[GUEST ACCESS MODE: Data is scrambled or limited to provide examples. Make requests using your API key to unlock full data. Check https://lunarcrush.ai/auth for authentication information.]  Jukan [@Jukanlosreve](/creator/twitter/Jukanlosreve) on x 22.8K followers Created: 2025-06-17 00:25:05 UTC There are quite a few surprising developments: X. Intel's Nova Lake CPUs and GPUs are expected to use TSMC’s 2nm process. X. AWS-related updates - Alchip’s (世芯) T3 chip was taped out in February and has already gone wafer-out as of May. - T4 is expected to be announced this summer, and Alchip is seen as a strong contender to win the project. - Collaborating with Arista Labs on I/O chiplets. Google TPU X. Ironwood (TPU v7p) is scheduled to enter mass production in the first half of 2025. - Broadcom has taped out a 3nm-based v7e, MediaTek is expected to tape out the 3nm v8p in August 2025, with mass production slated for the second half of next year. X. Meta - MTIA v3 (an ASIC version equipped with HBM) is expected to have initial shipment forecasts starting in July. - For MTIA v4, it has been confirmed that Meta plans to adopt larger packaging designs to support multiple computing dies. XXXXX engagements  **Related Topics** [$3661tw](/topic/$3661tw) [Post Link](https://x.com/Jukanlosreve/status/1934769230328848517)
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Jukan @Jukanlosreve on x 22.8K followers
Created: 2025-06-17 00:25:05 UTC
There are quite a few surprising developments:
X. Intel's Nova Lake CPUs and GPUs are expected to use TSMC’s 2nm process.
X. AWS-related updates
Alchip’s (世芯) T3 chip was taped out in February and has already gone wafer-out as of May.
T4 is expected to be announced this summer, and Alchip is seen as a strong contender to win the project.
Collaborating with Arista Labs on I/O chiplets. Google TPU
X. Ironwood (TPU v7p) is scheduled to enter mass production in the first half of 2025.
MediaTek is expected to tape out the 3nm v8p in August 2025, with mass production slated for the second half of next year.
X. Meta
MTIA v3 (an ASIC version equipped with HBM) is expected to have initial shipment forecasts starting in July.
For MTIA v4, it has been confirmed that Meta plans to adopt larger packaging designs to support multiple computing dies.
XXXXX engagements
Related Topics $3661tw
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