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![dnystedt Avatar](https://lunarcrush.com/gi/w:24/cr:twitter::45483286.png) Dan Nystedt [@dnystedt](/creator/twitter/dnystedt) on x 36.9K followers
Created: 2025-06-27 00:14:00 UTC

Microsoft and Meta have both turned to Taiwan contract chip designer Global Unichip (GUC) for work on their ASIC chips, including TSMC CoWoS-R advanced packaging, media report, citing unnamed supply chain sources, and adding GUC taped-out 2nm test chips at TSMC in Q3 last year and won verification on 3nm interconnect IP in Q1 this year. 1/3 $MSFT $META $TSM #semiconductors


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[Post Link](https://x.com/dnystedt/status/1938390321345274246)