia China Singapore and the U.S. The company specializes in designing and manufacturing high-precision assembly equipment for the back-end semiconductor process particularly targeting advanced logic chips memory sensors and photonic https://tspasemiconductor.substack.com/p/hybrid-bonding-at-scale-besis-vision https://tspasemiconductor.substack.com/p/hybrid-bonding-at-scale-besis-vision"
X Link 2025-07-12T04:56Z [---] followers, [---] engagements
"🌟 Truly wise people focus on just four things in life: [--] Find a way to make money while you sleep because time is limited and income shouldnt rely solely on effort. 2Double down on your strengths doing what youre naturally good at leads to long-term success. 3Surround yourself with great people your circle determines your altitude. 4Keep reading books are the fuel that keep your mind evolving and your perspective expanding. 💡 There are no shortcuts in life. Only by consistently making the right choices can you build a high-leverage path thats truly your own"
X Link 2025-07-13T02:56Z [---] followers, [---] engagements
"Financial Outlook and Strategic Significance At its [----] Investor Day Besi elevated hybrid bonding to a core business pillar raising long-term revenue targets to 1.51.9 billion with 4055% operating margins. Financial Times reported hybrid bonding revenues at 36M in [----] projected to surge to 476M by [----] potentially accounting for one-third of Besis total business. https://tspasemiconductor.substack.com/p/hybrid-bonding-at-scale-besis-vision https://tspasemiconductor.substack.com/p/hybrid-bonding-at-scale-besis-vision"
X Link 2025-07-13T03:54Z [----] followers, [---] engagements
"The #semiconductor industry is currently standing at a critical inflection point of transformation and restructuring. As #AI computing demand grows exponentially traditional Moores Law scaling can no longer singlehandedly sustain breakthroughs in system-level performance. In this context advanced packaging technologies are rapidly evolving from a backend process into the core enabler of system integration and architectural innovation"
X Link 2025-07-14T03:40Z [---] followers, [---] engagements
"Chinese media: Jensen Huang has arrived in Beijing and met with Lei Jun for a photo together. A media press conference is being held in Beijing. (Photo: Tencent Technology) #NVIDIA #MI"
X Link 2025-07-14T09:15Z [----] followers, [---] engagements
"Who will win in the future #NVIDIA #AMD #Google #Microsoft #AWS #inte"
X Link 2025-07-14T16:59Z [---] followers, [---] engagements
"As AI becomes a foundational infrastructure as computation extends beyond the cloud and as heterogeneous integration and photonic convergence become the new normal packaging technology is no longer just an engineering challengeits a strategic battleground. In the future the question wont just be Who can build the chip but rather Who can integrate everything together most effectively https://tspasemiconductor.substack.com/p/the-packaging-evolution-trilogy-hybrid https://tspasemiconductor.substack.com/p/the-packaging-evolution-trilogy-hybrid"
X Link 2025-07-15T03:55Z [---] followers, [---] engagements
"Unlocking Quantum OpportunitiesBritish Columbia #Taiwan: A New Chapter for #Quantum Innovation and Collaboration Event Date & Time July [--] [----] (Vancouver time) July [--] [----] (Taipei time) Online: The meeting link will be provided upon successful registration. https://docs.google.com/forms/d/1yLhQK2o5h6y0Ni0EJUJRnAqGKgIBn0RwtI8ehQDJIYo/viewformedit_requested=true https://docs.google.com/forms/d/1yLhQK2o5h6y0Ni0EJUJRnAqGKgIBn0RwtI8ehQDJIYo/viewformedit_requested=true"
X Link 2025-07-15T09:26Z [---] followers, [---] engagements
"Packaging as a System Platform Major foundries and IDMs are now positioning packaging as a system-level platform: #TSMC offers SoIC-X CoWoS-R and InFO-L for chiplet-based and memory-centric AI packaging. Intel is investing in EMIB Foveros Direct and glass substrates for ultra-large die integration and improved signal/power delivery. These platforms are designed to accommodate hybrid bonding optical interconnects and integrated power delivery networks effectively turning the package into a critical layer of the compute hierarchy"
X Link 2025-07-16T01:43Z [---] followers, [---] engagements
"#Fluxless TCB on the other hand replaces flux with plasma activation reducing atmosphere heating and surface cleaning while utilizing highly controlled temperature and pressure to achieve Cu-to-Cu or Sn-based bonding. This technique significantly reduces residual contamination improves bond cleanliness and yield and enhances signal integrity and thermal performancemaking it particularly well-suited for high-integration high-bandwidth and high-power packaging structures"
X Link 2025-07-16T04:46Z [---] followers, [---] engagements
"#Marvell has announced that its future flagship AI ASICs will adopt TSMCs sub-3nm processes potentially advancing to the 2nm node. For #TSMC this long-term agreement further secures high utilization of its advanced nodes and ensures stable demand for its CoWoS high-end packaging services. https://open.substack.com/pub/tspasemiconductor/p/from-custom-sram-to-optical-serdesr=4hpdhj https://open.substack.com/pub/tspasemiconductor/p/from-custom-sram-to-optical-serdesr=4hpdhj"
X Link 2025-07-17T03:52Z [---] followers, [---] engagements
"In the rapidly evolving field of advanced packaging Taiwans semiconductor supply chain is undergoing a strategic shift driven by explosive demand from AI and high-performance computing (HPC) applications. While TSMC remains the dominant provider of advanced packaging capacityparticularly for AI chips relying on CoWoSother Taiwanese players such as #UMC and #ASE (including #SPIL) are emerging as critical alternative sources especially for edge AI and customized applications that require diverse packaging approaches."
X Link 2025-07-17T05:49Z [---] followers, [---] engagements
"The global semiconductor industry is undergoing a profound transformationshifting from the relentless scaling of Moores Law to a new era driven by system-level innovation and advanced packaging integration. At the heart of this transition lies Heterogeneous Integration (#HI) a key enabling technology powering the next generation of applications in Artificial Intelligence (#AI) High-Performance Computing (#HPC) 5G/6G communications and energy-efficient edge devices. https://tspasemiconductor.substack.com/p/astraccelerating-r-and-d-in-heterogeneous"
X Link 2025-07-18T02:05Z [---] followers, [---] engagements
"Everyones talking about humanoid #robots and yes the market could be massive. #TSMC CEO C.C. Wei said its still too early to expect significant impact this year or even next because the technology is highly complex. But he also shared a clients bold prediction: 🚗 EVs are just the beginning humanoid robots could be [--] times the market size of EVs once they take off. A space worth watching closely"
X Link 2025-07-18T08:56Z [---] followers, [---] engagements
"🟨#Nikon unveils the DSP-100 Lithography System engineered for large square substrates up to [---] x [---] mm. This opens new possibilities for advanced packaging and panel-level integration. More info: #Semiconductor #AdvanedPackaging #FOPLP #CoPoS #Panel https://www.nikon.com/company/news/2025/0716_01.html https://www.nikon.com/company/news/2025/0716_01.html https://www.nikon.com/company/news/2025/0716_01.html https://www.nikon.com/company/news/2025/0716_01.html"
X Link 2025-07-18T11:03Z [----] followers, [---] engagements
"The cool design which makes it cool ❄ Liquid cooling isnt just a feature its an architecture-driven thermal design. In the G383-R80 LAP1 every elementfrom the placement of 4x AMD Instinct MI300A APUs to the dedicated cold plate loops and optimized component layoutis engineered to maximize cooling efficiency within a compact 3U chassis. #GIGABYTE #UpgradeYourLife #GIGACOMPUTING #serversolutions #DirectLiquidCooling #AMD #MI300A #ThermalDesign #GPUserver #DataCenterInnovation #AIInfrastructure #CoolDesign"
X Link 2025-07-18T14:13Z [----] followers, [---] engagements
"Why A*STAR and Heterogeneous Integration Deserve Attention ASTAR is Singapores lead government agency for research and innovation. Under its umbrella the Institute of Microelectronics (#IME) has long been a powerhouse in semiconductor process and packaging R&D. In recent years ASTAR has significantly strengthened its Heterogeneous Integration R&D Line establishing a vertically integrated platform that spans from individual components and packaging to complete system-level modules. According to recent public updates the platform includes the following core capabilities:"
X Link 2025-07-19T01:53Z [----] followers, [---] engagements
"❇ #NVIDIA CEO Jensen Huang praised DeepSeek and other Chinese contributions to global AI research during his meeting with Wang Jian founder of #AlibabaCloud and director of Zhejiang Lab in Beijing. He remarked that open-source generative AI models from China are actively helping the world advance. 📌What followed in their conversation was even more moving: #AI is perhaps the greatest equalizer in human history it costs almost nothing to use and cutting-edge capabilities are increasingly open-sourced or made available at minimal cost. Unlike social media and short videos that prey on human"
X Link 2025-07-19T02:44Z [----] followers, [---] engagements
"From Chip Definition to System Integration: #MediaTek at the Crossroads of Advanced Packaging In the era of AI-driven performance-per-watt optimization and heterogeneous integration the nature of chip design is shiftingfrom a singular focus on computational horsepower to a packaging-centric system-level co-design paradigm. https://tspasemiconductor.substack.com/p/decoding-node-strategy-mediateks https://tspasemiconductor.substack.com/p/decoding-node-strategy-mediateks"
X Link 2025-07-19T03:19Z [----] followers, [---] engagements
"#Intels Next Frontier: Redefining Chiplet Integration Through Advanced Packaging https://open.substack.com/pub/tspasemiconductor/p/intels-next-frontier-redefining-chipletr=4hpdhj&utm_campaign=post&utm_medium=web&showWelcomeOnShare=false https://open.substack.com/pub/tspasemiconductor/p/intels-next-frontier-redefining-chipletr=4hpdhj&utm_campaign=post&utm_medium=web&showWelcomeOnShare=false"
X Link 2025-07-19T14:07Z [----] followers, [---] engagements
"#Rapidus: The Locomotive of Japans Semiconductor Industry https://open.substack.com/pub/tspasemiconductor/p/rapidus-the-locomotive-of-japansr=4hpdhj&utm_campaign=post&utm_medium=web&showWelcomeOnShare=false https://open.substack.com/pub/tspasemiconductor/p/rapidus-the-locomotive-of-japansr=4hpdhj&utm_campaign=post&utm_medium=web&showWelcomeOnShare=false"
X Link 2025-07-19T14:14Z [----] followers, [---] engagements
"As a global leader in IC design #MediaTek has evolved from its consumer electronics SoC roots to expand into Edge AI #ASICs and automotive markets. In doing so it has increasingly recognized advanced packaging not merely as a manufacturing consideration but as a strategic capability. This evolution touches not only how chips are architected and IPs are integrated but how system-level synergy across performance thermal design and power consumption can be fully optimized. https://tspasemiconductor.substack.com/p/decoding-node-strategy-mediateks"
X Link 2025-07-19T16:14Z [----] followers, [---] engagements
"In the long run once applications mature TSMC Samsung and Intel will rely on EUV to fend off competitors. But for the entry and mid-tier nodes high-end DUVi remains key. China will keep buying DUV while local equipment makers gradually catch up assuming EUV sanctions stay"
X Link 2025-07-20T01:23Z [----] followers, [--] engagements
"Summary: DUV still captures the majority of applications High NA / Hyper NA EUV will take time to ramp ASML still has money visibility in the short term but future surprises await Lets see if ASML can pull off something truly groundbreaking"
X Link 2025-07-20T01:24Z [----] followers, [---] engagements
"#TSMCs SoW Renaissance: Defending the AI Frontier Where NVIDIA Sells Ecosystem Not Chips https://open.substack.com/pub/tspasemiconductor/p/tsmcs-sow-renaissance-defending-ther=4hpdhj&utm_campaign=post&utm_medium=web&showWelcomeOnShare=false https://open.substack.com/pub/tspasemiconductor/p/tsmcs-sow-renaissance-defending-ther=4hpdhj&utm_campaign=post&utm_medium=web&showWelcomeOnShare=false"
X Link 2025-07-21T02:01Z [----] followers, [---] engagements
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