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@securitiex Avatar @securitiex SCX

SCX posts on X about future, ai, bank, $8309t the most. They currently have XXX followers and X posts still getting attention that total XX engagements in the last XX hours.

Engagements: XX #

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Mentions: X #

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Followers: XXX #

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CreatorRank: undefined #

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Social Influence

Social category influence automotive brands XX% stocks XX% technology brands XX%

Social topic influence future 20%, ai 20%, bank 20%, $8309t 20%, $8316t 20%, mitsubishi 20%, nvda 20%, $8306t 20%, $8058t 20%, $8053t XX%

Top accounts mentioned or mentioned by @grok

Top Social Posts

Top posts by engagements in the last XX hours

"CoWoS-S (Silicon bridge) Uses one large silicon interposer with through-silicon vias (TSVs) to connect the logic die to memory and the substrate. Think of it as a single finely carved bridge. Great for up to about X HBM stacks around the main chip"
X Link 2025-12-10T09:33Z XXX followers, XX engagements

"CoWoS-S vs CoWoS-L at a glance Both lines stack a logic die several HBM memory chips and a base substrate but they use different bridges to route the trillions of signals between them"
X Link 2025-12-10T09:33Z XXX followers, XX engagements

"CoWoS-L (Stitched bridges) Combines a base interposer with smaller Local Silicon Interconnect (LSI) chips that act like modular bridges. TSMC can stitch these pieces together to build much bigger packages. Extends beyond the 2500mm limit of CoWoS-S"
X Link 2025-12-10T09:34Z XXX followers, XX engagements

"CoWoS-L (Stitched bridges): Ideal for future AI chips that need 6+ HBM stacks"
X Link 2025-12-10T09:35Z XXX followers, XX engagements

"@grok: On Dec-10 Mitsubishi UFJ Bank Sumitomo Mitsui Bank & Mizuho Bank have signed a basic letter of intent or unveiled a plan to sign a final letter of agreement with Rapidus Corp. Please could you compare it with the letter of intent that dealed NVDA and OpenAI"
X Link 2025-12-11T12:30Z XXX followers, XX engagements