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@semivision_tw Avatar @semivision_tw SemiVision👁️👁️

SemiVision👁️👁️ posts on X about chips, integration, samsung, hybrid the most. They currently have XXXXX followers and XXX posts still getting attention that total XXX engagements in the last XX hours.

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Followers: XXXXX #

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Social Influence #

Social category influence technology brands XXX% countries XXX% stocks XXX% fashion brands XXX% finance XXX% travel destinations XXX% automotive brands XXX% celebrities XXX% luxury brands XXX% agencies XXX%

Social topic influence chips 1.2%, integration #442, samsung 0.9%, hybrid 0.9%, open ai 0.9%, taiwan #1002, asics #166, $7936t #166, marking #173, bump XXX%

Top accounts mentioned or mentioned by @richieriiicch @nvidia @nano0526 @semivisiontw @wolfyxbt @sydneysweeney @kawausosuki0513 @kwoneunbi @bluejay87476298 @whitehouse @nav09284172 @jaredwerba @semitaipei @drfrederickchen @schott_ag @fredvfalcone @kapioyang @treasureh8nter @shihcolin

Top assets mentioned Microsoft Corp. (MSFT) Arista Networks Inc (ANET)

Top Social Posts #

Top posts by engagements in the last XX hours

"AI at scale needs optical I/O. #AyarLabs and Alchip are partnering to bring co-packaged optics into nextgen AI and HPC platforms. By combining #Alchips ASIC and advanced packaging with Ayar Labs CPO solutions were enabling higher bandwidth lower latency and better power efficiency for hyperscalers"
X Link @semivision_tw 2025-09-08T06:30Z 2123 followers, 6381 engagements

"Semicon Taiwan last day #Lasertec #Heraeus #TDK #Mitsubishi"
X Link @semivision_tw 2025-09-12T05:50Z 2120 followers, 1599 engagements

"Broadcoms CPO (Co-Packaged Optics) Manufacturing Assembly Flow clearly illustrates the complexity and precision required to bring optical engines and ASICs together at the package level from known good die to rack-level integration. As the industry moves toward co-packaged architectures to break through bandwidth and power bottlenecks such end-to-end integration flows are becoming foundational for next-generation AI data centers. #CPO #CoPackagedOptics #Broadcom #OpticalInterconnect #AdvancedPackaging #AIInfrastructure #Semiconductor #Photonics #SystemIntegration #SemiVision"
X Link @semivision_tw 2025-10-16T15:23Z 2124 followers, XXX engagements

"At Computex 2025 (Taipei) #Fabric8Labs and #Wiwynn a leading Taiwanese server manufacturer jointly showcased ECAM cold plate applications for AI data centers at Taipei Nangang Exhibition Center. The demo combined Fabric8Labs advanced thermal structures with Wiwynns liquid-cooled rack solutions marking an important deployment signal for ECAM technology within Taiwans AI infrastructure ecosystem"
X Link @semivision_tw 2025-10-16T13:57Z 2125 followers, XXX engagements

"Today Applied Materials together with Arizona State University we marked the official opening of the Materials-to-Fab Center a shared world-class $XXX million research development and prototyping facility inside the universitys MacroTechnology Works at ASUs Research Park in Tempe"
X Link @semivision_tw 2025-10-10T05:51Z 2122 followers, XXX engagements

"On one hand equipment vendors must meet the stringent demands of top-tier foundries like TSMC Samsung and Intel for next-generation packaging. On the other they must adapt to geopolitical pressures government-driven semiconductor self-sufficiency policies and supply chain diversification trends. Striking a balance between technological breakthroughs and fragmented markets will determine whether advanced packaging equipment suppliers can maintain leadership on the global stage"
X Link @semivision_tw 2025-10-05T20:18Z 2120 followers, XXX engagements

"In front-end wafer manufacturing the sector is almost monopolized by five major playersASML Applied Materials Lam Research Tokyo Electron (TEL) and KLAon which foundries such as TSMC Samsung Intel and UMC are highly dependent. While U.S. and Dutch firms remain global leaders in lithography deposition and etching export controls and policies such as the CHIPS Act and the European Chips Act have compelled equipment suppliers to adjust their footprints establishing new production and service bases across North America Europe Japan and Southeast Asia to strengthen supply chain resilience."
X Link @semivision_tw 2025-10-06T00:51Z 2119 followers, 1131 engagements

"Custom ASIC design house #Alchip Technologies and optical I/O company #AyarLabs have unveiled a reference design platform for AI ASICs with multiple optical die-die I/O engines. Enabling scale-up network and extended memory this design would allow 200-250 Tb/s bidirectional bandwidth from a single SiP"
X Link @semivision_tw 2025-09-25T03:37Z 2125 followers, XXX engagements

"OCS in Technologies Sailing into the AI Supercomputing Era: Key Technologies and Industry Trends at OCP APAC 2025"
X Link @semivision_tw 2025-10-13T03:08Z 2117 followers, XXX engagements

"Zhen Ding Tech advancing ABF substrate technology From 2005 to 2026 ABF substrates have undergone dramatic scaling: -Body size expanded from 3131 mm to 120140+ mm (20 growth) -Layer count increased from X to 28+ (4 growth) -Bump count jumped from 1K to over 300K500K (300 growth)"
X Link @semivision_tw 2025-08-18T07:37Z 2122 followers, 1004 engagements

"Big moment at WESEMiBAY Shanghai Jiao Tong Universitys CHIPX team officially released the thin-film lithium niobate photonic chip PDK marking a key step forward for Chinas integrated photonics ecosystem"
X Link @semivision_tw 2025-10-15T03:53Z 2125 followers, XXX engagements

"Hybrid Bonding at Scale: BESIs Vision and Industry Evolution in 3D Integration"
X Link @semivision_tw 2025-10-09T01:50Z 2122 followers, XXX engagements

"We are seeing new innovative materials emerging across CoWoS HBM and silicon photonics. Therefore in the future the semiconductor industry will need to shift its mindset toward the integration of materials as a core consideration"
X Link @semivision_tw 2025-10-07T02:53Z 2120 followers, 2075 engagements

"Tray for co-packaged optics developed by #SENKO Advanced Components Inc. and #Marvell Technology being shown this week at ECOC 2025. From Custom SRAM to Optical SerDes: How Marvell Builds the Data Highways for AI Chips"
X Link @semivision_tw 2025-10-01T06:19Z 2121 followers, XXX engagements

"History repeats itself but this time the lead roles have changed. NVIDIA CEO Jensen Huang personally handed over the worlds first DGX Spark a desktop-scale AI supercomputer with petaflop performance to Elon Musk at SpaceXs Starbase. Nine years ago Huang delivered the very first DGX-1 to the newly founded OpenAI where Musk was one of the co-founders. Today Musk is leading xAI in open competition with OpenAI and Huang is once again playing the role of AI arms dealer personally delivering this powerful machine capable of running 200-billion-parameter models locally into Musks hands. From OpenAI"
X Link @semivision_tw 2025-10-14T05:56Z 2121 followers, 1047 engagements

"Future of AI Accelerators Ayar Labs and Alchip are teaming up to bring optics directly on-package for next-gen XPUs. Key highlights: X full-reticle AI accelerators X HBM stacks X Ayar Labs TeraPHY optical engines Integrated passive devices (IPD) for better signal integrity UCIe protocol converter chiplets for scale-up This collaboration blends high-bandwidth low-latency optical I/O with advanced packaging shaping the future of heterogeneous AI compute. #AI #Semiconductors #Optical #AdvancedPackaging"
X Link @semivision_tw 2025-09-30T04:55Z 2125 followers, 8170 engagements

"FUJITSUMONAKA-X (1.4 nm) The Worlds Most Advanced Processor Made in Japan for AI"
X Link @semivision_tw 2025-10-11T08:45Z 2120 followers, XXX engagements

"Key Challenges for Super Stacks: Wafer-to-Wafer vs. Chip-to-Wafer As the industry pushes toward 3D Super Stacks for next-generation AI and HPC systems both Wafer-to-Wafer (W2W) and Chip-to-Wafer (C2W) approaches present distinct trade-offs: 🔷W2W is more mature with finer pitch and higher throughput but it requires same-size dies involves random pairing and faces cumulative yield risks (every die in the stack must work). 🔷C2W is less mature and currently coarser in pitch (though improving) but allows different die sizes intelligent die pairing and avoids cumulative yield issues through"
X Link @semivision_tw 2025-10-13T09:28Z 2119 followers, XXX engagements

"Flight to Shenzhen Semiconductor Industry Ecosystem Expo (SEMIBAY) 2025"
X Link @semivision_tw 2025-10-14T07:40Z 2121 followers, XXX engagements

"Powering the Next Generation of AI Chips Besi Applied Materials Besi Switzerland AG has announced its collaboration with Applied Materials on the newly introduced Kinex Bonding System the industrys first fully integrated die-to-wafer hybrid bonder. As AI and high-performance computing chips grow increasingly complex the demand for tighter integration higher accuracy and better process efficiency continues to rise"
X Link @semivision_tw 2025-10-09T01:51Z 2122 followers, XX engagements

"Sailing into the AI Supercomputing Era: Key Technologies and Industry Trends at OCP APAC 2025"
X Link @semivision_tw 2025-10-13T03:43Z 2117 followers, XXX engagements

"♥It was a pleasure to participate in the Optical Chip Design & Packaging Technology Forum at WESEMiBAY in Shenzhen (2025/10/15-17). A big thank you to the organizers for the kind invitation. I hope everyone enjoyed SemiVision s sharing session #Semiconductor #Packaging #Photonics #OpticalChips #SemiVision #WESEMiBAY #Shenzhen"
X Link @semivision_tw 2025-10-16T13:58Z 2125 followers, XXX engagements

"🟣At SEMICON Taiwan I spotted a showcase from LIST Technology (Zhen Ding Tech. Group) highlighting their high-layer FCBGA substrate for AI servers. XX layers ABF GL107 material XX XXX mm body size 11/11 m L/S Over 160K bump counts As AI accelerators push toward higher bandwidth and power delivery substrates like these become the true enablers. Advanced packaging isnt just about stacking chipsits about building the complex highways underneath that make AI scale possible. The race for high-layer count finer line/space substrates is intensifying and Taiwans ecosystem is clearly at the forefront."
X Link @semivision_tw 2025-09-11T05:55Z 2125 followers, 16.9K engagements

"#Advantest (Japan) is the worlds leading supplier of Automated Test Equipment (ATE) holding roughly XX% of the global market share in 2023 with the combined share of Advantest and the U.S. player Teradyne reaching around 80%. The company offers a comprehensive product portfolio that spans SoC mixed-signal and memory testers system-level test (SLT) platforms test handlers and interface solutions all integrated with edge computing and data analytics capabilities"
X Link @semivision_tw 2025-08-15T01:49Z 2106 followers, 1487 engagements

"Chinese smartphone makers keep pushing the boundaries of innovation Take this upcoming OPPO Find X9 series as an example it introduces a magnetic Hasselblad flash ring light capable of XXX consecutive flashes and 2200 Lux brightness at XXX m aiming to deliver studio-grade lighting in mobile photography. Its a great reminder that Chinas smartphone industry isnt just about specs its increasingly about original ideas and bold engineering"
X Link @semivision_tw 2025-10-13T03:54Z 2119 followers, XXX engagements

"On the logic process side TSMCs evolution from N3 N2 A16 involves more than geometric scalingit represents a transistor architecture transition: from FinFET to GAA (Gate-All-Around) and finally to the Super Power Rail architecture in the A16 generation. This series of changes is aimed at achieving the optimal balance of PPA (Power Performance and Area) laying the foundation for high-efficiency AI computing"
X Link @semivision_tw 2025-10-08T03:13Z 2123 followers, XXX engagements

"Money-Making Code: On October XX OpenAI CEO Sam Altman announced on social media platform X that the company will soon relax ChatGPTs safety restrictions allowing verified adult users to engage in erotic conversations with the chatbot and making the AIs responses more human-like and approachable"
X Link @semivision_tw 2025-10-15T03:45Z 2124 followers, XXX engagements

"On October X Sam Altman visited South Korea and signed agreements with Samsung and SK Hynix to supply memory chips for the Stargate project. The expected demand is 900000 wafers per month nearly double the current global monthly HBM capacity of 500000"
X Link @semivision_tw 2025-10-01T13:26Z 2120 followers, XXX engagements

"Entering the AI and high-performance computing (HPC) era demand for advanced packaging platformsincluding 2.5D/3D packaging Hybrid Bonding and CoWoSis surging reshaping the back-end equipment landscape. This paper analyzes the core elements of both WFE and back-end packaging supply chains while exploring how equipment vendors are responding to the challenges of geopolitics and globalization"
X Link @semivision_tw 2025-10-05T02:50Z 2122 followers, XXX engagements

"WESEMiBAY 2025 #Semiconductor"
X Link @semivision_tw 2025-10-15T03:06Z 2122 followers, XXX engagements

"#Broadcom is proud to be a part of a new Scale-Up Networking Collaboration to advance Ethernet for AI scale-up systems with industry leaders AMD Arm Arista Networks Cisco HPE Networking Marvell Technology Meta Microsoft NVIDIA OpenAI and Oracle. This open forum will drive technical collaboration interoperability and standards alignment"
X Link @semivision_tw 2025-10-14T05:43Z 2121 followers, XXX engagements

"🚗 #Foxconn EV Technology a key overseas EV venture under the Hon Hai Group plays a central role in the companys global electric vehicle strategy. In November 2021 Hon Hai signed a definitive asset purchase agreement with U.S.-based Lordstown Motors for the acquisition of its manufacturing plant in Lordstown Ohio. Foxconn #EV Technology served as the main investment entity behind this deal"
X Link @semivision_tw 2025-07-26T11:32Z 2120 followers, XXX engagements