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![dnystedt Avatar](https://lunarcrush.com/gi/w:24/cr:twitter::45483286.png) Dan Nystedt [@dnystedt](/creator/twitter/dnystedt) on x 36.9K followers
Created: 2024-01-03 02:04:40 UTC

AMD is seeking more CoWoS-like advanced packaging for its AI chips, media report, saying rumors put Powertech Technology at the top of the list of potential partners with a deal already signed, but that ASE, Amkor could also win out. Powertech declined to comment. $AMD $ASX $AMKR


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[Post Link](https://x.com/dnystedt/status/1742366334607089687)