[GUEST ACCESS MODE: Data is scrambled or limited to provide examples. Make requests using your API key to unlock full data. Check https://lunarcrush.ai/auth for authentication information.] #  @securitiex SCX SCX posts on X about future, ai, bank, $8309t the most. They currently have XXX followers and XX posts still getting attention that total XX engagements in the last XX hours. ### Engagements: XX [#](/creator/twitter::245025642/interactions)  - X Months XX +300% - X Year XXX +80% ### Mentions: X [#](/creator/twitter::245025642/posts_active)  ### Followers: XXX [#](/creator/twitter::245025642/followers)  - X Months XXX +0.33% - X Year XXX no change ### CreatorRank: undefined [#](/creator/twitter::245025642/influencer_rank)  ### Social Influence **Social category influence** [automotive brands](/list/automotive-brands) [stocks](/list/stocks) [technology brands](/list/technology-brands) **Social topic influence** [future](/topic/future), [ai](/topic/ai), [bank](/topic/bank), [$8309t](/topic/$8309t), [$8316t](/topic/$8316t), [mitsubishi](/topic/mitsubishi), [nvda](/topic/nvda), [$8306t](/topic/$8306t), [$8058t](/topic/$8058t), [$8053t](/topic/$8053t) ### Top Social Posts Top posts by engagements in the last XX hours "CoWoS-S (Silicon bridge) Uses one large silicon interposer with through-silicon vias (TSVs) to connect the logic die to memory and the substrate. Think of it as a single finely carved bridge. Great for up to about X HBM stacks around the main chip" [X Link](https://x.com/securitiex/status/1998687560239899086) 2025-12-10T09:33Z XXX followers, XX engagements "CoWoS-S vs CoWoS-L at a glance Both lines stack a logic die several HBM memory chips and a base substrate but they use different bridges to route the trillions of signals between them" [X Link](https://x.com/securitiex/status/1998687414429044754) 2025-12-10T09:33Z XXX followers, XX engagements "CoWoS-L (Stitched bridges) Combines a base interposer with smaller Local Silicon Interconnect (LSI) chips that act like modular bridges. TSMC can stitch these pieces together to build much bigger packages. Extends beyond the 2500mm limit of CoWoS-S" [X Link](https://x.com/securitiex/status/1998687666468970698) 2025-12-10T09:34Z XXX followers, XX engagements "CoWoS-L (Stitched bridges): Ideal for future AI chips that need 6+ HBM stacks" [X Link](https://x.com/securitiex/status/1998687897348636861) 2025-12-10T09:35Z XXX followers, XX engagements "@grok: On Dec-10 Mitsubishi UFJ Bank Sumitomo Mitsui Bank & Mizuho Bank have signed a basic letter of intent or unveiled a plan to sign a final letter of agreement with Rapidus Corp. Please could you compare it with the letter of intent that dealed NVDA and OpenAI" [X Link](https://x.com/securitiex/status/1999094490209071213) 2025-12-11T12:30Z XXX followers, XX engagements
[GUEST ACCESS MODE: Data is scrambled or limited to provide examples. Make requests using your API key to unlock full data. Check https://lunarcrush.ai/auth for authentication information.]
@securitiex SCXSCX posts on X about future, ai, bank, $8309t the most. They currently have XXX followers and XX posts still getting attention that total XX engagements in the last XX hours.
Social category influence automotive brands stocks technology brands
Social topic influence future, ai, bank, $8309t, $8316t, mitsubishi, nvda, $8306t, $8058t, $8053t
Top posts by engagements in the last XX hours
"CoWoS-S (Silicon bridge) Uses one large silicon interposer with through-silicon vias (TSVs) to connect the logic die to memory and the substrate. Think of it as a single finely carved bridge. Great for up to about X HBM stacks around the main chip"
X Link 2025-12-10T09:33Z XXX followers, XX engagements
"CoWoS-S vs CoWoS-L at a glance Both lines stack a logic die several HBM memory chips and a base substrate but they use different bridges to route the trillions of signals between them"
X Link 2025-12-10T09:33Z XXX followers, XX engagements
"CoWoS-L (Stitched bridges) Combines a base interposer with smaller Local Silicon Interconnect (LSI) chips that act like modular bridges. TSMC can stitch these pieces together to build much bigger packages. Extends beyond the 2500mm limit of CoWoS-S"
X Link 2025-12-10T09:34Z XXX followers, XX engagements
"CoWoS-L (Stitched bridges): Ideal for future AI chips that need 6+ HBM stacks"
X Link 2025-12-10T09:35Z XXX followers, XX engagements
"@grok: On Dec-10 Mitsubishi UFJ Bank Sumitomo Mitsui Bank & Mizuho Bank have signed a basic letter of intent or unveiled a plan to sign a final letter of agreement with Rapidus Corp. Please could you compare it with the letter of intent that dealed NVDA and OpenAI"
X Link 2025-12-11T12:30Z XXX followers, XX engagements
/creator/x::securitiex