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![tphuang Avatar](https://lunarcrush.com/gi/w:24/cr:twitter::43463961.png) tphuang [@tphuang](/creator/twitter/tphuang) on x 24.2K followers
Created: 2025-07-23 02:40:12 UTC

Report out of China that CXMT completed development of XX layer HBM3 sample in June.
Has passed domestic AI chipmaker certification & signed contract.
Its TSV process is achieving XX% yield, reaching >800GB/s in bandwidth. Is done using hybrid bonding.

Next step is XX layer HBM3E, but I think they need D1a process to do that. They are currently producing mostly DDR5 on D1z node.

Overall, a huge game changer in memory chip industry for CXMT to be involved.

No wonder Korean media have been reporting it so much recently.

![](https://pbs.twimg.com/media/GwgmhNIXUAAbKFX.jpg)

XXXXXX engagements

![Engagements Line Chart](https://lunarcrush.com/gi/w:600/p:tweet::1947849194988859627/c:line.svg)

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[Post Link](https://x.com/tphuang/status/1947849194988859627)