[GUEST ACCESS MODE: Data is scrambled or limited to provide examples. Make requests using your API key to unlock full data. Check https://lunarcrush.ai/auth for authentication information.]  Ray Wang [@rwang07](/creator/twitter/rwang07) on x 14.3K followers Created: 2025-05-25 13:42:37 UTC Goldman Sachs Takeaways from COMPUTEX, Hon Hai (Foxconn), and AI Servers. X. AI servers in various architecture. Hon Hai showcased AI servers in various architecture, across air / liquid-cooled, baseboard-based and rack-level, for example: GB300 NVL72 rack-level AI servers, HGX B300 baseboard-based AI servers, MGX 4U air cooling server, etc. covering clients’ needs across large / mid / small-scale entities. The MGX AI servers offers modular design with flexibility in memory / storage, and easier change on GPUs, attractive to small-scale companies. Apart from full systems, the company also exhibited AI server components including sockets, high speed connector / cables, power supply, thermal components etc, reflecting its vertical integration. Additionally, the company’s robotics solutions, including Semiconductor Hybrid Robot (for semiconductor manufacturing use cases) and Nurabot (for nursing use cases) were also exhibited during the event. X. AI servers in expansion. Management remains positive on AI servers ramp up and general servers recovery, driven by rising generative AI penetration, and new product cycle of general servers. The company covers various architecture of AI servers, and across comprehensive chipset platforms (e.g. GPU, ASIC). On cooling solutions, the company showcased baseboard of AI servers across air-cooled and liquid-cooled in Computex, and management maintains the strategy that it will not source all liquid cooling components in house, but also work with the supply chain. X. High speed cable / connectors. FIT (Honhai's subsidary) showcased cable / connectors for AI servers and networking equipment, for example: power distribution solutions, high-speed networking cables, high-speed connectors (e.g., PCIe Gen X connectors, socket, etc.). Management remains positive on high-speed connection and its leading market position. The company continuously advances Broadcom’s CPO (co-packaged optics), and FIT’s CPO components were in full-scale production in May: solderless LGA-to-LGA sockets and Remote Pluggable Laser Source (PLS) I/O cages, alongside specialized connector assemblies. XXXXX engagements  **Related Topics** [coins ai](/topic/coins-ai) [hon hai](/topic/hon-hai) [goldman sachs](/topic/goldman-sachs) [stocks financial services](/topic/stocks-financial-services) [Post Link](https://x.com/rwang07/status/1926635013426041038)
[GUEST ACCESS MODE: Data is scrambled or limited to provide examples. Make requests using your API key to unlock full data. Check https://lunarcrush.ai/auth for authentication information.]
Ray Wang @rwang07 on x 14.3K followers
Created: 2025-05-25 13:42:37 UTC
Goldman Sachs Takeaways from COMPUTEX, Hon Hai (Foxconn), and AI Servers.
X. AI servers in various architecture. Hon Hai showcased AI servers in various architecture, across air / liquid-cooled, baseboard-based and rack-level, for example: GB300 NVL72 rack-level AI servers, HGX B300 baseboard-based AI servers, MGX 4U air cooling server, etc. covering clients’ needs across large / mid / small-scale entities. The MGX AI servers offers modular design with flexibility in memory / storage, and easier change on GPUs, attractive to small-scale companies. Apart from full systems, the company also exhibited AI server components including sockets, high speed connector / cables, power supply, thermal components etc, reflecting its vertical integration. Additionally, the company’s robotics solutions, including Semiconductor Hybrid Robot (for semiconductor manufacturing use cases) and Nurabot (for nursing use cases) were also exhibited during the event.
X. AI servers in expansion. Management remains positive on AI servers ramp up and general servers recovery, driven by rising generative AI penetration, and new product cycle of general servers. The company covers various architecture of AI servers, and across comprehensive chipset platforms (e.g. GPU, ASIC). On cooling solutions, the company showcased baseboard of AI servers across air-cooled and liquid-cooled in Computex, and management maintains the strategy that it will not source all liquid cooling components in house, but also work with the supply chain.
X. High speed cable / connectors. FIT (Honhai's subsidary) showcased cable / connectors for AI servers and networking equipment, for example: power distribution solutions, high-speed networking cables, high-speed connectors (e.g., PCIe Gen X connectors, socket, etc.). Management remains positive on high-speed connection and its leading market position. The company continuously advances Broadcom’s CPO (co-packaged optics), and FIT’s CPO components were in full-scale production in May: solderless LGA-to-LGA sockets and Remote Pluggable Laser Source (PLS) I/O cages, alongside specialized connector assemblies.
XXXXX engagements
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