[GUEST ACCESS MODE: Data is scrambled or limited to provide examples. Make requests using your API key to unlock full data. Check https://lunarcrush.ai/auth for authentication information.]  Jukan [@Jukanlosreve](/creator/twitter/Jukanlosreve) on x 22.7K followers Created: 2025-07-18 00:07:17 UTC Report: Applied Materials Bolsters Advanced Semiconductor Packaging Applied Materials, the world's largest semiconductor equipment company, is expanding its investment in advanced semiconductor packaging. Designating it as a new growth engine, the company has embarked on securing talent and developing new equipment solutions. This is interpreted as a strategic response to the increasing demand for advanced semiconductor packaging driven by the expansion of the Artificial Intelligence (AI) market. According to industry sources on the 17th, Applied Materials has internally decided to make advanced semiconductor packaging a future growth driver and is moving to significantly enhance its competitiveness. To this end, it is understood to have initiated comprehensive efforts, from recruitment to new equipment. For talent, aggressive recruitment is underway with no limitations on scale. Multiple industry insiders stated in unison, "Applied Materials is contacting the entire industry to secure high-level talent in advanced packaging. They are gathering so many people that it's as if they are 'sucking up' packaging personnel." In particular, it has been identified that the expansion of personnel is centered around the Advanced Packaging Technology (APT) team in Taiwan. Applied Materials' Taiwan APT team is currently the organization leading major equipment development and is collaborating with global material and component companies, including those in Korea. It is analyzed that R&D is being conducted with demand in mind, given Taiwan's strong semiconductor packaging ecosystem. Synergy is also expected with Applied Materials' Singapore Advanced Packaging R&D Center. The company also plans to expand its packaging equipment portfolio. Currently, it is developing various packaging equipment, starting with lithography machines for semiconductor substrates. Development of hybrid bonding equipment, expected to be used in next-generation High Bandwidth Memory (HBM), 400-layer (or more) NAND flash memory, and 3D DRAM, is also in full swing. For this, Applied Materials is cooperating with BE Semiconductor Industries (Besi), a Dutch packaging equipment company. Applied Materials, which became the largest shareholder of Besi by acquiring a stake this year, has established a full-fledged collaborative system between the two companies. Applied Materials' move comes as the advanced semiconductor packaging market is expected to grow rapidly with the proliferation of AI. The semiconductor industry is heavily investing in packaging technology to enhance performance by expanding bandwidth and increasing integration in advanced semiconductors like AI chips. This aims to overcome various challenges that could not be solved by existing front-end processes through packaging technology. Until now, Applied Materials has had an equipment portfolio primarily focused on front-end processes. It boasts virtually all front-end process technologies, excluding lithography, such as thin-film deposition, etching, circuit control, polishing, and metrology. By expanding its scope to advanced packaging (back-end processes), including substrate processes and wafer bonding, it is analyzed that the company intends to significantly expand its equipment portfolio. According to market research firm Global Information, the semiconductor packaging market is expected to grow from $XXXXX billion (approximately XXXXX trillion KRW) this year to over X% annual growth, surpassing $XXXXX billion (approximately XXXXX trillion KRW) by 2030. An industry insider familiar with the matter stated, "I understand that Applied Materials is considering additional equity investments or mergers and acquisitions (M&A) to strengthen advanced packaging. They are building diversified strategies to enhance packaging capabilities." $AMAT  XXXXX engagements  **Related Topics** [investment](/topic/investment) [worlds largest](/topic/worlds-largest) [the worlds](/topic/the-worlds) [$0981hk](/topic/$0981hk) [applied](/topic/applied) [$amat](/topic/$amat) [stocks technology](/topic/stocks-technology) [Post Link](https://x.com/Jukanlosreve/status/1945998773584605561)
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Jukan @Jukanlosreve on x 22.7K followers
Created: 2025-07-18 00:07:17 UTC
Report: Applied Materials Bolsters Advanced Semiconductor Packaging
Applied Materials, the world's largest semiconductor equipment company, is expanding its investment in advanced semiconductor packaging. Designating it as a new growth engine, the company has embarked on securing talent and developing new equipment solutions. This is interpreted as a strategic response to the increasing demand for advanced semiconductor packaging driven by the expansion of the Artificial Intelligence (AI) market.
According to industry sources on the 17th, Applied Materials has internally decided to make advanced semiconductor packaging a future growth driver and is moving to significantly enhance its competitiveness. To this end, it is understood to have initiated comprehensive efforts, from recruitment to new equipment.
For talent, aggressive recruitment is underway with no limitations on scale. Multiple industry insiders stated in unison, "Applied Materials is contacting the entire industry to secure high-level talent in advanced packaging. They are gathering so many people that it's as if they are 'sucking up' packaging personnel."
In particular, it has been identified that the expansion of personnel is centered around the Advanced Packaging Technology (APT) team in Taiwan. Applied Materials' Taiwan APT team is currently the organization leading major equipment development and is collaborating with global material and component companies, including those in Korea.
It is analyzed that R&D is being conducted with demand in mind, given Taiwan's strong semiconductor packaging ecosystem. Synergy is also expected with Applied Materials' Singapore Advanced Packaging R&D Center.
The company also plans to expand its packaging equipment portfolio. Currently, it is developing various packaging equipment, starting with lithography machines for semiconductor substrates. Development of hybrid bonding equipment, expected to be used in next-generation High Bandwidth Memory (HBM), 400-layer (or more) NAND flash memory, and 3D DRAM, is also in full swing. For this, Applied Materials is cooperating with BE Semiconductor Industries (Besi), a Dutch packaging equipment company. Applied Materials, which became the largest shareholder of Besi by acquiring a stake this year, has established a full-fledged collaborative system between the two companies.
Applied Materials' move comes as the advanced semiconductor packaging market is expected to grow rapidly with the proliferation of AI. The semiconductor industry is heavily investing in packaging technology to enhance performance by expanding bandwidth and increasing integration in advanced semiconductors like AI chips. This aims to overcome various challenges that could not be solved by existing front-end processes through packaging technology.
Until now, Applied Materials has had an equipment portfolio primarily focused on front-end processes. It boasts virtually all front-end process technologies, excluding lithography, such as thin-film deposition, etching, circuit control, polishing, and metrology. By expanding its scope to advanced packaging (back-end processes), including substrate processes and wafer bonding, it is analyzed that the company intends to significantly expand its equipment portfolio.
According to market research firm Global Information, the semiconductor packaging market is expected to grow from $XXXXX billion (approximately XXXXX trillion KRW) this year to over X% annual growth, surpassing $XXXXX billion (approximately XXXXX trillion KRW) by 2030. An industry insider familiar with the matter stated, "I understand that Applied Materials is considering additional equity investments or mergers and acquisitions (M&A) to strengthen advanced packaging. They are building diversified strategies to enhance packaging capabilities."
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