[GUEST ACCESS MODE: Data is scrambled or limited to provide examples. Make requests using your API key to unlock full data. Check https://lunarcrush.ai/auth for authentication information.]  Jukan [@Jukanlosreve](/creator/twitter/Jukanlosreve) on x 22.6K followers Created: 2025-07-20 23:41:26 UTC Report: China's DRAM and NAND Flash Production Nearly Doubles in One Year… Global Memory Market 'Stumbles' ChangXin Memory Technologies (CXMT) and Yangtze Memory Technologies Co. (YMTC), China's leading memory semiconductor companies, are bolstering their influence in the global memory semiconductor market by nearly doubling their production capacity in just over a year. Starting last year, Chinese-made memory began to establish its presence in the commoditized DRAM market, which had been dominated by Samsung Electronics and SK hynix, beginning with legacy DRAM. Driven by domestic market demand and government subsidies, Chinese memory is enhancing its competitiveness. Furthermore, by successively challenging advanced product lines such as High Bandwidth Memory (HBM) and 300-layer 3D NAND flash, they are narrowing the gap with Samsung Electronics and SK hynix. According to the latest report from market research firm Omdia, obtained by Chosun Biz on the 21st, China's CXMT's DRAM production capacity (based on wafer input) expanded by approximately XX% to XXXXXXX wafers in Q3 this year, compared to XXXXXXX wafers in the same period last year. On an annual basis, CXMT's DRAM wafer production is projected to increase from XXXX million in 2023 to around XXXX million this year. Just two or three years ago, CXMT's share in the global DRAM market was so negligible that it wasn't even captured in figures, but it has rapidly expanded its production lines and shipments in a short period. According to Omdia's shipment forecast for next year, CXMT's DRAM shipments are expected to approach those of Micron, the third-largest player in the industry. This is why forecasts suggest that the existing "big three" DRAM structure (Samsung Electronics, SK hynix, Micron) will be reorganized into a "big four" structure in the future. In NAND flash as well, YMTC's rapid production expansion is fueling an oversupply in the market. While major companies like Samsung Electronics, SK hynix, Kioxia, and Micron continue their production cuts due to declining NAND flash prices, YMTC has significantly increased production at its Wuhan Fab X since Q1 last year. YMTC's NAND production at its Wuhan Fab X reached XXXXXXX wafers in Q2 this year, based on wafers, more than double the XXXXXX wafers in the same period last year. YMTC's total NAND production also increased by XX% compared to the same period last year. Both companies are expanding their portfolios not only to commoditized and older memory products but also to advanced product lines. CXMT is showing faster-than-expected progress in the High Bandwidth Memory (HBM) market, which SK hynix currently leads. CXMT plans to complete the certification process for mass production of HBM3, a 4th-generation HBM product, by the end of this year. An official from the semiconductor equipment industry explained, "CXMT is aggressively expanding its factories in Beijing and Hefei, and is expected to invest in equipment for HBM packaging in the future. CXMT has set an internal goal to mass produce 5th-generation HBM (HBM3E), a cutting-edge product dominated by SK hynix and Micron, within two years." YMTC is also focusing on advancement by continuously increasing the number of layers in its 3D NAND flash. The higher the number of layers in NAND, the better its performance. Just like building taller apartments, a higher number of layers allows for storing and processing more data. Currently, the highest number of layers in mass-produced NAND is SK hynix's XXX layers, followed by Samsung Electronics' XXX layers, and YMTC's XXX layers. Although still lower than Samsung Electronics and SK hynix, YMTC is catching up to a comparable level. Market research firm TechInsights evaluated that YMTC achieved significant progress in NAND performance metrics, recording XXXXX gigabits (Gb)/mm² in chip size and capacity per square millimeter (㎟). Meanwhile, the NAND market has been in an oversupply throughout this year. Samsung Electronics is estimated to have suffered a loss in its NAND business in Q2 this year despite prolonged production cuts, and other memory companies are also facing worsening profitability due to continuous price declines. Previously, market research firm TrendForce lowered its annual NAND flash demand growth rate forecast for this year from XX% to 10-15%.  XXXXXX engagements  **Related Topics** [$0981hk](/topic/$0981hk) [dram](/topic/dram) [Post Link](https://x.com/Jukanlosreve/status/1947079433120321831)
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Jukan @Jukanlosreve on x 22.6K followers
Created: 2025-07-20 23:41:26 UTC
Report: China's DRAM and NAND Flash Production Nearly Doubles in One Year… Global Memory Market 'Stumbles'
ChangXin Memory Technologies (CXMT) and Yangtze Memory Technologies Co. (YMTC), China's leading memory semiconductor companies, are bolstering their influence in the global memory semiconductor market by nearly doubling their production capacity in just over a year.
Starting last year, Chinese-made memory began to establish its presence in the commoditized DRAM market, which had been dominated by Samsung Electronics and SK hynix, beginning with legacy DRAM. Driven by domestic market demand and government subsidies, Chinese memory is enhancing its competitiveness. Furthermore, by successively challenging advanced product lines such as High Bandwidth Memory (HBM) and 300-layer 3D NAND flash, they are narrowing the gap with Samsung Electronics and SK hynix.
According to the latest report from market research firm Omdia, obtained by Chosun Biz on the 21st, China's CXMT's DRAM production capacity (based on wafer input) expanded by approximately XX% to XXXXXXX wafers in Q3 this year, compared to XXXXXXX wafers in the same period last year. On an annual basis, CXMT's DRAM wafer production is projected to increase from XXXX million in 2023 to around XXXX million this year.
Just two or three years ago, CXMT's share in the global DRAM market was so negligible that it wasn't even captured in figures, but it has rapidly expanded its production lines and shipments in a short period. According to Omdia's shipment forecast for next year, CXMT's DRAM shipments are expected to approach those of Micron, the third-largest player in the industry. This is why forecasts suggest that the existing "big three" DRAM structure (Samsung Electronics, SK hynix, Micron) will be reorganized into a "big four" structure in the future.
In NAND flash as well, YMTC's rapid production expansion is fueling an oversupply in the market. While major companies like Samsung Electronics, SK hynix, Kioxia, and Micron continue their production cuts due to declining NAND flash prices, YMTC has significantly increased production at its Wuhan Fab X since Q1 last year. YMTC's NAND production at its Wuhan Fab X reached XXXXXXX wafers in Q2 this year, based on wafers, more than double the XXXXXX wafers in the same period last year. YMTC's total NAND production also increased by XX% compared to the same period last year.
Both companies are expanding their portfolios not only to commoditized and older memory products but also to advanced product lines. CXMT is showing faster-than-expected progress in the High Bandwidth Memory (HBM) market, which SK hynix currently leads. CXMT plans to complete the certification process for mass production of HBM3, a 4th-generation HBM product, by the end of this year.
An official from the semiconductor equipment industry explained, "CXMT is aggressively expanding its factories in Beijing and Hefei, and is expected to invest in equipment for HBM packaging in the future. CXMT has set an internal goal to mass produce 5th-generation HBM (HBM3E), a cutting-edge product dominated by SK hynix and Micron, within two years."
YMTC is also focusing on advancement by continuously increasing the number of layers in its 3D NAND flash. The higher the number of layers in NAND, the better its performance. Just like building taller apartments, a higher number of layers allows for storing and processing more data. Currently, the highest number of layers in mass-produced NAND is SK hynix's XXX layers, followed by Samsung Electronics' XXX layers, and YMTC's XXX layers. Although still lower than Samsung Electronics and SK hynix, YMTC is catching up to a comparable level. Market research firm TechInsights evaluated that YMTC achieved significant progress in NAND performance metrics, recording XXXXX gigabits (Gb)/mm² in chip size and capacity per square millimeter (㎟).
Meanwhile, the NAND market has been in an oversupply throughout this year. Samsung Electronics is estimated to have suffered a loss in its NAND business in Q2 this year despite prolonged production cuts, and other memory companies are also facing worsening profitability due to continuous price declines. Previously, market research firm TrendForce lowered its annual NAND flash demand growth rate forecast for this year from XX% to 10-15%.
XXXXXX engagements
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